Amphenol Printed Circuits Shows PCBs of All Sizes at IMS2026

Why It Matters

The showcase highlights APC’s ability to meet divergent market pressures—both ultra‑compact SWaP demands and the need for large, precision‑engineered radar and satellite boards—positioning the company as a key supplier for emerging high‑frequency systems.

Key Takeaways

• APC showcases PCBs ranging from tiny SMT to 40‑inch large‑format assemblies
• Materials support rugged RF/microwave, high‑speed digital, and space applications
• Large‑format boards meet tight amplitude and phase specs for radar
• Booth #16054 includes engineer Colby Hobart for live technical briefings
• Hobart joins workshop on minimizing loss, noise, and distortion in RF components

Pulse Analysis

The IEEE MTT‑S symposium is the premier gathering for microwave engineers, and APC’s presence underscores its commitment to the high‑frequency market. By displaying everything from miniature surface‑mount modules that shave weight and volume to a 40‑inch, phase‑matched board, APC illustrates how modern PCB manufacturers must cater to two opposite trends: aggressive SWaP reduction and the growing need for expansive, high‑precision platforms in radar and satellite systems. This duality reflects a broader industry shift where designers balance miniaturization with performance‑critical, large‑area interconnects.

Manufacturing large‑format RF/microwave PCBs presents unique challenges. Maintaining amplitude and phase consistency across dozens of channels requires advanced substrate materials with low dielectric loss and tight dimensional tolerances. APC’s use of flex, rigid, and rigid‑flex laminates enables tight stack‑up control while providing the mechanical robustness needed for harsh terrestrial, maritime, and space environments. Moreover, the company’s expertise in impedance control and signal integrity ensures that high‑speed digital signals coexist with sensitive RF paths, a critical factor as systems converge on heterogeneous architectures.

For end users, APC’s showcase signals a reliable supply chain for next‑generation platforms that demand both compactness and large‑scale precision. As defense and commercial satellite programs scale up antenna arrays and phased‑array radars, the demand for boards that can deliver exacting phase alignment over long distances will rise. APC’s participation in the workshop on loss, noise, and distortion further positions it as a thought leader, helping customers navigate design trade‑offs and accelerate time‑to‑market. In a competitive PCB landscape, this breadth of capability gives APC a strategic edge in winning high‑value contracts across aerospace, defense, and telecommunications.