Enkris Unveils High-Speed, Low-Power Micro-LED Optical Interconnect Product

Why It Matters

The breakthrough offers data‑center operators a high‑bandwidth, ultra‑low‑power interconnect that mitigates the power and heat challenges of faster SerDes, accelerating the shift to optical‑in, copper‑out architectures.

Key Takeaways

• Enkris launches 8‑inch/12‑inch GaN‑on‑Si micro‑LED interconnects
• Bandwidth reaches 1.6 GHz at 500 A/cm² current density
• Power consumption drops below 1 pJ per bit
• CMOS‑compatible process enables integration with advanced‑node chips
• Low heat and no EMI suit data‑center short‑range links

Pulse Analysis

Data centers are racing to meet AI‑driven workloads, pushing the limits of traditional copper interconnects. As server bandwidth demands climb, the industry is pivoting toward an "optical‑in, copper‑out" model that moves high‑speed signals onto light‑based links while retaining familiar copper outputs. Micro‑LEDs, originally a display technology, have emerged as a promising light source for these short‑distance connections because they combine high density with minimal power draw, addressing the thermal and energy constraints of next‑generation SerDes.

Enkris’s latest offering leverages its expertise in gallium‑nitride epitaxy to produce GaN‑on‑silicon micro‑LEDs on 8‑inch and 12‑inch wafers. By engineering the quantum wells to suppress the quantum‑confined Stark effect and reducing the active‑region footprint, the company achieved a 3 dB bandwidth of 1.6 GHz at a low current density of 500 A/cm², translating to sub‑picojoule per‑bit energy consumption. The CMOS‑compatible process flow means the LEDs can be bonded directly to advanced‑node chips using mature wafer‑to‑wafer or die‑to‑wafer techniques, eliminating the need for exotic packaging.

The commercial impact could be significant. With power per bit under 1 pJ and negligible heat generation, operators can densify rack designs without exacerbating cooling costs. Moreover, the absence of electromagnetic interference simplifies board layout and compliance testing. As major cloud providers seek to scale AI inference clusters, Enkris’s solution positions itself as a viable alternative to traditional electrical links, potentially reshaping short‑range interconnect standards and prompting faster adoption of optical‑in, copper‑out architectures across the data‑center ecosystem.