Samtec Expands Compact Power Interconnect Portfolio

Samtec Expands Compact Power Interconnect Portfolio

Power Electronics News
Power Electronics NewsMay 8, 2026

Why It Matters

The enhancement gives designers a more reliable, compact solution for high‑current distribution in demanding applications, accelerating adoption of miniaturized power architectures across critical sectors.

Key Takeaways

  • Samtec adds through‑hole terminations to mPOWER vertical and right‑angle connectors.
  • New options boost vibration and shock resistance for industrial, military, aerospace.
  • mPOWER delivers 18 A per blade with up to 40% space savings.
  • Stack heights span 5 mm‑20 mm, supporting 2‑10 power positions.
  • Cable assemblies offered in PVC or Teflon, various wire gauges.

Pulse Analysis

The power‑electronics market has been driven by a relentless push toward smaller form factors while still delivering high current densities. Engineers designing industrial control units, avionics, or defense platforms need connectors that can fit tight board spaces yet handle up to tens of amperes without overheating. Samtec’s mPOWER ultra‑micro power interconnect family has become a reference solution because it packs up to 18 A per blade into a footprint that is up to 40 percent smaller than traditional power connectors. This combination of density and performance aligns with the broader trend of miniaturization across the sector.

In its latest expansion, Samtec introduced through‑hole termination options for the vertical UMPS/UMPT series and the right‑angle UMPT‑RA variant. The through‑hole design adds mechanical strength, reducing the risk of connector pull‑out under vibration, shock, or repeated mating cycles—conditions common in military and aerospace applications. Designers now have stack‑height choices from 5 mm to 20 mm and can select between two and ten power positions, preserving the family’s 18 A per blade rating while improving reliability in harsh environments.

The added flexibility gives system architects a broader palette for high‑performance power distribution, especially where board‑to‑board or wire‑to‑board routing constraints dominate. With cable assemblies available in PVC or Teflon and a range of wire gauges, engineers can tailor electrical and thermal characteristics to specific mission requirements. Samtec’s extensive design resources—3‑D models, test data, and documentation—speed up validation, shortening time‑to‑market. As compact, high‑current systems proliferate in electric vehicles, renewable‑energy converters, and next‑gen defense platforms, the reinforced mPOWER portfolio positions Samtec as a key enabler of future power‑electronics architectures.

Samtec Expands Compact Power Interconnect Portfolio

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