Scalable Network-on-Chip Enables a Modular Chiplet Platform

Key Takeaways

• Menta's MOSAICS Hub uses Arteris FlexNoC as a known-good die.
• FlexNoC supports over 30 initiators and targets operating above 500 MHz.
• MOSAICS platform claims up to ten‑fold cost reduction versus monolithic SoCs.
• Time‑to‑market can improve four times thanks to modular chiplet integration.
• Scalable NoC lowers engineering complexity and enhances QoS for AI workloads.

Pulse Analysis

The semiconductor industry is rapidly shifting from monolithic system‑on‑chips to disaggregated chiplet ecosystems, driven by escalating performance demands and shrinking product cycles. Chiplet architectures promise flexibility, allowing designers to mix and match proven IP blocks, but they also introduce a critical bottleneck: efficient, low‑latency communication across disparate dies. Menta’s MOSAICS platform tackles this challenge head‑on by centering its design around a reusable hub that abstracts inter‑die traffic, enabling rapid composition of custom silicon without the traditional integration overhead.

At the heart of MOSAICS lies Arteris' FlexNoC, a silicon‑proven network‑on‑chip solution that can scale to more than 30 initiators and targets while sustaining clock speeds beyond 500 MHz. Its highly configurable topology, quality‑of‑service controls, and built‑in error‑correction features make it suitable for bandwidth‑intensive AI inference as well as latency‑sensitive control loops. Engineers benefit from a drag‑and‑drop configuration flow, slashing prototype turnaround times and reducing silicon area penalties. This technical agility translates directly into business value, as Menta reports up to a ten‑fold reduction in system cost and a fourfold acceleration in time‑to‑market compared with conventional SoC development.

For the broader market, MOSAICS exemplifies how strategic IP partnerships can de‑risk the chiplet transition and unlock new revenue streams. By offering a standardized, power‑efficient NoC backbone, Menta and Arteris lower the barrier for OEMs and fabless firms to adopt modular silicon, especially in high‑growth segments like edge AI, industrial automation, and data‑center accelerators. As the ecosystem matures, such scalable interconnects will become the de‑facto infrastructure, fostering faster innovation cycles and more sustainable product portfolios.