Server - HPC _ High Performance Computing - Sub-Project - (2026-06-09)

Why It Matters

Connector and substrate choices will determine whether the module achieves HBM-like density, cost targets and Gen7 signal compatibility; selecting a larger EDSF solution risks losing the density and thermal advantages that are central to the product’s competitive positioning.

Summary

Engineering stakeholders reviewed form-factor and high-speed interconnect tradeoffs for a proposed high-density HPC module aimed at HBM-like capacity at lower cost. The team favored an M.2-like substrate for its half-millimeter pitch, thin substrate profile and compact 4 mm overall module thickness, noting the design requires roughly 108 I/Os and 12 transceivers per module. Moving to EDSF/MCIO-style connectors would increase pitch, thickness and connector width (including 16-transceiver variants up to ~57 mm), complicating miniaturization and layout density. The group also discussed vertical vs. right-angle mating for Gen7 signaling and thermal/architectural implications for packing ~50 modules on a 120×120 mm reticle area.

Original Description

Public call recording of Server - HPC _ High Performance Computing sub-project.