Server - Mezz NIC - Sub-Project - (2026-01-07)

Why It Matters

Finalizing thermal designs and aligning Gen‑7 specs will determine compatibility, performance, and procurement decisions for data‑center servers, directly impacting vendor roadmaps and market adoption.

Key Takeaways

• Thermal workstream finalizes TSF spec, advances liquid‑cool neck design.
• Mechanical design expected to close in Q1 with prototype readiness.
• Vendor engagement pending; Nvidia positive, cage vendors yet to commit.
• Four‑factor workstream sunsetted, focusing on niche power/Z‑height needs.
• SI workstream aligns Gen‑7 spec to Chem‑7 insertion‑loss targets.

Summary

The meeting was a monthly status call for the Server Mezz NIC sub‑project, kicking off after the holiday break. Participants provided brief personal updates before diving into technical workstreams.

The thermal workstream reported that the TSF specification, including hot and cold design guidance and test‑fixture configuration, is complete. Efforts are now focused on the OCP liquid‑cool neck design, with mechanical iterations progressing toward a Q1 design freeze and prototype production.

Vendor feedback remains mixed: Nvidia has expressed support, while cage vendors have yet to commit to testing the new cooling solutions. Discussions also covered passive versus active cooling for optics and the height constraints of the TSF form factor. Additionally, the four‑factor workstream was sunsetted, narrowing its focus to power and Z‑height challenges.

The SI workstream is proposing that the Gen‑7 specification adopt Chem‑7 insertion‑loss targets, seeking community input before finalization. These updates shape the roadmap for next‑generation server NICs and influence broader ecosystem alignment.

Original Description

Public call recording of Server - Mezz NIC sub-project.