Server - OCE - Chiplet Systems - Workstream (2025-04-22)

Why It Matters

A unified, standards‑driven chiplet ecosystem will lower development costs and speed time‑to‑market for next‑generation servers, while federal funding ensures scalable, industry‑wide adoption.

Key Takeaways

• Consolidate dual wiki pages into a single, searchable OCP chiplet hub
• Recruit volunteers to lead chapters: architecture, security, power, performance, checklist
• Align chiplet interoperability checklist with AMD, Intel, and open‑economy standards
• Leverage $1.55 B NAPMP NOFO2 funding for EDA tools and ecosystem development
• Integrate decision‑support factors to streamline chiplet matching across vendors

Summary

The OCP Chiplet Systems workstream convened to review progress on its new wiki page, clarify the charter, and assign ownership of key focus areas. Participants highlighted the current duplication of official and internal wiki sites and agreed to merge them into a single, easily navigable hub that will host architecture, security, power, performance, and interoperability checklists.

Volunteers stepped forward to lead each chapter, with Rob offering a draft interoperability checklist and others proposing to shape system architecture and security sections. The group also discussed leveraging the $1.55 billion National Advanced Packaging Manufacturing Program (NAPMP) NOFO2 funding, which earmarks up to $150 million per award for five‑year projects covering EDA tools, chiplet ecosystems, and related technologies.

Rich presented a slide deck comparing NOFO2 targets to earlier specifications, underscoring an order‑of‑magnitude jump in bandwidth density and energy‑per‑bit performance. Attendees from AMD, Intel, Micron, ADI, and Tesla shared perspectives on vendor‑specific approaches, emphasizing the need for open‑economy standards that transcend individual company roadmaps.

The meeting set a collaborative framework that could accelerate multi‑vendor chiplet interoperability, reduce integration risk, and drive faster adoption of advanced packaging in server platforms. By aligning industry expertise with substantial federal funding, the OCP initiative aims to create a reusable, standards‑based ecosystem that benefits both hardware vendors and end‑users.

Original Description

Public call recording of Server - OCE - Chiplet Systems workstream.