Server - OCE - Chiplet Systems - Workstream (2025-04-29)

Why It Matters

A unified chiplet specification will lower integration barriers, speed time‑to‑market, and cut costs for hardware vendors adopting modular silicon architectures.

Key Takeaways

• OCE workstream defines multi‑vendor chiplet specification for ecosystem integration
• Roles assigned: architecture, security, power, performance, packaging chapters
• Power and thermal alignment identified as critical for chiplet integration
• Packaging expertise to be sourced from OSAT members and CDX contacts
• Probe testing of micro‑bumps remains a major challenge for validation

Summary

The Open Compute Ecosystem (OCE) workstream convened to outline a specification that will guide multi‑vendor chiplet design and integration across the industry. Participants mapped out the specification’s structure, assigning chapter leads for silicon architecture, security, power, performance optimization, and packaging, while also identifying open positions that need volunteers. Key discussions centered on aligning power and thermal requirements, clarifying that "efficiency" was a misleading term and should focus on power envelopes and thermal management. The group also explored the need for telemetry data to monitor chiplet performance, and debated whether a dedicated chapter was required. Packaging expertise will be tapped from OSAT members and CDX contacts, with specific outreach to experts like El from Saras and David, who runs a power‑thermal analysis startup. A recurring pain point highlighted was the difficulty of probing micro‑bump connections during testing. Participants described the reliance on sacrificial pads and the lack of suitable probe technology, underscoring a gap that could hinder advanced packaging adoption. The conversation referenced real‑world experiences, such as the "known good die" versus "pretty good die" debate and the challenges of high‑speed serial interfaces as a potential workaround. The resulting specification aims to provide a cohesive set of standards—referred to as the B/FI open standard—that will streamline chiplet marketplace interactions, reduce integration overhead, and accelerate hyperscale adoption of modular silicon solutions.

Original Description

Public call recording of Server - OCE - Chiplet Systems workstream.