Server - Project (2026-04-22)

Why It Matters

The meeting underscores accelerating collaboration across OCP’s server, chiplet, and cooling initiatives, positioning the consortium to shape next‑generation data‑center hardware and speed industry adoption.

Key Takeaways

• OCP AMIA Summit in Barcelona expects ~2,000 attendees, double last year.
• Catalina tray design files moving through contribution vote for server project.
• New OCE co‑leads added, expanding global governance and session leadership.
• Thermal test fixture and liquid‑cooling keep‑out zones under review.
• OCP Academy draft course released to streamline spec adoption for newcomers.

Summary

The April 2026 OCP Server Project meeting was a brief, agenda‑light session that primarily set the stage for the upcoming OCP AMIA Summit in Barcelona. Organizers highlighted an expected attendance of roughly 2,000 participants—about twice the size of last year’s Dublin event—and urged members to register early. The meeting also confirmed the Catalina tray design files are progressing through the contribution vote and announced the next steering‑committee meeting for May 14. Key project updates spanned several work streams. The MHS team is finalizing a PDF of the CRPS 1.06 spec for the wiki, while the Open Chiplet Economy (OCE) group introduced AI‑driven use cases, co‑package optics activity, and new co‑leads—Mark Knight from ARM and Dr. Vang Lo—expanding its global governance. OCE also scheduled half‑day and full‑day sessions at the AMIA and Asia‑Pacific summits, and Credo is considering contributing its OmniConnect technology. Technical discussions focused on thermal testing and liquid‑cooling designs. Engineers presented a thermal test fixture and debated a hybrid “Option 5” format that blends DTF and IPMU approaches. Damian detailed three design revisions for liquid‑cooling keep‑out zones, noting the current single‑port configuration targets 400 G/800 G bandwidth and may evolve to dual‑port variants. The OCP Academy initiative unveiled a draft eight‑chapter course to condense the 200‑page specification into an hour‑long learning path for newcomers. Overall, the meeting signaled a maturing OCP ecosystem with growing participation, expanding leadership, and concrete steps toward standardizing thermal and chiplet solutions. The educational push via OCP Academy aims to lower entry barriers, while the summit and upcoming steering‑committee sessions provide platforms for broader industry alignment and rapid adoption of next‑generation server technologies.

Original Description

Public call recording of Server project.