ADLINK Launches PXIe SMU and PXI Express Chassis

Why It Matters

These instruments give test engineers faster, more accurate characterization of advanced chips, shortening development cycles. Their modular, high‑bandwidth design also supports scalable test systems across semiconductor and industrial markets.

Key Takeaways

• PXIe-9908 provides 8‑channel, four‑quadrant source measurement
• Update rate reaches 100 kS/s, 1 MS/s sampling
• PXES-2596 chassis supports 9 or 12 slots, Gen3 backplane
• Thermal sensors and fan‑curve support enable custom cooling
• Products target semiconductor, optoelectronic, and industrial testing

Pulse Analysis

The PXI ecosystem has become a cornerstone for high‑speed, modular test solutions in semiconductor and industrial applications. ADLINK’s decision to broaden its PXI portfolio reflects growing demand for platforms that combine precision, scalability, and ease of integration. By delivering both a cutting‑edge SMU and a versatile chassis, the company positions itself alongside established players while catering to niche requirements such as custom thermal management and backplane‑only configurations.

The PXIe-9908 SMU stands out with its eight‑channel, four‑quadrant architecture, offering up to 100 kS/s update rates and a 1 MS/s sampling capability. These specifications enable rapid voltage and current sweeps, essential for device characterization, reliability validation, and low‑power electronics testing. Meanwhile, the PXES-2596 chassis delivers a compact 9‑ or 12‑slot layout built on a Gen3 PXI Express backplane, ensuring high‑bandwidth data throughput. Integrated heat sinks, on‑board thermal sensors, and fan‑curve control provide engineers with granular thermal tuning, a critical factor for dense, high‑performance test rigs.

For test engineers, OEMs, and system integrators, the new ADLINK offerings translate into shorter development timelines and lower total cost of ownership. The modular nature of the PXIe‑9908 and PXES‑2596 allows seamless scaling from single‑device validation to multi‑module production testing, supporting the rapid iteration cycles demanded by today’s semiconductor roadmaps. As the industry pushes toward finer geometries and higher integration densities, tools that deliver precise, synchronized measurements while remaining adaptable will be pivotal, and ADLINK’s latest products directly address that evolving landscape.