Infineon’s New H-DPAK Puts a 750 V CoolSiC Half-Bridge in a Top-Side-Cooled Package for EV OBCs and DC-DC Converters

Why It Matters

By integrating the high‑voltage SiC half‑bridge into a single, liquid‑cooled package, OEMs can shrink converter footprints while boosting efficiency, accelerating EV adoption and reducing system costs.

Key Takeaways

• 750 V CoolSiC half‑bridge integrated in single H‑DP​AK package
• Top‑side cooling enables liquid‑cooling without board redesign
• Split‑lead‑frame reduces parasitic inductance, cutting switching noise
• Drop‑in compatible with existing 2.3 mm Q‑DP​AK footprints
• Low gate charge cuts drive losses, boosting efficiency

Pulse Analysis

Silicon carbide (SiC) has become the material of choice for high‑voltage power electronics, offering superior switching speed and thermal resilience compared with silicon. Infineon’s latest H‑DP​AK package builds on this advantage by consolidating the high‑side and low‑side MOSFETs of a 750 V CoolSiC G2 half‑bridge into a single footprint. This integration eliminates the need for discrete components, reduces board area, and simplifies the design of on‑board chargers (OBCs) and DC‑DC converters that must handle the demanding power profiles of modern electric vehicles.

The H‑DP​AK’s top‑side‑cooled architecture is a key differentiator. By orienting the heat‑spreading surface upward, manufacturers can attach liquid‑cooling plates directly to the package, achieving superior thermal performance without redesigning the PCB. The split‑lead‑frame further minimizes parasitic loop inductance, which translates to lower voltage ringing and reduced electromagnetic interference during high‑dv/dt switching events. Combined with the CoolSiC G2’s low gate charge, these features lower overall gate‑drive losses, delivering efficiency gains that directly improve vehicle range and reduce cooling system size.

From a market perspective, the drop‑in compatibility with Infineon’s existing 2.3 mm Q‑DP​AK and TOLT footprints lowers the barrier for rapid adoption across the automotive supply chain. OEMs and Tier‑1 suppliers can retrofit existing designs, accelerating time‑to‑market for next‑generation EV power modules. Beyond automotive, the same thermal and electrical benefits apply to high‑voltage data‑center power supplies and backup systems, positioning the H‑DP​AK as a versatile solution in the broader push toward greener, more efficient power conversion.