
Participants on the OCP Security Project call reviewed progress on several specifications and coordination steps rather than following a fixed agenda. Key discussion centered on the DOT framework, which has advanced past version 1.0 in GitHub but has not completed OCP’s formal contribution process, leaving adoption and official recognition unresolved. Attendees agreed to solicit interest for offline working groups to flesh out proposals (including a security hub extension for device key management) and to reconvene for a review in the new year before submitting any spec through the OCP contribution portal. Action items include drafting outreach emails, forming focused working groups, and performing a formal spec review prior to submission.

The Open Compute Project’s Technology Cooling System (TCS) workstream convened on Dec. 11, 2025 to accelerate cloud‑scale liquid‑cooling deployment. Participants reviewed the latest white paper on modular pipe distribution, emphasizing the need for standardized, “Lego‑like” components that can scale from 130 kW...

The February 12, 2026 OCP Technology Cooling System (TCS) Pipe Distribution Workstream call centered on advancing liquid‑cooling standards for high‑density data centers. Participants from Fluid to Chip, Astropec, and the Coldplate group presented draft guidelines for the PG‑25 dielectric coolant,...

The OCP Technology Cooling System (TCS) pipe‑distribution workstream call focused on the rapid evolution of liquid‑cooling architectures as data‑center power density climbs toward 1 MW per rack. Participants reviewed the modular pipeline roadmap, highlighted the need for larger‑format connectors, and discussed...

The OCP Rack & Power Project call on February 11, 2026 featured Meta’s rollout of a 160 kW power shelf designed for high‑density AI GPU racks, followed by Oracle’s briefing on utility‑provider fault‑condition requirements for data centers. The shelf integrates eleven 18 kW power‑supply units,...