
China's National Intellectual Property Administration (CNIPA) clarified that its new inventor‑information rules, effective Jan. 1 2026, obligate Chinese inventors to provide a national ID but do not require foreign inventors to submit passport or other ID numbers at the filing stage. The requirement can be satisfied within two months of a CNIPA request. Earlier guidance from Chinese law firms conflicted on foreign inventor data, but a recent CNIPA letter confirms the flexibility for non‑Chinese inventors. The clarification follows a U.S. Embassy inquiry and aims to streamline patent filings while maintaining inventor authenticity.

The U.S. Court of Appeals for the Second Circuit affirmed the dismissal of Elliott McGucken’s false copyright‑management‑information claim against Shutterstock, finding the platform’s watermarking and automated CMI removal did not show scienter. However, the court vacated summary judgment on the underlying...

The Federal Circuit affirmed Willis Electric’s $42.5 million verdict and upheld the validity of claim 15 of its modular artificial‑tree patent. The court rejected Polygroup’s motions, finding the district court correctly admitted the damages expert’s testimony and did not require limiting damages...

Standard‑essential‑patent (SEP) litigation grew about 15% between 2020 and 2025, moving away from traditional cellular (ETSI) disputes toward Wi‑Fi and video‑codec standards. Litigated video‑codec SEPs jumped 263% and Wi‑Fi SEPs rose 71%, while ETSI‑declared cellular SEPs fell 32%. The surge...

Former Google engineer Linwei Ding was convicted of economic espionage after transferring over 1,000 confidential AI‑chip files to a personal cloud and later launching a China‑based startup. The case illustrates how trusted insiders can bypass traditional perimeter defenses by using...

Two bipartisan bills—the TRAIN Act and the CLEAR Act—are moving through Congress to increase transparency around copyrighted material used in generative AI training. The TRAIN Act would let copyright owners obtain data disclosures via administrative subpoenas after suspecting infringement, while...

The semiconductor industry is moving from planar MOSFETs to 3D structures such as FinFETs and GAA transistors, reshaping how patents are drafted and enforced. These architectural shifts create new layers of patent risk, especially around enablement, claim construction, and apportionment....