News•Mar 11, 2026
Accelerating 4D Imaging Radar with Vision 4DR
Cadence introduced a 4D imaging radar solution that couples its Vision 341 DSP with the Vision 4DR accelerator to handle the heavy FFT workload inherent in high‑resolution MIMO radars. Adding elevation to range, velocity and azimuth creates a massive data cube, demanding fast Fourier transforms across four dimensions. Offloading FFTs to the 4DR engine yields up to 3.7× faster processing, freeing the Vision 341 for parallel AI and sensor‑fusion tasks. Two operating modes—Vision 341 + 4DR and Vision 341 only—offer flexible integration for automotive platforms.
By Semiconductor Engineering
News•Mar 10, 2026
The Specialty Device Surge Part 1: Wafer Size Transitions Are Powering The Future Of Specialty Devices And Bringing New Challenges
Specialty devices—including SiC and GaN power transistors, MEMS, photonics, and CIS—are shifting from traditional 150mm and 200mm wafers to larger 200mm and 300mm formats. GaN power is moving to 300mm, while SiC power advances to 200mm, and photonics, MEMS, and...
By Semiconductor Engineering
News•Mar 10, 2026
Enabling Seamless Monitoring, Test, And Repair In Multi-Die Designs
The semiconductor industry is turning to 2.5D/3D multi‑die designs to meet AI‑driven performance and efficiency goals. However, testing, monitoring, and repairing hidden chiplets remain a major hurdle. Synopsys and TSMC showcased a demo vehicle built on TSMC’s N3P process that...
By Semiconductor Engineering
News•Mar 10, 2026
The Petabyte Problem: How AI Is Finally Making Semiconductor Manufacturing Data Actionable
Semiconductor manufacturers are grappling with petabyte‑scale data from probe, assembly and test operations, yet less than 5% is currently used for analytics. PDF Solutions introduced its Exensio platform, combining a parallel data architecture, semantic integration, and agentic LLM capabilities to...
By Semiconductor Engineering
News•Mar 10, 2026
Ensuring AI Reliability: Mitigating OCP’s Silent Data Corruption Risks
An Open Compute Project whitepaper, co‑authored by NVIDIA, Google, Meta and Microsoft, warns that silent data corruption (SDC) is escalating in AI data centers as process geometries shrink and workloads intensify. SDC originates from timing violations, voltage‑frequency scaling, and wear‑out,...
By Semiconductor Engineering
News•Mar 10, 2026
Detecting Chemical Variability At Advanced Nodes
Advanced‑node semiconductor yield is increasingly eroded by subtle chemical variability in thin films, interfaces, and residues rather than obvious particle defects. This molecular variability manifests as parametric drift and margin erosion that only appear under workload or thermal stress, making...
By Semiconductor Engineering
News•Mar 9, 2026
Research Bits: Mar. 9
Researchers at UNIST unveiled a 28 nm injection‑locked clock multiplier that delivers 2.1 GHz signals with a record‑low -81.36 dBc reference spur and 280.9 fs jitter while consuming just 12.28 mW. A multinational team demonstrated a 2D‑material thermal sensor that reads temperature in 100 ns, is...
By Semiconductor Engineering
News•Mar 9, 2026
The Future of Semiconductors: Engineering in the Convergence Era
The semiconductor sector is moving into a convergence era where silicon, software, physics, packaging, security, AI and power constraints intersect. While transistor scaling remains relevant, architecture, integration, verification and automation now drive growth. System‑level engineering, digital twins and software‑defined chips...
By Semiconductor Engineering