CoolSem Technologies Raises Pre-Seed Funding for Wafer-Level Thermal Innovation

Why It Matters

Enhanced thermal management can unlock higher chip performance while extending device lifetimes, supporting a more sustainable, circular semiconductor supply chain.

Key Takeaways

• Pre‑seed round led by HTGF, includes four investors
• WaLTIS stack replaces substrate, improves heat dissipation
• Targets RF, power, photonic chips with thermal limits
• Funding accelerates engineering samples and customer validation
• Promotes circular semiconductor industry via material reuse

Pulse Analysis

Thermal management has become a bottleneck as semiconductor architectures shrink and power densities rise. Industry analysts note that conventional packaging materials are approaching their physical limits, especially in high‑frequency RF, power‑conversion, and photonic domains. This pressure drives a shift toward solutions that not only dissipate heat more efficiently but also align with sustainability goals, reducing reliance on scarce raw materials and extending hardware lifespans.

CoolSem's WaLTIS technology tackles these challenges by introducing a multilayer wafer‑level stack that substitutes the traditional substrate. Engineered for superior thermal conductivity and mechanical robustness, the stack enables chips to operate at higher temperatures without performance degradation. By integrating directly at the wafer level, WaLTIS simplifies the packaging stack, potentially lowering manufacturing complexity and cost. Early interest from leading RF, power, and photonics firms suggests the solution addresses a critical gap in next‑generation chip design.

The recent pre‑seed financing provides the capital needed to transition WaLTIS from laboratory proof‑of‑concept to engineering samples ready for customer trials. Validation with real‑world workloads will be essential to demonstrate reliability and performance gains. Successful adoption could position WaLTIS as a standard component in future semiconductor thermal architectures, attracting further venture interest and fostering a more circular, resource‑efficient industry. Investors are watching closely as thermal solutions become a strategic differentiator for high‑performance chips.

Deal Summary

CoolSem Technologies, a semiconductor thermal-management startup, closed a pre-seed round led by High-Tech Gründerfonds (HTGF) with participation from KBC Focus Fund NV, Brabant Development Agency (BOM) and TTT Green Tech B.V. (SHIFT Invest). The funding will support development of its WaLTIS wafer-level thermal management technology and production of engineering samples. The round was announced on Jan 19 2026.