Could AMD Be the First Company to Use Custom HBM?, Sorry I'm Using a Translator.
A February 2026 forum thread suggests AMD could become the first company to deploy a custom HBM solution, likely HBM4e, using a bespoke base die (b‑die) for a next‑gen GPU dubbed MI455X. Contributors highlight development costs exceeding $100 million and significant compatibility hurdles with memory dies from Samsung, Hynix, and TSMC. Samsung and Hynix have already assembled dedicated custom HBM teams, while TSMC proposes a larger I/O alternative. The debate weighs custom B‑die, dual‑die architectures, and unit‑price trade‑offs.
ASUS Transformer T100
The ASUS Transformer T100, a legacy 2‑in‑1 notebook, can be repurposed as an external monitor for a desktop PC. The device includes a micro‑HDMI output and can accept video via a USB‑to‑HDMI adapter, allowing Windows to extend or duplicate the...
Xbox Series X
The forum thread captures early consumer reactions to Microsoft’s Xbox Series X, highlighting expectations around its naming, design flexibility, and performance claims of delivering four times the power of the Xbox One X. Participants reference official statements about vertical or horizontal...
