
OCP CE - CDU _ Coolant Distribution Unit Project Call (Oct 28, 2025)
The Open Compute Project convened its first Coolant Distribution Unit (CDU) workstream call, outlining a three‑phase deliverable: a high‑level white paper, a detailed performance specification, and a commissioning guide. Co‑lead John Minaj, joined by representatives from Nvidia, Google, and a CDU‑producing startup, emphasized the need for a unified industry reference that clarifies component types, design criteria, and testing methodologies. Participants highlighted gaps in current documentation, noting that many data‑center planners struggle to differentiate CDU architectures—liquid‑to‑liquid, liquid‑to‑air, rack‑mount, etc.—and to understand key metrics such as approach temperature. Nvidia’s Praep Shahi and Google’s Husam Kabani pledged existing internal specifications and qualification procedures to inform the OCP drafts, while Jack Kar stressed transparency to prevent “smoke and mirrors” in performance ratings. The discussion also introduced the Ashray 127 testing methodology as a benchmark for rating CDUs, and underscored the broader OCP Advanced Cooling Facilities goal: enable higher compute density, improve energy efficiency, and unlock heat‑reuse opportunities. By standardizing metrics like approach temperature and defining commissioning steps, the workstream aims to reduce vendor‑to‑vendor variance and simplify procurement decisions. If successful, the white paper and subsequent specifications will give data‑center operators a clear, vendor‑agnostic framework for selecting CDUs, accelerating liquid‑cooling adoption and supporting sustainability targets across the industry.

OCP CE - CDU _ Coolant Distribution Unit Project Call (Sep 23, 2025)
Attendees used the scheduled CDU project call to review a draft white paper on Coolant Distribution Units (CDUs) after the chair was absent, focusing on specification, qualification and operational assurance of CDUs for liquid-cooled data centers. Discussion highlighted core topics...

OCP CE - CDU _ Coolant Distribution Unit Project Call (Aug 26, 2025)
Participants discussed launching a CDU (Coolant Distribution Unit) performance white paper to complement the modular Thermal Control System (TCS) work, aiming to define qualification and performance requirements and avoid duplicating prior Cooling Environments efforts. Attendees noted confusion over multiple overlapping...

OCP Open Platform Firmware Project Call (Feb 26, 2026)
The OCP Open Platform Firmware (OPF) recurring call centered on two urgent items: completing the review of the 0.5 specification draft and finalizing the agenda for the upcoming EMA summit. Participants from ARM, Intel, AMD, and other silicon partners were...

OCP Security Project Call (Dec 09, 2025)
Participants on the OCP Security Project call reviewed progress on several specifications and coordination steps rather than following a fixed agenda. Key discussion centered on the DOT framework, which has advanced past version 1.0 in GitHub but has not completed...

OCP DCF - Technology Cooling System (TCS) Pipe Distribution Workstream Call (Feb 12, 2026)
The February 12, 2026 OCP Technology Cooling System (TCS) Pipe Distribution Workstream call centered on advancing liquid‑cooling standards for high‑density data centers. Participants from Fluid to Chip, Astropec, and the Coldplate group presented draft guidelines for the PG‑25 dielectric coolant,...

OCP DCF - Technology Cooling System (TCS) Pipe Distribution Workstream Call (Dec 11, 2025)
The Open Compute Project’s Technology Cooling System (TCS) workstream convened on Dec. 11, 2025 to accelerate cloud‑scale liquid‑cooling deployment. Participants reviewed the latest white paper on modular pipe distribution, emphasizing the need for standardized, “Lego‑like” components that can scale from 130 kW...

OCP DCF - Technology Cooling System (TCS) Pipe Distribution Workstream Call (Jan 08, 2026)
The OCP Technology Cooling System (TCS) pipe‑distribution workstream call focused on the rapid evolution of liquid‑cooling architectures as data‑center power density climbs toward 1 MW per rack. Participants reviewed the modular pipeline roadmap, highlighted the need for larger‑format connectors, and discussed...

OCP Rack & Power Project Call (Feb 11, 2026)
The OCP Rack & Power Project call on February 11, 2026 featured Meta’s rollout of a 160 kW power shelf designed for high‑density AI GPU racks, followed by Oracle’s briefing on utility‑provider fault‑condition requirements for data centers. The shelf integrates eleven 18 kW power‑supply units,...

OCP Evenstar Workstream Call (Dec 12, 2025)
The Evenstar Workstream met Dec. 12 with co-chair Tom Nato filling in; the group had no formal agenda but discussed several pending items from recent weeks. Members flagged an “autonomous RU” paper with comments to be circulated and reviewed in...

OCP Evenstar Workstream Call (Jan 09, 2026)
On the Jan. 9 Evenstar workstream call, OCP leaders outlined a reorganization that will fold the Evenstar project into a newly proposed AI computing continuum, replacing the existing telco/edge top-level project. The group plans to refocus Evenstar toward integrating AI...

OCP Evenstar Workstream Call (Feb 06, 2026)
Members of the OCP Evenstar community reviewed progress on the RAI (Radio Abstraction Interface) and coordination with the Open MPlane project, reporting significant repo modernization, dependency upgrades, dockerization, and a new test suite and mock RU/DU simulations aimed at enabling...