
Networking - SAI _ Switch Abstraction Interface - Sub-Project - (2026-04-16)
The meeting presented a proposal to extend the Switch Abstraction Interface (SAI) with optical transport network (OTN) support. Alibaba’s Wan and Molex’s Jimmy outlined how the Sonic OTM work group plans to integrate OTN components—starting with optical amplifiers and attenuators—into SAI as experimental objects, mirroring OpenConfig YANG models. Key insights include the three‑phase rollout: Phase 1 adds basic amplifier and attenuator objects; Phase 2 will bring in OCM, OTDR, WSS, and APS; Phase 3 targets full transponder functionality. To avoid disrupting existing SAI IP objects, the OTN definitions are isolated via the experimental namespace and introduced through extension mechanisms rather than core code changes. A novel integer‑plus‑position tag enables decimal precision without altering SAI’s data‑type system. Notable details: the proposal reuses OpenConfig attribute definitions, reducing debate over field selection, and implements a new switch type “OTN” to route OTN‑specific logic. Code changes are confined to dedicated OTN files—flex‑counter, config‑manager, and ultra‑agent—ensuring runtime parity between traditional switches and OTN devices. The pull request, reviewed and approved after addressing range checks for the position tag, now awaits final merge. Implications are significant: a unified SONiC‑based control plane can orchestrate both packet and optical layers, offering vendors a common development base and expanding SONiC’s influence into the broader network domain. This paves the way for multi‑layer SDN controllers and tighter integration of data‑center interconnects.

Strategic Initiatives - Open Cluster Designs for AI - Workstream - (2025-07-31)
The workstream meeting centered on finalizing a draft white paper that defines Open Cluster and Open Pod Group architectures for AI‑focused data centers. Participants reviewed the document, agreed to publish it on a shared G‑Drive, and outlined the agenda for...

Server - CMS _ Composable Memory System - Workstream - (2026-02-05)
The video records a CMS workstream meeting on February 5 2026 at the Reality Lab, where team members coordinated logistics, addressed security protocols, and outlined the agenda to lock down deliverables for the composable memory system this year. A central focus was...

Server - CMS - DC - Memory Fabric Orchestration - 87523137632 & 83213620697 - Workstream - (2025-11-
The meeting centered on progress and roadblocks in the Server‑CMS‑DC memory‑fabric orchestration workstream, including the pending OCP white paper and its limited public accessibility. Participants highlighted two parallel technical tracks: a system‑level solution for dynamic CXL memory provisioning and a...

HM - DDD _ Datacenter Diagnostics and Debug - Workstream - (2025-11-13)
The meeting focused on the Datacenter Diagnostics and Debug workstream, aiming to devise a collaborative approach for troubleshooting complex issues that span multiple stakeholders – tenants, cloud service providers, and silicon OEMs. Participants highlighted the growing frequency of hard‑to‑reproduce faults...

HM - DDD _ Datacenter Diagnostics and Debug - Workstream - (2026-04-23)
The meeting opened with a brief on recent OCP Zoom policy changes, requiring a host ID and OCP Gmail account to start meetings. Participants noted frequent delays as hosts struggled with the new authentication flow, highlighting a need for better...

FTI - DCIQII _ Data Center Integration of Quantum Information Infrastructure - Workstream - (2025-10
The Open Compute Project (OCP) workstream convened to advance the Data Center Integration of Quantum Information Infrastructure (DCIQII). Participants discussed a forthcoming white paper and an updated OCP‑Ready checklist designed to make data centers "quantum‑ready" by outlining power, cryogenic, and...

Server - Project (2026-04-22)
The April 2026 OCP Server Project meeting was a brief, agenda‑light session that primarily set the stage for the upcoming OCP AMIA Summit in Barcelona. Organizers highlighted an expected attendance of roughly 2,000 participants—about twice the size of last year’s...

Server - OCE - Chiplet Systems - Workstream (2025-10-22)
The OCP Chiplet Systems workstream held a follow‑up meeting after a recent industry conference, noting that attendance was modest—fewer than fifty participants in the session despite the larger event drawing thousands. The discussion centered on ARM’s recent decision to contribute...

DCF - Digital Twin - Workstream (2025-09-02)
The DCF Digital Twin workstream held a coordination call to finalize a presentation slated for the upcoming global summit. The team confirmed the deck is stored on Google Drive, with a review cycle ending this week, and discussed procedural details...

CE - IC - Hardware Management for Liquid Cooling - Workstream (2026-04-15)
The meeting focused on progress in hardware management for liquid‑cooled AI racks, covering a recent breakthrough in mock‑up generation, ongoing Redfish schema work, and coordination with the OCP Europe community. Using Claude’s agent‑enabled cursor mode, the team finally completed a...

CE - IC - Hardware Management for Liquid Cooling - Workstream (2026-03-18)
The March 18 meeting revisited the ongoing hardware management workstream for liquid‑cooling systems, confirming that the series of update calls will continue and outlining the year’s focus on delivering mock‑ups and interoperability (interop) profiles for various cooling topologies. Participants reviewed...

RP _ Rack & Power - Project (2026-03-11)
Meta’s engineering team, led by Daryl Daniel, presented the Open Rack Wide (OW) frame specification to the OCP community, positioning it as a standardized, double‑width rack solution for next‑generation AI workloads. The session outlined the project’s status, upcoming contribution timeline,...

RP _ Rack & Power - Project (2026-02-25)
The call centered on the Rack & Power project’s progress and coordination for upcoming industry events, including GTC, the AMIA summit, and the APAC Apex Summit. Participants discussed abstract review deadlines, email notification gaps, and logistical challenges affecting their contributions. Key...

RP _ Rack & Power - Project (2026-04-08)
The meeting opened with a reminder about the upcoming OCP EMA summit on April 29‑30, where working groups will review the latest developments in rack‑power and related projects. Organizers emphasized the importance of attendance for stakeholders interested in shaping future...

Server - OCE - Chiplet Systems - Workstream (2025-04-22)
The OCP Chiplet Systems workstream convened to review progress on its new wiki page, clarify the charter, and assign ownership of key focus areas. Participants highlighted the current duplication of official and internal wiki sites and agreed to merge them...

Server - OCE - Chiplet Systems - Workstream (2025-04-29)
The Open Compute Ecosystem (OCE) workstream convened to outline a specification that will guide multi‑vendor chiplet design and integration across the industry. Participants mapped out the specification’s structure, assigning chapter leads for silicon architecture, security, power, performance optimization, and packaging,...

CE - ACF Door Heat Exchanger - Sub-Project (2026-02-05)
The monthly OCP community call focused on the ACF Door Heat Exchanger sub‑project and broader OCP initiatives. Participants reviewed upcoming events, including the Barcelona summit with an abstract deadline of February 9, and highlighted sponsorship opportunities for the high‑attendance liquid‑cooling networking...

OCP HM - OpenRMC-DM Project Call (Mar 24, 2026)
The OCP OpenRMC-DM project call on March 24, 2026 brought together core maintainers and several new contributors, notably Sharda Krishna from Strategic Thermal Labs, a Texas‑based liquid‑cooling startup, and Mitch Dinsley of Open Gear. The meeting opened with introductions, a brief login...

OCP HM - OpenRMC-DM Project Call (Dec 09, 2025)
The final 2025 OpenRMC‑DM call centered on the upcoming 1.3 specification, which expands Redfish‑based management to support bulk inventory, firmware versioning, and group operations across an entire rack. Participants reviewed new Git changes that introduce single‑command queries for CPU, power,...

OCP CE - CP - Cold Plate Base Specifications Project Call (Feb 04, 2026)
The OCP Cold Plate Base Specifications working group reviewed the near-final draft and agreed to lock the document on Friday for formatting and submission, while leaving it open for final comments. The team asked for expert reviewers with core-plate design...

OCP CE - CP - Cold Plate Base Specifications Project Call (Dec 10, 2025)
The OCP CE‑CP Cold Plate Base Specifications call focused on refining validation requirements for cold‑plate components ahead of the 2026 scaling push. Participants examined legacy specifications, highlighted practical field failures, and debated whether the scope should remain limited to individual...

OCP CE - ACF Cold Plate Sub-Project Call (Feb 11, 2026)
The OCP Community Engineering call on February 11 focused on progress updates for the ACF Cold Plate sub‑project and upcoming community events. Organizers reminded participants of the AMIA summit timeline, with presentation proposals due March 2 and final slides due March 23,...

OCP CE - ACF Cold Plate Sub-Project Call (Jan 14, 2026)
The OCP CE ACF Cold Plate sub‑project call opened with logistical housekeeping and a reminder that the regional summit’s call for presentations closes on February 9. Participants were urged to submit abstracts and slide decks early to ensure representation of their...

OCP DCF - Technology Cooling System (TCS) Pipe Distribution Workstream Call (Mar 12, 2026)
The Open Compute Project’s Technology Cooling System (TCS) Pipe Distribution workstream convened on March 12, 2026 to address the massive liquid‑cooling infrastructure required for next‑generation AI data centers. Speakers highlighted that the projected AI “tsunami” – hundreds of megawatts of GPU‑intensive...

OCP CE - CDU _ Coolant Distribution Unit Project Call (Oct 28, 2025)
The Open Compute Project convened its first Coolant Distribution Unit (CDU) workstream call, outlining a three‑phase deliverable: a high‑level white paper, a detailed performance specification, and a commissioning guide. Co‑lead John Minaj, joined by representatives from Nvidia, Google, and a...

OCP CE - CDU _ Coolant Distribution Unit Project Call (Sep 23, 2025)
Attendees used the scheduled CDU project call to review a draft white paper on Coolant Distribution Units (CDUs) after the chair was absent, focusing on specification, qualification and operational assurance of CDUs for liquid-cooled data centers. Discussion highlighted core topics...

OCP CE - CDU _ Coolant Distribution Unit Project Call (Aug 26, 2025)
Participants discussed launching a CDU (Coolant Distribution Unit) performance white paper to complement the modular Thermal Control System (TCS) work, aiming to define qualification and performance requirements and avoid duplicating prior Cooling Environments efforts. Attendees noted confusion over multiple overlapping...

OCP Open Platform Firmware Project Call (Feb 26, 2026)
The OCP Open Platform Firmware (OPF) recurring call centered on two urgent items: completing the review of the 0.5 specification draft and finalizing the agenda for the upcoming EMA summit. Participants from ARM, Intel, AMD, and other silicon partners were...

OCP Security Project Call (Dec 09, 2025)
Participants on the OCP Security Project call reviewed progress on several specifications and coordination steps rather than following a fixed agenda. Key discussion centered on the DOT framework, which has advanced past version 1.0 in GitHub but has not completed...

OCP DCF - Technology Cooling System (TCS) Pipe Distribution Workstream Call (Feb 12, 2026)
The February 12, 2026 OCP Technology Cooling System (TCS) Pipe Distribution Workstream call centered on advancing liquid‑cooling standards for high‑density data centers. Participants from Fluid to Chip, Astropec, and the Coldplate group presented draft guidelines for the PG‑25 dielectric coolant,...

OCP DCF - Technology Cooling System (TCS) Pipe Distribution Workstream Call (Dec 11, 2025)
The Open Compute Project’s Technology Cooling System (TCS) workstream convened on Dec. 11, 2025 to accelerate cloud‑scale liquid‑cooling deployment. Participants reviewed the latest white paper on modular pipe distribution, emphasizing the need for standardized, “Lego‑like” components that can scale from 130 kW...

OCP DCF - Technology Cooling System (TCS) Pipe Distribution Workstream Call (Jan 08, 2026)
The OCP Technology Cooling System (TCS) pipe‑distribution workstream call focused on the rapid evolution of liquid‑cooling architectures as data‑center power density climbs toward 1 MW per rack. Participants reviewed the modular pipeline roadmap, highlighted the need for larger‑format connectors, and discussed...

OCP Rack & Power Project Call (Feb 11, 2026)
The OCP Rack & Power Project call on February 11, 2026 featured Meta’s rollout of a 160 kW power shelf designed for high‑density AI GPU racks, followed by Oracle’s briefing on utility‑provider fault‑condition requirements for data centers. The shelf integrates eleven 18 kW power‑supply units,...

OCP Evenstar Workstream Call (Dec 12, 2025)
The Evenstar Workstream met Dec. 12 with co-chair Tom Nato filling in; the group had no formal agenda but discussed several pending items from recent weeks. Members flagged an “autonomous RU” paper with comments to be circulated and reviewed in...

OCP Evenstar Workstream Call (Jan 09, 2026)
On the Jan. 9 Evenstar workstream call, OCP leaders outlined a reorganization that will fold the Evenstar project into a newly proposed AI computing continuum, replacing the existing telco/edge top-level project. The group plans to refocus Evenstar toward integrating AI...

OCP Evenstar Workstream Call (Feb 06, 2026)
Members of the OCP Evenstar community reviewed progress on the RAI (Radio Abstraction Interface) and coordination with the Open MPlane project, reporting significant repo modernization, dependency upgrades, dockerization, and a new test suite and mock RU/DU simulations aimed at enabling...