
CE - IC - Hardware Management for Liquid Cooling - Workstream (2026-04-15)
The meeting focused on progress in hardware management for liquid‑cooled AI racks, covering a recent breakthrough in mock‑up generation, ongoing Redfish schema work, and coordination with the OCP Europe community. Using Claude’s agent‑enabled cursor mode, the team finally completed a full rack mock‑up—including eight servers, a DLC, and a CDU—overcoming earlier failures that stalled at 50‑70% completion. The agenda also previewed the upcoming OCP Europe summit, where European partners will discuss standards alignment and share field experiences. Key insights included the resolution of the mock‑up bottleneck, the identification of gaps in the Redfish schema—particularly around leak‑detector types, humidity, temperature, and differential pressure sensors—and the role of MQTT as a transport layer that feeds data into the Redfish model. Participants highlighted that current leak‑detection schemas only support simple alarm states, lacking granularity for rope‑style detectors or distance‑to‑leak metrics, and that environmental metrics need explicit sensor definitions for barometric and differential air pressure. Notable examples were drawn from Nvidia’s AI‑pod reference design, which enumerates temperature, humidity, and airflow pressure but relies on MQTT for telemetry. The discussion underscored how Redfish can provide a unified context for such data, ensuring that telemetry from any transport can be mapped back to specific chassis, rack, or component locations. Attendees also shared a draft schema snippet showing leak‑detector groups, sensor types, and the need for additional properties. The implications are clear: without extending the Redfish schema to cover nuanced leak‑detection and pressure sensors, operators risk fragmented monitoring and limited automation in high‑density liquid‑cooled environments. Industry contributions to the DMTF working group are essential to standardize these extensions, enabling interoperable management tools and smoother integration of MQTT‑based telemetry across AI data centers.

CE - IC - Hardware Management for Liquid Cooling - Workstream (2026-03-18)
The March 18 meeting revisited the ongoing hardware management workstream for liquid‑cooling systems, confirming that the series of update calls will continue and outlining the year’s focus on delivering mock‑ups and interoperability (interop) profiles for various cooling topologies. Participants reviewed...

RP _ Rack & Power - Project (2026-03-11)
Meta’s engineering team, led by Daryl Daniel, presented the Open Rack Wide (OW) frame specification to the OCP community, positioning it as a standardized, double‑width rack solution for next‑generation AI workloads. The session outlined the project’s status, upcoming contribution timeline,...

RP _ Rack & Power - Project (2026-02-25)
The call centered on the Rack & Power project’s progress and coordination for upcoming industry events, including GTC, the AMIA summit, and the APAC Apex Summit. Participants discussed abstract review deadlines, email notification gaps, and logistical challenges affecting their contributions. Key...

RP _ Rack & Power - Project (2026-04-08)
The meeting opened with a reminder about the upcoming OCP EMA summit on April 29‑30, where working groups will review the latest developments in rack‑power and related projects. Organizers emphasized the importance of attendance for stakeholders interested in shaping future...

Server - OCE - Chiplet Systems - Workstream (2025-04-22)
The OCP Chiplet Systems workstream convened to review progress on its new wiki page, clarify the charter, and assign ownership of key focus areas. Participants highlighted the current duplication of official and internal wiki sites and agreed to merge them...

Server - OCE - Chiplet Systems - Workstream (2025-04-29)
The Open Compute Ecosystem (OCE) workstream convened to outline a specification that will guide multi‑vendor chiplet design and integration across the industry. Participants mapped out the specification’s structure, assigning chapter leads for silicon architecture, security, power, performance optimization, and packaging,...

CE - ACF Door Heat Exchanger - Sub-Project (2026-02-05)
The monthly OCP community call focused on the ACF Door Heat Exchanger sub‑project and broader OCP initiatives. Participants reviewed upcoming events, including the Barcelona summit with an abstract deadline of February 9, and highlighted sponsorship opportunities for the high‑attendance liquid‑cooling networking...

OCP HM - OpenRMC-DM Project Call (Mar 24, 2026)
The OCP OpenRMC-DM project call on March 24, 2026 brought together core maintainers and several new contributors, notably Sharda Krishna from Strategic Thermal Labs, a Texas‑based liquid‑cooling startup, and Mitch Dinsley of Open Gear. The meeting opened with introductions, a brief login...

OCP HM - OpenRMC-DM Project Call (Dec 09, 2025)
The final 2025 OpenRMC‑DM call centered on the upcoming 1.3 specification, which expands Redfish‑based management to support bulk inventory, firmware versioning, and group operations across an entire rack. Participants reviewed new Git changes that introduce single‑command queries for CPU, power,...

OCP CE - CP - Cold Plate Base Specifications Project Call (Feb 04, 2026)
The OCP Cold Plate Base Specifications working group reviewed the near-final draft and agreed to lock the document on Friday for formatting and submission, while leaving it open for final comments. The team asked for expert reviewers with core-plate design...

OCP CE - CP - Cold Plate Base Specifications Project Call (Dec 10, 2025)
The OCP CE‑CP Cold Plate Base Specifications call focused on refining validation requirements for cold‑plate components ahead of the 2026 scaling push. Participants examined legacy specifications, highlighted practical field failures, and debated whether the scope should remain limited to individual...

OCP CE - ACF Cold Plate Sub-Project Call (Feb 11, 2026)
The OCP Community Engineering call on February 11 focused on progress updates for the ACF Cold Plate sub‑project and upcoming community events. Organizers reminded participants of the AMIA summit timeline, with presentation proposals due March 2 and final slides due March 23,...

OCP CE - ACF Cold Plate Sub-Project Call (Jan 14, 2026)
The OCP CE ACF Cold Plate sub‑project call opened with logistical housekeeping and a reminder that the regional summit’s call for presentations closes on February 9. Participants were urged to submit abstracts and slide decks early to ensure representation of their...

OCP DCF - Technology Cooling System (TCS) Pipe Distribution Workstream Call (Mar 12, 2026)
The Open Compute Project’s Technology Cooling System (TCS) Pipe Distribution workstream convened on March 12, 2026 to address the massive liquid‑cooling infrastructure required for next‑generation AI data centers. Speakers highlighted that the projected AI “tsunami” – hundreds of megawatts of GPU‑intensive...