Mission Accomplished: Infineon Technology Proves Reliable Once Again in Space on Artemis II
Infineon Technologies’ radiation‑hardened semiconductors performed without fault during NASA’s Artemis II Orion capsule mission, which spent ten days in deep space and set a new distance record for crewed flight. The company highlighted its long heritage, dating to the 1970s, of supplying rad‑hard components to NASA, ESA and the International Space Station, and noted that its internally manufactured JANS‑qualified gallium‑nitride (GaN) transistor is the first of its kind for space. Infineon’s broad portfolio now includes Si MOSFETs, GaN transistors, gate drivers, solid‑state relays, memories and RF devices, all qualified to stringent MIL‑PRF and ESA standards. The firm reported 57,000 employees and FY 2025 revenue of roughly €14.7 billion (about $16 billion).
Indium Corporation Presents Collaborative Research on Solder Alloy Reliability for Heterogeneous Integration at ICEP-HBS
Indium Corporation will present an INEMI‑backed study at ICEP‑HBS comparing SnBi and SAC305 solder alloys for first‑level interconnects in heterogeneous packages. The research shows SnBi solder reduces package warpage by more than 70 microns thanks to its lower processing temperature,...
In Memoriam: Tracy Kidder, Author of Pulitzer Prize-Winning “The Soul of a New Machine”
Tracy Kidder, Pulitzer‑winning author of “The Soul of a New Machine,” died on March 24 at age 80. The 1981 bestseller chronicled Data General’s race to build the 32‑bit Eclipse MV/8000, a story Kidder captured by embedding with the engineering team despite having...
Siemens Accelerates AI Chip Verification to Trillion‑cycle Scale with NVIDIA Technology
Siemens and NVIDIA announced that Siemens’ Veloce proFPGA CS hardware‑assisted verification platform can capture tens of trillions of pre‑silicon design cycles in just a few days. The breakthrough combines Siemens’ scalable FPGA‑based architecture with NVIDIA’s performance‑optimized chip designs, dramatically accelerating AI/ML system‑on‑chip...
CEA-Leti, CEA-List and PSMC Collaborate to Integrate RISC-V and MicroLED Silicon Photonics Into 3D Stacking and Interposer for...
CEA‑Leti, CEA‑List and Powerchip Semiconductor Manufacturing Corporation (PSMC) announced a partnership to embed CEA‑List’s RISC‑V processor IP and CEA‑Leti’s microLED silicon‑photonic chiplets into PSMC’s 3D‑stacking and interposer platform. The integration replaces traditional copper interconnects with short‑reach, high‑bandwidth optical links, delivering...
CEA-Leti and Fraunhofer IPMS Validate Wafer Exchange for Ferroelectric Memory Materials Within the FAMES Pilot Line
CEA‑Leti and Fraunhofer IPMS have completed the first exchange of ferroelectric memory wafers within the EU‑funded FAMES Pilot Line, proving a shared platform for advanced embedded non‑volatile memory development. The exchange used 300 mm CMOS cleanrooms to process hafnium‑zirconium oxide (HZO)...