Indium Corporation Presents Collaborative Research on Solder Alloy Reliability for Heterogeneous Integration at ICEP-HBS
Indium Corporation will present an INEMI‑backed study at ICEP‑HBS comparing SnBi and SAC305 solder alloys for first‑level interconnects in heterogeneous packages. The research shows SnBi solder reduces package warpage by more than 70 microns thanks to its lower processing temperature, while matching SAC305’s thermal aging and shock resistance. Findings aim to guide material selection for next‑generation high‑density semiconductor packages that demand superior thermomechanical reliability. The presentation is led by senior global product manager Sze Pei Lim, alongside metallurgist Danyang Zheng and other INEMI partners.
Sivers Semiconductors Collaborates With Jabil on Energy Efficient 1.6T Pluggable Optical Transceiver Module
Sivers Semiconductors announced a partnership with Jabil to create a 1.6‑terabit‑per‑second linear‑receive optical (LRO) transceiver module built around Sivers’ high‑performance distributed‑feedback lasers. The pluggable module is designed for ultra‑low power consumption, addressing the energy‑efficiency demands of next‑generation hyperscale AI data...
In Memoriam: Tracy Kidder, Author of Pulitzer Prize-Winning “The Soul of a New Machine”
Tracy Kidder, Pulitzer‑winning author of “The Soul of a New Machine,” died on March 24 at age 80. The 1981 bestseller chronicled Data General’s race to build the 32‑bit Eclipse MV/8000, a story Kidder captured by embedding with the engineering team despite having...
Siemens Accelerates AI Chip Verification to Trillion‑cycle Scale with NVIDIA Technology
Siemens and NVIDIA announced that Siemens’ Veloce proFPGA CS hardware‑assisted verification platform can capture tens of trillions of pre‑silicon design cycles in just a few days. The breakthrough combines Siemens’ scalable FPGA‑based architecture with NVIDIA’s performance‑optimized chip designs, dramatically accelerating AI/ML system‑on‑chip...
CEA-Leti, CEA-List and PSMC Collaborate to Integrate RISC-V and MicroLED Silicon Photonics Into 3D Stacking and Interposer for...
CEA‑Leti, CEA‑List and Powerchip Semiconductor Manufacturing Corporation (PSMC) announced a partnership to embed CEA‑List’s RISC‑V processor IP and CEA‑Leti’s microLED silicon‑photonic chiplets into PSMC’s 3D‑stacking and interposer platform. The integration replaces traditional copper interconnects with short‑reach, high‑bandwidth optical links, delivering...
CEA-Leti and Fraunhofer IPMS Validate Wafer Exchange for Ferroelectric Memory Materials Within the FAMES Pilot Line
CEA‑Leti and Fraunhofer IPMS have completed the first exchange of ferroelectric memory wafers within the EU‑funded FAMES Pilot Line, proving a shared platform for advanced embedded non‑volatile memory development. The exchange used 300 mm CMOS cleanrooms to process hafnium‑zirconium oxide (HZO)...
