Anglia and Nanopower Reduce IoT Power and Increase Battery Life for UK and EU Customers
Anglia Components has signed a pan‑European distribution agreement with Norway’s Nanopower Semiconductor to sell the nPZero Gen1 power‑management IC. The nPZero reduces IoT device power consumption by up to 90% by handling sensor monitoring and wake‑up logic, allowing the main MCU to stay off for longer periods. Anglia will be the first distributor across the UK and EU to stock the solution, positioning it as a key enabler for battery‑powered and energy‑harvesting applications. The partnership aligns with both companies’ sustainability goals and aims to eliminate millions of batteries.
Sivers & GlobalFoundries Advance AI Data Center Optical Solutions
Sivers Semiconductors and GlobalFoundries announced a strategic partnership to develop silicon‑photonic solutions for AI‑driven data centers. Sivers’ high‑precision laser arrays will be integrated into GlobalFoundries’ silicon photonics platform and its SCALE™ co‑packaged optics (CPO) module. The collaboration covers co‑packaged optics,...
DCD-SEMI Introduces eSPI Combo for Next-Generation Intel-Based Platforms
DCD‑SEMI announced the DESPI eSPI Combo, a unified controller‑and‑target IP solution for Enhanced Serial Peripheral Interface (eSPI) on Intel‑based platforms. The combo supports up to 66 MHz serial clocks across single, dual, and quad SPI links, replacing legacy LPC interfaces with...
Guerrilla RF Launches GRF2118 with Best-in-Class Noise Figure Across the SatCom X-Band Spectrum
Guerrilla RF unveiled the GRU2118, an ultra‑low‑noise X‑Band LNA covering 6.0‑8.5 GHz, aimed at satellite communications, defense, and space platforms. In low‑bias mode the device delivers a 0.57 dB noise figure with 25.5 dB gain, while high‑bias mode offers 0.67 dB NF, 26.1 dB gain,...
Imec Demonstrates the First 3D Implementation of a Charge Coupled Device for AI Memory Applications
Imec unveiled the first 3‑D charge‑coupled device (CCD) memory with an IGZO channel at the 2026 IEEE International Memory Workshop. The prototype uses a three‑word‑line stack and 80‑120 nm vertical holes, achieving charge‑transfer speeds above 4 MHz and moving a few thousand...
IC-Link by Imec Joins TSMC 3DFabric® Alliance to Accelerate Advanced Packaging and 3D IC Innovation
IC‑Link by imec has become a member of TSMC’s 3DFabric Alliance within the Open Innovation Platform, giving it direct access to TSMC’s 2.5D/3D silicon stacking and advanced packaging technologies such as SoIC, CoWoS and InFO. The partnership expands IC‑Link’s ASIC...
Canvys Expands 4K Display Platform for Medical Applications with New 32-Inch Monitor
Canvys, a division of Richardson Electronics, announced a new 32‑inch 4K monitor that extends its existing medical‑grade display platform. The Ultra HD screen offers 3840 × 2160 resolution, high color accuracy, and a True Flat, non‑reflective surface designed for easy cleaning. Built...
New Samtec SMA Interconnects Capable of 26.5 GHz
Samtec announced the production‑ready launch of a new SMA edge‑mount board connector that operates reliably up to 26.5 GHz with a 50 Ω impedance. The design terminates directly at the PCB edge, minimizing discontinuities and return loss compared with traditional vertical or...
Jama Software Launches Model Context Protocol (MCP) Server
Jama Software announced that its Jama Connect platform now includes a Model Context Protocol (MCP) server, the first engineering management solution to embed this capability. The MCP server lets engineers use AI tools such as Claude, Codex, and GitHub Copilot...
KYOCERA AVX Releases Multilayer Varistors Optimized for 48V Automotive Power Supply Systems
KYOCERA AVX has added high‑temperature, automotive‑grade multilayer varistors (MLVs) to its TransGuard® VT Series, specifically engineered for 48 V power‑supply systems used in modern vehicles. The new devices operate from –55 °C to +150 °C, meet AEC‑Q200, IEC 61000‑4‑2, ISO 10605, and VDA‑320 standards,...
Purdue Drone Initiatives Focus on the Future of Autonomy in the Sky
Purdue University is spearheading a multi‑disciplinary push into autonomous drones, blending AI, advanced computing and aerospace engineering. The school helped Indiana win an FAA‑designated unmanned aircraft systems test site and launched the Center on AI for Digital, Autonomous and Augmented...
TANAKA to Showcase Advanced Semiconductor Materials and Circular Economy Initiatives at SEMICON Southeast Asia 2026
TANAKA Precious Metal Technologies will exhibit at SEMICON Southeast Asia 2026 in Kuala Lumpur, showcasing a full suite of precious‑metal materials for semiconductor front‑end, packaging and testing, including bonding wires, silver sintering paste, AgSn TLP sheets, sputtering targets, probe pins,...
Infineon Provides MEMS Technology for Valeo’s Ground Projection Module Based on Laser Beam Scanning Presented at 2026 Auto Beijing
Infineon and Valeo unveiled a short‑distance ground projection module at Auto Beijing 2026, integrating Infineon’s 2D MEMS mirror and controller into Valeo’s high‑definition, bi‑color projector. The system delivers superior brightness, contrast and resolution for daytime visibility and is positioned for...
Himax to Showcase Industry-Leading High-Contrast Dual-Edge Front-Lit LCoS Microdisplay at SID Display Week 2026
Himax Technologies unveiled a next‑generation high‑contrast dual‑edge front‑lit LCoS microdisplay at SID Display Week 2026 in Los Angeles. The 0.09 c.c. device weighs just 0.2 g, delivers up to 350,000 nits brightness, 1 lumen at 200 mW, and features a 720×720 resolution. Proprietary material and...
Introspect Technology Adds New ATE-on-Bench Solution for LPDDR6, DDR6, and HBM Interfaces
Introspect Technology has begun shipping its M5504 High‑Speed Digital Test System, the latest addition to the M Series. The benchtop instrument combines Bit Error Rate Testing, Automatic Test Equipment and System‑Level testing to validate LPDDR6, DDR6 and HBM interfaces under...