EE Times Europe

EE Times Europe

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European chip and electronics news across power, automotive, embedded and wireless.

MIT Underwater Robot Teaming Targets Cable Inspection
NewsApr 14, 2026

MIT Underwater Robot Teaming Targets Cable Inspection

MIT Lincoln Laboratory is developing a human‑machine system that teams divers with autonomous underwater vehicles (AUVs) to inspect subsea power and telecom cables. The AUV maps the cable, pinpoints likely faults and guides the diver to the exact location, combining...

By EE Times Europe
SEALSQ and Kaynes Advance India’s PQC Chip Hub
NewsApr 14, 2026

SEALSQ and Kaynes Advance India’s PQC Chip Hub

SEALSQ announced a joint venture with Kaynes Semicon to open India’s first post‑quantum cryptography (PQC) personalization center inside Kaynes’s new OSAT plant in Sanand, Gujarat. The facility will assemble, test and cryptographically provision SEALSQ’s QS7001 microcontroller chips on‑site, eliminating the...

By EE Times Europe
Stryten Launches E-Series AGM Batteries for Telecom and Utility Reliability
NewsApr 13, 2026

Stryten Launches E-Series AGM Batteries for Telecom and Utility Reliability

Stryten Energy has launched the E‑Series AGM160 and AGM190 multi‑terminal batteries, targeting telecom and electric‑utility backup power. The sealed, maintenance‑free VRLA units can operate at up to 80% depth of discharge and charge rapidly, offering long discharge cycles for harsh...

By EE Times Europe
Pasqal Partners with True Nexus on Quantum Food Protein Design
NewsApr 10, 2026

Pasqal Partners with True Nexus on Quantum Food Protein Design

Quantum computing firm Pasqal has teamed up with computational‑intelligence specialist True Nexus to use Pasqal’s neutral‑atom quantum processors for protein modeling in alternative food systems. The partnership will develop the first fully vectorized, dynamic 3‑D model of protein gelation, integrating...

By EE Times Europe
The Race to Secure Data
NewsApr 10, 2026

The Race to Secure Data

Chip makers are racing to secure data both at rest and in motion as AI models expose software flaws faster than ever. Broadcom’s SecureHBA line now embeds post‑quantum cryptography on 64‑Gb/s Fibre Channel adapters and has taped out 128‑Gb/s silicon...

By EE Times Europe
Low-RDS(on) MOSFETs in Automotive Power Systems
NewsApr 10, 2026

Low-RDS(on) MOSFETs in Automotive Power Systems

STMicroelectronics has launched a new series of low‑RDS(on) MOSFETs built on its Smart STripFET F8 platform, beginning with the STL059N4S8AG – a 40 V, 420 A N‑channel device featuring a 0.59 mΩ on‑resistance and housed in a compact PowerFLAT 5×6 package. The technology reduces conduction...

By EE Times Europe
Eclipse hawkBit 1.0 Released for Open-Source IoT Software Updates
NewsApr 9, 2026

Eclipse hawkBit 1.0 Released for Open-Source IoT Software Updates

Eclipse Foundation announced the 1.0 release of hawkBit, its open‑source over‑the‑air (OTA) update platform for IoT devices. The milestone marks the project’s promotion to Mature status after years of development, 84 contributors, nearly 4,000 commits and 20 prior releases. hawkBit...

By EE Times Europe
Intel and SambaNova Target Agentic AI Inference with Xeon 6
NewsApr 9, 2026

Intel and SambaNova Target Agentic AI Inference with Xeon 6

Intel and SambaNova announced a heterogeneous inference architecture that pairs GPUs, SambaNova’s Reconfigurable Dataflow Units (RDUs) and the upcoming Xeon 6 processor. The design allocates prefill, decode and control tasks to the hardware best suited for each stage, aiming to boost...

By EE Times Europe
Vadzo Publishes GMSL Camera Guide for Embedded Vision
NewsApr 9, 2026

Vadzo Publishes GMSL Camera Guide for Embedded Vision

Vadzo Imaging has released a technical guide that demystifies Gigabit Multimedia Serial Link (GMSL) camera technology for engineers building embedded‑vision systems. The guide explains how GMSL’s serializer/deserializer architecture delivers uncompressed video over long cable runs with sub‑microsecond latency. It compares...

By EE Times Europe
ThunderX Uses SAFERTOS for Cockpit-ADAS Fusion
NewsApr 9, 2026

ThunderX Uses SAFERTOS for Cockpit-ADAS Fusion

ThunderX announced the integration of SAFERTOS, a pre‑certified real‑time operating system, into its next‑generation AI domain controller platforms built on Qualcomm SA8775P and SA8650P automotive SoCs. The safety‑focused RTOS will run in selected safety‑critical subsystems of the AIBOX family, supporting...

By EE Times Europe
Samtec Launches Upscreen Testing Service to Accelerate Mil/Aero Development
NewsApr 8, 2026

Samtec Launches Upscreen Testing Service to Accelerate Mil/Aero Development

Samtec has launched an in‑house Upscreen Testing service to certify commercial off‑the‑shelf interconnects for military and aerospace applications. The offering blends traditional Lot Screen Testing with a Qualification Conformance Inspection that adds shock, vibration, and extended life tests. Test data...

By EE Times Europe
EU Approves €144m French Hydrogen Project for Fertiliser Industry
NewsApr 8, 2026

EU Approves €144m French Hydrogen Project for Fertiliser Industry

The European Commission has cleared a €144 million ($155 million) state‑aid package for HyforSeeds to install a 50 MW renewable hydrogen electrolyser at LAT Nitrogen’s fertilizer plant in eastern France. The hydrogen will replace up to 15% of fossil‑based feedstock in ammonia production,...

By EE Times Europe
400kW EV Charger Supports Denser Charging Sites
NewsApr 8, 2026

400kW EV Charger Supports Denser Charging Sites

SK Signet has launched a 400 kW all‑in‑one ultra‑fast DC charger that integrates silicon‑carbide power modules and dispenser hardware in a single unit. The design achieves 96.5% power conversion efficiency while shrinking the installation footprint by 54% compared with its previous...

By EE Times Europe
Nanopower Moves nPZero IC Into Volume Production for Ultra-Low-Power IoT
NewsApr 7, 2026

Nanopower Moves nPZero IC Into Volume Production for Ultra-Low-Power IoT

Nanopower Semiconductor announced that its nPZero power‑saving IC has entered volume production, moving from evaluation kits to large‑scale deployment. The chip targets battery‑powered and energy‑harvesting IoT devices by handling sensor polling independently of the host MCU. By using user‑defined thresholds,...

By EE Times Europe