Incedo Targets AI Native Telecom Growth in Canada
Incedo announced a major expansion into Canada, targeting AI‑native telecom operations at the Canadian Telecom Summit 2026. The company will help operators replace legacy, manual workflows with autonomous, real‑time decision‑making platforms. New offerings include Proxima for churn prediction, Smart Network Change Management for zero‑touch upgrades, and an Agentic AI Operations suite that merges service assurance with cybersecurity. Incedo’s push aims to transform Canadian telcos from pure connectivity providers into revenue‑generating digital service businesses.
Red Hat AI and OpenShift Services Land on IBM Cloud
IBM announced two new managed services on its cloud platform: Red Hat AI Inference, a production‑grade, fully managed model‑serving offering, and Red Hat OpenShift Virtualization Service, which lets enterprises run VM workloads on OpenShift. Both services leverage Red Hat’s open...
Molex Teramount Deal Targets Co-Packaged Optics
Molex has completed its acquisition of Israeli silicon‑photonic packaging specialist Teramount for roughly $430 million, adding detachable fibre‑to‑chip connectivity to its portfolio. Teramount’s TeraVERSE platform uses passive‑alignment optics that can self‑align fibres to silicon chips within ±30 µm, enabling field‑serviceable co‑packaged optics...
NVIDIA and ServiceNow Extend AI Governance From Desktops to Data Centres
ServiceNow and NVIDIA announced an expanded partnership to govern autonomous AI agents from desktop to data‑center environments. The collaboration introduces Project Arc, a desktop‑based AI agent that can write code, execute tasks and adapt without pre‑built workflows, while operating under the...
Semiconductor Industry Heads for $1tn in 2026
The semiconductor market is on track to exceed $1 trillion in 2026, with Q1 sales reaching $298.5 billion—a 25% quarter‑on‑quarter jump. Forecasts from Future Horizons and IDC place 2026 revenue between $1.0 tn and $1.29 tn, while the most optimistic view sees $1.6 tn. Memory,...
Decoupled by Design: How Gateworks and NXP Are Rethinking Edge AI Architecture
Gateworks and NXP have launched the GW16168 M.2 AI accelerator, pairing NXP’s Ara240 discrete neural processing unit with a 16 GB LPDDR4‑backed card that delivers roughly 40 eTOPS at a typical 12 W power envelope. The decoupled architecture lets industrial single‑board computers...
GCT Taps Satellite Partner to Speed 5G Rollout
GCT Semiconductor has signed a reference platform agreement with a major satellite communications provider to speed the creation of 5G user equipment that works across satellite and terrestrial networks. The deal builds on an earlier chipset licensing pact and delivers...
SiTime Posts 88% Revenue Growth on AI Infrastructure Demand
SiTime reported first‑quarter 2026 revenue of $113.6 million, an 88.3% year‑over‑year increase driven by soaring demand for precision timing in AI data‑center and high‑performance computing systems. While the company posted a GAAP net loss of $5.2 million, non‑GAAP earnings surged to $38.9 million,...
Infrared LEDs Support In-Cabin Sensing for Vehicle Safety
ams OSRAM introduced its OSLON Black IR:6 C‑Series infrared LEDs, a 940 nm high‑power solution designed for camera‑based in‑cabin driver and occupant monitoring. The LEDs suppress the visible red‑glow effect, delivering low‑visibility illumination that works across changing lighting conditions. By targeting...
Quantum Brilliance CEO Mark Luo on Deployable Quantum Systems and the Future of Diamond-Based Computing
Quantum Brilliance, founded on the premise that synthetic‑diamond chips can run quantum operations at room temperature, has become a TIME Top 100 Invention of 2025. CEO Mark Luo says the company’s strategy—eschewing cryogenic systems, investing heavily in European manufacturing, and securing...
SEMI Summit Spotlights Europe’s Chiplet and Packaging Push
The SEMI 3D & Systems Summit will take place June 17‑19 in Dresden, putting Europe’s advanced packaging, chiplet ecosystems and heterogeneous integration front‑and‑center. Attendees—including chipmakers, equipment suppliers and research institutes—will debate AI hardware, hybrid bonding, co‑packaged optics and system‑level design....
AI Data Center Infrastructure Drives Pennsylvania Energy Expansion
AI workloads are driving a wave of dedicated energy projects as hyperscale operators seek reliable power for compute‑intensive tasks. UGI Energy Services and Prime Data Centers announced a partnership to build a natural‑gas pipeline and on‑site generation facility in Pennsylvania,...
NXP CoreRide Gains Vector Software Support for SDV Platforms
NXP’s CoreRide platform now includes Vector’s MICROSAR embedded software, creating a pre‑integrated solution for software‑defined vehicles (SDVs). The partnership delivers the CoreRide Z248 zonal reference system, combining real‑time compute hardware with Vector’s classic stack, configurator and system‑design tools. By aligning...
Elektor Lab Talk Covers Red Pitaya and Reconfigurable Test Gear
Elektor is hosting Red Pitaya’s Miha Gjura for Lab Talk #46 on May 13, 2026, to showcase reconfigurable test equipment and the STEMlab Gen 2 platform. The live session, normally a €25 ($27) ticket, is free thanks to eeNews Europe. The discussion will explore...
SEMI Names Julie Rogers to Lead ESD Alliance
SEMI has appointed Julie Rogers as Executive Director of the Electronic System Design Alliance (ESDA), succeeding Robert P. Smith after his 11‑year tenure. Rogers arrives with more than three decades of experience in technical marketing, ecosystem development, and conference leadership....
ASML CEO Backs Joint Call for Europe Tech Competitiveness Push
A coalition of Europe’s top technology CEOs, led by ASML’s Christophe Fouquet, issued a joint appeal for swift policy reforms to safeguard the continent’s tech competitiveness. The signatories—representing roughly €417 billion ($455 billion) in revenue, €1.1 trillion ($1.2 trillion) in market value, and over...
ROHM Targets Smart Rings with Ultra-Compact NFC Wireless Power Chipset
ROHM has introduced the ML7670/ML7671 NFC‑based wireless power chipset aimed at ultra‑compact wearables such as smart rings and bands. The solution delivers up to 250 mW at roughly 45 % efficiency while integrating the transmitter, receiver and firmware into a single 2.28 × 2.56 × 0.48 mm...
China Silicon Wafers Push Boosts Eswin Capacity
China has set an informal mandate for domestic silicon wafer suppliers to meet 70% of the 12‑inch wafer demand by 2026, intensifying its push to localise the semiconductor stack amid AI‑driven demand and U.S. export controls. Xi’an‑based Eswin Material Technology...
ESD Alliance Outlook Spotlights Agentic AI in Chip Design
The Electronic System Design Alliance’s 2026 Executive Outlook, slated for June 10 in San Jose, will put agentic AI at the center of the semiconductor conversation. Hosted at Cadence Design Systems headquarters, the event gathers leading EDA firms and AI‑focused startups...
AI Robotics Sales Growth Rises as Faraday Future Expands Into Education
Faraday Future reported that it shipped 68 AI‑powered robots by the end of April, adding 46 new units in that month and aiming to deliver 200 by the end of June. The company frames the growth as part of its...
Microchip Expands dsPIC33A Controllers for AI Data Center Power
Microchip has expanded its dsPIC33A family with the dsPIC33AK256MPS306 digital signal controller, targeting high‑density AI‑driven data‑center power, motor control and intelligent sensing. The part features a 200 MHz 32‑bit core, double‑precision FPU, 78 ps PWM, 40 MSPS 12‑bit ADCs and hardware‑accelerated post‑quantum cryptography....
SensiBel MEMS Microphone Heads to Silex Production
sensiBel announced a high‑volume manufacturing deal with Sweden’s Silex Microsystems, the pure‑play MEMS foundry, to produce its optical MEMS microphone. The microphone delivers an 80 dB signal‑to‑noise ratio, 146 dB SPL overload point and 132 dB dynamic range, aimed at conferencing, laptop, automotive...
SEMI: Global Silicon Wafer Shipments Jump 13% on AI Demand
Global silicon wafer shipments surged 13.1% year‑on‑year in Q1 2026, reaching 3,275 million square inches. The growth is driven primarily by AI‑related data‑center demand, spanning advanced logic, memory and power management devices. While industrial semiconductor segments helped absorb excess inventory, smartphone...
AI Drives Photonics Innovation
AI‑driven workloads are pushing data‑center interconnects toward photonics, with power and bandwidth becoming critical constraints. The pluggable optics market is forecast to reach $34 billion by 2030, growing at a 17% CAGR, while co‑packaged optics (CPO) is set to generate over...
Advantech Adds Intel Core Series 3 to Edge AI Systems
Advantech announced it will embed Intel’s Core Series 3 processors into its industrial embedded boards and edge AI systems, beginning with a lineup launching in April 2026. The hybrid six‑core silicon combines performance and efficient cores, an Xe3 GPU and Intel NPU 5.0,...
NI CHESS Enables Software-Driven RF Channel Emulation Into Aerospace Testing
Emerson has launched the NI Channel Emulator System Software (CHESS), a software‑driven RF channel emulation platform that works with NI PXI vector signal transceiver hardware. Presented at the 2026 Space Symposium, CHESS can replicate real‑time aerospace communication scenarios such as...
Forsee Power Battery System Powers New Electric Fire Pump
Forsee Power has delivered its GO 1.6 lithium‑ion battery system to Tohatsu for the VM130A electric portable fire pump, slated for launch later this year. The compact, modular pack, originally designed for light electric vehicles, now powers a critical emergency‑response tool...
Advantech Brings Agentic AI to Jetson Thor Edge Platforms
Advantech unveiled its MIC‑AI series, a family of edge platforms built on NVIDIA Jetson Thor modules that can run generative and agentic AI workloads directly in factories and autonomous machines. The lineup includes MIC‑743, MIC‑742, MIC‑741 systems and MIB‑741, MIB‑742...
Rohde & Schwarz Adds Pulsar Signal Simulation for LEO Navigation
Rohde & Schwarz has integrated Pulsar signal simulation into its SMBV100B and SMW200A vector signal generators, giving device makers a way to test receivers for Xona’s upcoming low‑Earth‑orbit (LEO) navigation service. The software option lets engineers validate compatibility before the...
UL Solutions Builds New Testing Lab in Germany
UL Solutions announced the construction of a new electromagnetic compatibility (EMC) and wireless testing laboratory in Neu‑Isenburg, Germany. The facility will accommodate large, complex connected systems across industrial, medical, automotive and consumer sectors. By offering local testing capabilities, UL aims...
Tower Semiconductor and Axiro Push High-Efficiency SiGe for Next-Gen Radar
Tower Semiconductor and Axiro Semiconductor have introduced a new family of silicon‑germanium (SiGe) beamforming ICs for Ku‑ and X‑band radar and satellite communications. The devices, now moving to volume production in Tower’s U.S. fabs, promise higher gain, linearity, output power...
Robotics Development Platform Links EBV Ecosystem for System Design
EBV Elektronik launched MOVE, a robotics development platform that aggregates processors, AI accelerators, sensors, motion control, connectivity, memory, power and display components into a single resource hub. The platform targets engineers designing next‑generation robots across industrial automation, logistics, healthcare, agriculture...
Satellite Connected Cattle Collars Expand Remote Ranching
Halter, a Colorado ag‑tech firm, has launched satellite‑connected cattle collars that link directly to Starlink, removing the need for cellular or on‑site radio infrastructure. The solar‑powered, GPS‑enabled devices enable virtual fencing across remote terrain, expanding the addressable U.S. beef cattle...
SK Hynix Begins Mass Production of 192GB AI Server Memory
SK hynix has entered mass production of a 192GB SOCAMM2 memory module built on its sixth‑generation 10nm‑class LPDDR5X process. The module, aimed at AI servers, delivers more than double the bandwidth of conventional RDIMMs while cutting power use by over...
2Trust.AI and Carahsoft Partner to Scale AI Governance for Public Sector
2Trust.AI has partnered with Carahsoft Technology Corp. to distribute its AI governance platform to U.S. federal, state and local agencies. The solution will be available through Carahsoft’s major procurement vehicles such as SEWP V, ITES‑SW2 and NASPO ValuePoint. It offers...
Musk Teams with Intel for Terafab Plans
Elon Musk announced a partnership with Intel to build a series of advanced semiconductor fabs, dubbed “Terafab,” aimed at delivering a terawatt of AI processing capacity per year within the next decade. The initial phase involves a $25 billion investment in...
Altilium EV Battery Recycling Expands with New Investment Round
Altilium, a UK‑based clean‑tech firm, has opened a new investment round on Republic Europe, bolstered by a £18.5 million UK government grant (about $23.5 million). The capital will expand the ACT3 recycling plant in Plymouth and fund a commercial‑scale facility in Teesside,...
Credo to Unveil AI Interconnect Solutions at TSMC 2026 Symposium
Credo Technology Group will unveil its new AI interconnect solutions at the TSMC 2026 Technology Symposium, starting April 22 in Santa Clara. The highlight is OmniConnect Weaver, featuring 112 Gbps VSR SerDes and a lightweight AXI framer, promising up to 10×...
Gartner Projects IT Spending at $6.31 Trillion in 2026 on AI Surge
Gartner forecasts worldwide IT spending to reach $6.31 trillion in 2026, a 13.5% year‑over‑year increase. Software outlays are set to rise 15.1% to $1.44 trillion, driven largely by generative AI, while data‑center systems are projected to jump 55.8% to nearly $788 billion. Investment...
Quectel Expands IoT Reach in Brazil with Vermont Partnership
Quectel Wireless Solutions has signed a partnership with Vermont Brasil to serve as its regional representative for the full range of wireless and antenna products in Brazil. The deal leverages Vermont's nationwide footprint and technical know‑how to provide design‑in assistance...
Autonomous Material Handling Stack Links Thoro and Orbbec
Thoro unveiled CoreFlex, a modular autonomy platform that pairs its software stack with Orbbec’s Gemini 336 3‑D cameras, enabling plug‑and‑play automation across pallet trucks, tuggers and other industrial vehicles. The infrastructure‑free system promises to cut integration cycles by using a...
OE-A Publishes 10th Edition of “Roadmap for Flexible and Printed Electronics”
The Organic and Printed Electronics Association (OE‑A) released the 10th edition of its “Roadmap for Flexible and Printed Electronics,” a 310‑page whitepaper that maps short‑, medium‑ and long‑term forecasts for technologies, applications and markets. More than 100 industry and research...
Infineon Joins European Quantum Pilot Lines for Quantum Chips
Infineon announced its participation in three of Europe’s six quantum pilot line projects—CHAMP-ION, SUPREME and SPINS—bringing semiconductor manufacturing expertise to the emerging quantum‑chip ecosystem. The pilot lines are designed to bridge the gap between laboratory prototypes and industrial‑scale production, offering...
Iran Network Backdoors Claim Hits Cisco, Juniper, Fortinet
Iran’s Ministry of ICT alleges that hidden U.S. access mechanisms caused Cisco, Juniper, Fortinet and MikroTik equipment to reboot and go offline during strikes on Isfahan Province. Tehran has not released forensic evidence, and ordinary power or hardware issues could...
CVD Equipment Advances SiC Cystal Growth with University Collaboration
CVD Equipment Corporation successfully grew a high‑quality single‑crystal 4H silicon carbide (SiC) boule using its Physical Vapor Transport (PVT) system, in partnership with Stony Brook University. The crystal was shown to be polytype‑free and to have a low defect density,...
EU Unlocks €63M to Accelerate AI in Health and Safety
The European Commission has announced €63.2 million (about $68 million) in new funding under the Digital Europe Programme to accelerate AI innovation in healthcare, digital skills and online safety. Approximately €9 million will support AI‑driven image screening in medical centres, while €24 million targets...
GTT Targets AI Networking Growth with 2026 Strategy
GTT Communications unveiled its 2026 strategy centered on AI‑driven networking, expanding its Envision platform and bolstering hybrid‑cloud and security services. The plan builds on 2025’s milestone of over 700 Tbps capacity and reach in more than 170 countries, positioning GTT as...
Race Rock Sign Clamp Gets TxDOT Approval
Race Rock has secured Texas Department of Transportation (TxDOT) approval for its new one‑piece sign clamp, engineered for triangular slip‑base sign systems on Texas highways. The clamp replaces traditional multi‑part or welded assemblies with a two‑bolt, single‑cast design that slides...
SEMI Forum Targets Europe’s Semiconductor Strategy
The SEMI Europe Policy Forum will convene in Brussels on June 3, 2026 to discuss Europe’s semiconductor strategy, with a focus on a proposed “Chips Act 2.0” that would close gaps in the current EU Chips Act. Policymakers, industry executives and technology...
Smartphone Memory Shortage to Cut 2026 Shipments: IDC
IDC projects a 12.9% plunge in global smartphone shipments for 2026, trimming volumes to 1.12 billion units – roughly 160 million fewer than the prior year and the lowest level in over a decade. The decline is driven by a structural memory...