Electronic Design

Electronic Design

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Design engineering news and analysis; regular semiconductor coverage.

The Human Side of MISRA C Compliance
NewsMay 18, 2026

The Human Side of MISRA C Compliance

The piece examines why MISRA C compliance often meets developer resistance and how to turn it into a productivity asset. It quantifies the effort increase—10‑15% for green‑field projects and 30‑35% for legacy code—while stressing that the real hurdle is cultural, not...

By Electronic Design
This Week in PowerBites: Grid-Scale Storage Boom, V2G Initiative, and APEC Standouts
NewsMay 13, 2026

This Week in PowerBites: Grid-Scale Storage Boom, V2G Initiative, and APEC Standouts

U.S. domestic production of grid‑scale battery storage now satisfies the entire renewable generation capacity demand, positioning storage to provide about 28% of new U.S. power capacity. California’s Energy Commission released a roadmap detailing technical, economic and regulatory actions needed to...

By Electronic Design
Applying Edge AI to DC Arc Fault Detection (Part 1)
NewsMay 13, 2026

Applying Edge AI to DC Arc Fault Detection (Part 1)

Edge artificial intelligence is being applied to detect DC series arc faults in power systems such as solar inverters, EV chargers, and battery packs. By running convolutional neural networks on microcontroller units, manufacturers can recognize high‑frequency arc signatures locally within...

By Electronic Design
Flyback ICs Extend Operating Power to 440 W
NewsMay 13, 2026

Flyback ICs Extend Operating Power to 440 W

Power Integrations has launched the TOPSwitchGaN family, extending flyback converter capability to 440 W. The new ICs combine PowiGaN switches with TOPSwitch architecture, delivering up to 92% efficiency and eliminating the need for heatsinks in many applications. Operating at up to...

By Electronic Design
Multilayer Device Delivers Solar and Raindrop Energy Harvesting
NewsMay 12, 2026

Multilayer Device Delivers Solar and Raindrop Energy Harvesting

Researchers at Spain’s Institute of Materials Science of Seville have unveiled a multilayer device that merges perovskite solar cells with a drop‑driven triboelectric nanogenerator. A fluorinated polymer (CFₓ) coating protects the perovskite layer, offers >90% optical transparency, and serves as...

By Electronic Design
APEC 2026 Multimedia Highlights: Bidirectional GaN, Multichip Modules, and Mini Regulators
NewsMay 11, 2026

APEC 2026 Multimedia Highlights: Bidirectional GaN, Multichip Modules, and Mini Regulators

Renesas showcased a 500‑W single‑stage solar micro‑inverter built around its new 650‑V bidirectional GaN switch, promising higher efficiency and simpler topology. Texas Instruments introduced IsoShield‑based isolated power modules that claim three‑times the power density of traditional discrete solutions. Ferric presented...

By Electronic Design
Accelerating Semiconductor/Electronic Systems with Comprehensive AI Digital Twins
NewsMay 11, 2026

Accelerating Semiconductor/Electronic Systems with Comprehensive AI Digital Twins

Siemens EDA’s Vice President of Strategy, Craig Johnson, says AI‑powered comprehensive digital twins can halve semiconductor design cycles, shrinking development from 18‑36 months to 12‑18 months. The approach ties software‑defined design to hardware early, enabling multi‑domain engineering that merges mechanical,...

By Electronic Design
APEC 2026 Embraces the International Power Community
NewsMay 11, 2026

APEC 2026 Embraces the International Power Community

The IEEE Applied Power Electronics Conference (APEC) convened in San Antonio, Texas, drawing a record 5,452 registrants and 319 exhibitors. Over 571 technical papers were presented across 71 sessions, while student participation surged to 655, up from 447 the prior...

By Electronic Design
AI and NI Connect 2026
NewsMay 11, 2026

AI and NI Connect 2026

At NI Connect 2026 in Fort Worth, Emerson unveiled Nigel, a LabVIEW‑specific generative‑AI chatbot trained on the company’s own documentation. The new version adds graphical code‑completion, aiming to reduce hallucinations and speed VI development. The conference also featured Archer Aviation’s...

By Electronic Design
Integrated Voltage Regulators Help Pull Heat Out of Processors
NewsMay 7, 2026

Integrated Voltage Regulators Help Pull Heat Out of Processors

AI accelerators in data centers are moving power conversion beneath the processor to cut parasitic losses and improve transient response. Empower Semiconductor’s Crescendo integrated voltage regulator (IVR) packs the converter, inductors and capacitors into an ultra‑thin chip, offering up to...

By Electronic Design
Sensors Converge 2026
NewsMay 6, 2026

Sensors Converge 2026

Sensors Converge 2026 highlighted a surge of AI‑enabled sensor solutions and power‑efficiency breakthroughs. The conference underscored how AI workloads are straining electrical networks, prompting vendors to showcase programmable metasurface optical switches as a scalable fix. Notable product announcements included Posifa Technologies’...

By Electronic Design
Why Optical Circuit Switching Is Becoming Essential for AI Data Centers
NewsMay 6, 2026

Why Optical Circuit Switching Is Becoming Essential for AI Data Centers

Optical circuit switching (OCS) is emerging as a core architecture for AI data centers as GPU clusters grow to tens of thousands of units. By establishing dedicated light paths, OCS removes per‑packet inspection, cutting latency and energy per bit. Recent...

By Electronic Design
Rethinking Display Design for Modern Engineering Workflows
NewsMay 5, 2026

Rethinking Display Design for Modern Engineering Workflows

Engineering teams are moving from isolated monitors to AI‑driven visual ecosystems that act as central orchestration hubs. Modern displays now embed device recognition, seamless input handoff, and synchronized multi‑screen windowing to cut context‑switching. At the same time, manufacturers are adding...

By Electronic Design
Waterproof USB-C Connectors Expand Application Arena
NewsMay 5, 2026

Waterproof USB-C Connectors Expand Application Arena

Same Sky (formerly CUI Devices) has released the UJ family of waterproof USB‑C receptacles covering IPX5 through IP68 ratings. The connectors support USB 2.0 up to USB 4.0 Gen 3×2, delivering up to 40 Gb/s data rates and 240 W power delivery at 48 V/5 A. Designed with...

By Electronic Design
Electronic Design | Pulse