AMC Bridge Demos MCP Connector for BIM Workflows
AMC Bridge demonstrated a Model Context Protocol (MCP) connector that links Autodesk Platform Services with Procore, using AI‑driven natural language to streamline BIM‑to‑field workflows. The proof‑of‑concept enables conversational queries of 3‑D models, automatic quantity‑to‑cost‑code synchronization, and contextual linking of field data such as photos and logs. By replacing rigid point‑to‑point scripts with adaptive, context‑aware orchestration, the solution promises faster design‑to‑execution turnover and fewer data silos. The demo positions MCP as a scalable, open‑standard foundation for broader AEC interoperability.
Nota AI and SiMa.ai Partner on Edge Physical AI
Nota AI and SiMa.ai have formed a strategic partnership to accelerate physical AI at the edge, combining Nota AI's NetsPresso model‑compression SDK with SiMa.ai's high‑performance Modalix MLSoC and Palette SDK. The collaboration will jointly develop and commercialize on‑device AI solutions,...
NVIDIA Releases Dynamo 1.0 for AI Inference
NVIDIA unveiled Dynamo 1.0, an open‑source software platform that acts as a distributed operating system for AI inference workloads. Paired with the new Blackwell GPU architecture, Dynamo can accelerate generative and agentic inference up to seven times, improving token efficiency...
Cadence Expands AI Design Collaboration with NVIDIA
Cadence announced an expanded partnership with NVIDIA, integrating Grace CPUs and Blackwell GPUs into its design‑automation portfolio. The new Millennium M2000 supercomputer promises up to 80× higher throughput and 20× lower power consumption, with solvers like Clarity 3D running five...
Procore Integrates with NVIDIA Omniverse DSX
Procore Technologies announced an integration of its construction management platform with NVIDIA’s Omniverse DSX Blueprint, creating a live, high‑fidelity digital twin for AI factories and other critical infrastructure. The solution automatically translates more than 15 BIM and CAD formats into...
EmbedUR Expands Arm Support in Fusion Studio
embedUR Systems announced a major expansion of Arm ecosystem support in its ModelNova Fusion Studio desktop application at Embedded World 2026. The update introduces native ExecuTorch integration for Ethos‑U85 and U55 NPUs, seamless deployment to Alif Ensemble development kits, and...
Additive Business Update: 3D Systems, Materialise, Stratasys, and More
3D Systems reported a 12% YoY revenue decline for 2025, with healthcare down 5% and industrial solutions down 17%, though adjusted figures show a smaller dip after the Geomagic divestiture. The company confirmed Phyllis Nordstrom as permanent CFO while highlighting...
Trimble and Hitachi Expand Grade Control in Europe
Trimble and Hitachi Construction Machinery Europe have deepened their partnership to ship Hitachi excavators equipped with Trimble Earthworks 3D grade‑control as a factory‑installed option. The collaboration also adds Trimble WorksManager software, linking field machines with office project data. European customers will...
Moldex3D Releases 2026 Version with A.O.I. Updates
Moldex3D launched its 2026 release, embedding an Automation, Optimization, and Intelligence (A.O.I.) framework to accelerate digital transformation in mold design. The update revamps solver architecture for stable hot‑runner pressure prediction and delivers over four‑times faster multi‑cavity analysis via partial runner...
Improve Speed, Cost and Quality Through Cloud PLM
Autodesk promotes its cloud‑based PLM solution, Fusion Manage, as a way to eliminate data silos and accelerate product development. The platform provides a single real‑time system of record for BOMs, change management, quality and supplier collaboration. Early adopters report up...
Scanology Launches SIMSCAN-S Gen2 Wireless 3D Scanner
Scanology unveiled the SIMSCAN‑S Gen2, a palm‑sized wireless 3D scanner aimed at manufacturers needing micron‑level inspection. The device delivers metrology‑grade accuracy of up to 0.015 mm and captures up to 8.1 million measurements per second at 180 FPS. Weighing only 560 g, its magnesium‑alloy...
Raytron Debuts Three Thermal Imaging Modules at MWC
Raytron Microelectronics unveiled three thermal imaging modules—WN2T, DVS256, and ECOT—at MWC Barcelona 2026. The WN2T adds high‑resolution, real‑time temperature overlay for predictive maintenance and drone inspections. DVS256 merges infrared and visible imaging for consumer handheld cameras and smartphone accessories. ECOT...
Infineon Partners with Zenergize on India Power Tech
Infineon Technologies has formed a strategic technology partnership with Indian power‑electronics firm Zenergize, announced at the Bharat Electricity Summit 2026. Infineon will supply its wide‑bandgap silicon‑carbide (SiC) semiconductors and engineering support to integrate them into solar inverters, EV chargers and...
HyperDock Simulator Combines Vehicle Dynamics with NVH
VI‑grade unveiled its HyperDock cockpit at Multimatic’s Vehicle Dynamics Center in Novi, Michigan, marking the first North American deployment of the full‑spectrum simulator. The system adds high‑frequency vibration and noise (NVH) reproduction to existing motion platforms, covering a 0‑20,000 Hz bandwidth....
Siemens Expands Data Center Ecosystem for AI Power Needs
Siemens Smart Infrastructure is broadening its data‑center ecosystem by investing in Emerald AI, adding Fluence grid‑scale battery storage, and integrating PhysicsX physics‑based AI modeling. The combined solution lets operators shift AI workloads according to grid conditions, use on‑site storage to...
Cyngn Brings Autonomous Forklift Models Into Isaac Sim
Cyngn announced that its high‑fidelity autonomous forklift models are now integrated into NVIDIA’s Isaac Sim, an open‑source simulation platform for autonomous systems. The models, exported as Functional Mock‑up Units, exchange two‑way data with Isaac Sim’s virtual surfaces, mirroring real‑world dynamics....
NVIDIA Expands Open AI Models for Agents, Robotics and Science
NVIDIA announced an expanded suite of open‑source foundation models targeting agentic AI, physical robotics, and life‑science research. The Nemotron 3 family now includes Ultra, Omni, and VoiceChat variants that combine language, vision, and audio for advanced AI assistants, while Cosmos,...
TransTech Acquires Stake in Teknoflow, Enters India Market
TransTech Group announced a controlling‑interest acquisition of Teknoflow Green Equipments, establishing its first manufacturing platform in India. Teknoflow, a Nashik‑based engineered fabrication firm, adds 180,000 square feet of capacity and a portfolio of ASME‑coded pressure vessels, heat exchangers and modular...
Vertiv Supports NVIDIA DSX AI Factory Infrastructure Design
Vertiv announced its role in designing converged physical infrastructure for NVIDIA's Vera Rubin DSX AI factory reference design and the Omniverse DSX Blueprint. The OneCore Rubin DSX model is simulation‑ready, providing digital power, cooling assets, validated interfaces and repeatable building...
Atom Computing Integrates NVQLink Into Quantum Systems
Atom Computing announced that it has successfully integrated NVIDIA’s NVQLink, a low‑latency, high‑bandwidth communication interface, into its proprietary quantum control‑systems stack. The integration delivers ultra‑low latency pathways that accelerate logical‑qubit cycle speeds and support scaling to thousands of qubits. Validation...
IWT Expands Use of Aras Innovator PLM Platform
IWT has broadened its reliance on Aras Innovator, turning a CAD‑centric PLM into an enterprise‑wide product data platform. Since the 2019 go‑live, the system now supports engineering, project, spare‑parts, and quotation processes, with 80% of staff using it as their...
HyperLight Releases 400G-per-Lane TFLN Photonic ICs
HyperLight Corporation has launched a new family of 400‑gigabit‑per‑lane thin‑film lithium niobate (TFLN) photonic integrated circuits. The PICs deliver low insertion loss, low drive voltage, and ultra‑wide electro‑optic bandwidth, enabling energy‑efficient 400G optical links for AI‑focused networking. Built on HyperLight’s...
Hitachi Unveils 800 VDC Architecture for AI Data Centers
Hitachi announced an 800‑volt DC (800 VDC) power and control architecture, fully integrated into the Vera Rubin DSX reference design and compatible with NVIDIA Omniverse DSX Blueprint. The solution uses an OpenUSD‑based 3D simulation that mirrors the entire electrical chain from...
Nvidia Is Absolutely Everywhere in Engineering Software
Nvidia’s GTC 2026 highlighted a sweeping AI push across engineering software, cementing partnerships with industry leaders such as Dassault Systèmes, Siemens, Synopsys, Cadence and PTC. At the event, PTC unveiled a workflow that syncs its Onshape cloud CAD with Nvidia...
Great Expectations for AMUG 2026
The Additive Manufacturing Users Group (AMUG) 2026 conference returns with a lineup that underscores collaboration and scale in 3D printing. Highlights include a joint automotive‑defense keynote featuring General Atomics and Divergent Technologies, and a LEGO Group case study on high‑volume,...
Pete Pharma Partners with Atrium24 on Pharmacy 3D Printing
Pete Pharma has entered a strategic partnership with Atrium24 Technologies, designating Pete Pharma as the primary 3D‑printing provider within Atrium24’s group‑ purchasing organization. The deal gives Atrium24‑member independent pharmacies preferred pricing on Pete Pharma’s FABRx 3D‑printing platform, enabling on‑site production...
SME PRIME Program Expands to South Carolina Tech Center
The SME Education Foundation is launching its SME PRIME program at Daniel Morgan Technology Center in Spartanburg, South Carolina for the 2026‑2027 school year. SME PRIME delivers industry‑driven curricula, equipment, teacher training, scholarships and extracurricular funding to high schools, aligning...
Micron Completes PSMC Tongluo Fab Site Acquisition
Micron Technology has finalized the purchase of Powerchip Semiconductor Manufacturing Corporation’s P5 fab in Tongluo, Taiwan, adding roughly 300,000 square feet of 300mm cleanroom capacity. The site sits about 15 miles from Micron’s existing Taichung mega‑campus and will be retrofitted...
DCX Launches ECDU Liquid Cooling Systems up to 2.6 MW
DCX introduced its Enterprise Coolant Distribution Unit (ECDU) family, offering three liquid‑cooling models that span 600 kW to 2.6 MW of real‑world capacity in standard rack and in‑row footprints. The flagship 1380/2600 units deliver up to 3,333 lpm flow and support over 100...
Zuken Releases Harness Builder 2026 for Harness Manufacturing
Zuken USA launched Harness Builder 2026, its newest wire‑harness manufacturing suite, adding live cost estimation, enhanced BOM management, and shop‑floor documentation tools. The Cost Estimator now pulls real‑time pricing and availability from TrustedParts.com, while DS‑E3 integration centralises production BOM data...
Tencent Cloud Supports Iyzico European Cloud Platform Launch
At Mobile World Congress 2026, Tencent Cloud announced a partnership with Turkish fintech iyzico to launch its first European cloud‑based production platform, hosted on Tencent’s IaaS in Frankfurt. The deployment meets strict financial‑services regulations, delivering high‑availability, low‑latency payment processing across...
ASRock Industrial Controller Wins Embedded World Award
ASRock Industrial’s iEP‑5010G‑DCN industrial controller captured the Best in Show award at Embedded World 2026. The fanless unit, powered by an Intel Atom x6425RE, operates from –40 °C to 70 °C and up to 3,000 m altitude. It carries ATEX Zone 2, IECEx and UL C1D2 certifications plus...
Opinion: AI Agents Are Stepping up for Engineering Simulation
Engineering simulation adoption of AI has lagged due to demands for accuracy, transparency, and control. Dr. Steven Lainé argues that agentic AI, when designed as transparent collaborators, can automate repetitive setup tasks and accelerate design exploration. By embedding auditability and...
New Insights Into Battery Failure
Engineers at NJIT and partners in the U.S. and Singapore have shown that lithium dendrites inside batteries are not soft but brittle, snapping like dry spaghetti. The team harvested dendrites from operating cells, measured their mechanical strength, and paired the...
Synopsys Updates Hardware-Assisted Verification Portfolio
Synopsys unveiled a refreshed hardware‑assisted verification (HAV) portfolio that adds new HAPS‑200 and ZeBu‑200 FPGA platforms and a suite of software‑defined enhancements. The 12‑FPGA systems double capacity over prior 6‑FPGA offerings and target data‑center AI training, inference, GPUs, and edge...
Nordic Expands Edge AI Portfolio with NPU-Enabled SoC
Nordic Semiconductor unveiled its first Neural Processing Unit (NPU) enabled system‑on‑chip, the nRF54LM20B, expanding its ultra‑low‑power edge AI portfolio. The integrated NPU accelerates TensorFlow Lite models up to 15 times faster than the Cortex CPU and delivers up to sevenfold...
Congatec Expands Ryzen AI Embedded COM Express Modules
congatec announced six new variants of its Ryzen AI Embedded P100 Series COM Express 3.1 Type 6 Compact modules, expanding core counts from four to twelve and graphics units from two to sixteen. The modules leverage 4‑nm Zen 5/5c CPUs, RDNA 3.5 GPUs...
ASRock Industrial Expands Motherboard Lineup for AMD CPUs
ASRock Industrial unveiled a new line of industrial motherboards that support AMD EPYC 4005/4004 and Ryzen 9000/8000/7000 series processors. The portfolio spans ATX (IMB‑A1700), Micro‑ATX (IMB‑A1302) and Mini‑ITX (IMB‑A1002/ A1003) platforms, each featuring DDR5 memory, PCIe Gen5 expansion, and multi‑display...
Synopsys Launches Electronics Digital Twins for Software-Defined Vehicles
Synopsys unveiled its Electronics Digital Twin (eDT) Platform, a cloud‑based, open ecosystem that lets engineers create, deploy and manage digital twins of electronic systems. The platform is aimed at the automotive sector, promising up to 90% of software validation before...
ABB Plans $75 Million Manufacturing Expansion in India
ABB will invest roughly $75 million in 2026 to expand its Indian manufacturing and R&D footprint, adding to more than $35 million already committed for 2025. The expansion spans Bengaluru, Hyderabad, Nashik and Vadodara and targets its Electrification, Motion and...
EVOLVE Fabrication Links BIM Models to Shop Equipment
EVOLVE announced EVOLVE Fabrication, software that links BIM data from Revit and EVOLVE Electrical directly to shop‑floor CNC benders and printers. The platform automates conversion of conduit bend schedules into machine‑ready files, applying spring‑back and elongation corrections. By unifying modeling,...
Additive Aerospace Update: GE Aerospace, Rocket Lab, Velo3D, and More
Additive manufacturing is gaining momentum in aerospace and defense, with 41% of industry leaders forecasting a rapid acceleration this year. GE Aerospace announced a $1 billion U.S. investment, including a $115 million spend to expand 3D metal‑printing capacity at its Cincinnati hub...
Are You Struggling with Implementing Data Pipelines?
Implementing data pipelines is essential for digital transformation and AI, yet teams repeatedly encounter vague requirements, poor data quality, scalability bottlenecks, orchestration complexity, and monitoring gaps. These challenges cause costly rework, downstream errors, and performance degradation. Solutions include detailed requirement...
Molex Introduces 145 GHz Multi-Port Coaxial Assemblies
Molex has launched the Cardinal Multi-Port High-Frequency Coaxial Assemblies, extending its test‑and‑measurement portfolio to 145 GHz. The new modules deliver phase‑matched connectivity and support data rates up to 448 Gbps, targeting AI back‑haul, 5G/6G, mmWave radar and terahertz imaging. Multi‑port configurations (1×4,...
Mastercam Completes Acquisition of In-House Solutions
Mastercam has completed the acquisition of longtime channel partner In‑House Solutions, rebranding the business as Mastercam Canada. The deal shifts Mastercam from a reseller model to direct sales, training, and technical support across the Canadian manufacturing sector. By combining In‑House...
Tencent Cloud, Maxon Partner to Add AI to Cinema 4D
At Mobile World Congress 2026, Tencent Cloud announced a partnership with Maxon to embed its generative AI model, HY 3D Global, into Cinema 4D on iPad and desktop. The integration will deliver API‑based high‑quality 3D model generation, enhancing speed, reliability and creative flexibility...
Siemens Expands Circuit Protection, Introduces Refurbished Starter
Siemens Smart Infrastructure has broadened its industrial control lineup by enhancing the semiconductor‑based SENTRON Electronic Circuit Protection Device (ECPD) and launching the SIRIUS 3RW5‑Z R11 refurbished soft starter, its first product built on circular‑economy principles. The upgraded SENTRON ECPD now...
InnovMetric Integrates FARO Creaform Scanners in PolyWorks
InnovMetric announced that FARO Creaform’s auto‑referencing multi‑line 3D scanners are now natively integrated into PolyWorks|Inspector. The integration enables real‑time scan visualization, automatic scan‑to‑CAD alignment and built‑in dimensional analysis directly within the inspection software. It was driven by OEM feedback seeking to...
Trimble and Hyundai Enable Upgrade to Earthworks 3D Platform
Trimble and Hyundai announced a partnership that lets civil contractors upgrade Hyundai excavators from the factory‑installed 2D grade‑control system to Trimble’s Earthworks 3D platform. The aftermarket upgrade adds the “autos” mode, where the system automatically controls boom and bucket while...
AFM Capital Acquires Majority Stake in Incodema3D
AFM Capital Partners announced it has acquired a majority ownership stake in Incodema3D Holdings, a leading North American metal additive manufacturing firm. The deal leaves CEO Sean Whittaker and senior leaders with significant equity, allowing them to continue running the...
