PATEO Expands Vehicle AI with New Computing Platform
PATEO announced deep collaborations with NVIDIA and a leading NEV OEM to bring on‑vehicle large AI models to mass production. The company will use NVIDIA’s DRIVE AGX Thor platform to power its AI Box, enabling Level 3/4 autonomous driving workloads. It also received a nomination from the NEV OEM for a first‑of‑its‑kind integrated hardware‑software AI box that couples ByteDance’s general model with PATEO’s edge model. The move positions PATEO to capture the emerging vehicle‑side computing market and explore token‑based billing models.
Vertiv Acquires Thermal Specialist for Liquid Cooling
Vertiv announced the acquisition of Strategic Thermal Labs LLC, a specialist in advanced liquid‑cooling and cold‑plate design. The deal bolsters Vertiv’s thermal‑chain strategy, adding simulation and high‑density validation expertise for AI and high‑performance computing workloads. Vertiv says the purchase will...
These Are the Top Workplaces for Engineers in 2026
Engineering.com teamed up with Energage to publish the 2026 Top Workplaces for Engineers, spotlighting 93 companies that excel in supporting engineers' well‑being and career growth. Winners span large (500+ employees), midsize (150‑499) and small (35‑149) firms, each employing at least...
Pete Pharma Partners with Fagron to Scale Pharma 3D Printing
Pete Pharma has entered a strategic partnership with Fagron, appointing the compounding specialist as the exclusive reseller of its 3D‑printing platform across the United States and Canada. The deal combines Pete Pharma’s FABRx/M3DIMAKER hardware and software with Fagron’s extensive distribution...
Autodesk Nominates Omar Abbosh to Board of Directors
Autodesk announced the nomination of Omar Abbosh, CEO of Pearson and former Microsoft and Accenture executive, as an independent director to be elected at its upcoming annual meeting. At the same time, Stephen Milligan disclosed he will not seek re‑election,...
Roland DG Updates Connect Designer and VersaWorks 7
Roland DG announced upgrades to its software suite, expanding the cloud‑based Connect Designer with an Object Decoration Module, Visual Communication enhancements, and an AI Image Generation add‑on, while VersaWorks 7 RIP now includes the ColorMatch feature for consistent color across...
WeRide Expands WRD 3.0 Across Multiple Chip Platforms
WeRide announced that its WRD 3.0 advanced driver assistance system is now compatible with multiple chip platforms, including NVIDIA DRIVE, Qualcomm Snapdragon and SiEngine’s StarLight AD1000. The expansion enables automakers to deploy L2++ ADAS across a range of computing power—from...
The Future of Additive Manufacturing in Defense
Stratasys has entered the U.S. Department of War’s Joint Additive Manufacturing Acceptability (JAMA) IV pilot, aiming to speed qualification of 3D‑printed parts for defense. The Defense Logistics Agency currently fulfills only about 50% of its demand, leaving a roughly $20 billion...
Aitech Launches Rugged SBCs for Military, Aerospace AI
Aitech unveiled two rugged single‑board computers, the U‑C8600 and U‑C8601, built on Intel’s 14th‑generation Core Ultra platform. The boards combine a multi‑core x86 CPU, integrated GPU and a neural processing unit, delivering roughly 2.5× CPU and 2× GPU performance over...
Concepts NREC Names Innovalues Labs ASEAN Reseller
Concepts NREC has appointed Innovalues Labs Pvt Ltd as its exclusive reseller for the full suite of turbomachinery software across India and the ASEAN region. The partnership covers local support, demonstrations, training, and engineering services for the Agile Engineering Design...
Woolpert Acquires UMC Architects in U.K. Expansion
Woolpert has acquired U.K.-based UMC Architects, adding over 90 designers and expanding its European workforce to more than 600 employees. UMC brings expertise in industrial, logistics, entertainment and large‑scale redevelopment projects for clients such as Amazon, DHL, Ikea, Coca‑Cola and...
DuPont Launches AI Tool for Reverse Osmosis Operations
DuPont Water Solutions introduced the RO Operations Advisor, an AI‑enabled digital platform that analyzes historical plant data to recommend optimal cleaning and membrane‑replacement schedules for reverse osmosis systems. By delivering system‑specific guidance, the tool aims to cut downtime, extend membrane...
Hexagon Adds Automated Inspection Features to ATS800
Hexagon’s Manufacturing Intelligence unit has upgraded the Leica Absolute Tracker ATS800 with AI‑driven FeatureDetect and automatic PowerLock capabilities, turning the handheld laser tracker into a semi‑automated inspection tool for aerospace, shipbuilding and wind‑turbine production. The portable device scans up to...
EVOLVE Launches Analytics Platform for BIM Performance
EVOLVE has introduced EVOLVE Professional, an analytics platform that converts BIM data into real‑time performance insights for trade contractors. The solution pulls material quantities, modeling activity and change history directly from Revit, delivering productivity trends, risk indicators and forecasting data....
SHINING 3D’s FreeScan Omni Receives Red Dot Award 2026 Recognition
SHINING 3D’s FreeScan Omni, a standalone metrology 3D scanner, earned the 2026 Red Dot Award for industrial design. The device delivers 0.02 mm accuracy, validated by VDI/VDE 2634 and ISO 10360 standards, while offering onboard computing and cable‑free operation. Its AI‑driven feature recognition and video...
STL Launches Neuralis Data Center Connectivity Suite
STL Optical Connectivity NA, the U.S. arm of Sterlite Technologies, unveiled its Neuralis data‑center connectivity suite at Data Center World 2026 in Washington, D.C. Neuralis combines ultra‑high‑density MMC and MPO cabling with the Celesta IBR series, which can house up...
Cadence Expands TSMC Collaboration for AI Chip Design
Cadence announced an expanded partnership with TSMC to deliver AI‑ready IP, signoff‑ready design infrastructure, and certified end‑to‑end EDA flows for the foundry’s N3, N2, A16 and A14 processes. The collaboration adds DDR5, PCIe 6.0, LPDDR6/5X, and HBM4E IP to Cadence’s portfolio...
Hexagon, Schaeffler Expand AEON Robot Partnership
Hexagon Robotics and Schaeffler have expanded their strategic partnership to scale the AEON humanoid robot across global factories. After a successful joint pilot in 2025, Schaeffler plans to deploy at least 1,000 AEON units by 2032, using its high‑precision actuators....
Autodesk Announces Fusion MCP Servers and More AI Updates
Autodesk announced that its AI‑powered Autodesk Assistant is now live across Fusion, Inventor, Moldflow and Vault, expanding from a simple chatbot to a task‑orchestrating tool. The company also launched AI rendering in Fusion, granting commercial subscribers 20 photorealistic image generations...
Hexagon Launches QUINDOS 2026.1 with CMM Updates
Hexagon’s Manufacturing Intelligence division unveiled QUINDOS 2026.1, its latest metrology platform for special geometries. The update introduces CMM Check 3.0‑compliant machine monitoring, simplified high‑speed scanning, and CAD‑driven rotary‑table programming that consolidates multi‑axis point generation. New gear‑inspection modules add Hirth serration...
FANUC Adds CRX-3iA Cobot for High-Mix Automation
FANUC America has launched the CRX-3iA, an 11 kg collaborative robot designed for rapid redeployment in high‑mix, low‑volume tasks such as welding, assembly and inspection. The cobot offers a 3 kg payload, 692 mm reach and flexible mounting options, allowing one‑person transport to...
Dassault Systèmes and OMRON Partner on IT/OT
Dassault Systèmes and OMRON have teamed up to merge information technology with operational technology, creating a unified platform that links 3D design, simulation and real‑world automation. The partnership combines Dassault’s 3DEXPERIENCE suite with OMRON’s Sysmac industrial automation system to deliver...
SME Names CoorsTek Training Award Recipient
SME has awarded CoorsTek the 2026 Excellence in Manufacturing Training Award, recognizing its robust workforce development program. The company’s CoorsTek Academy delivers structured onboarding, technical training, and career pathways for new hires. A Train‑the‑Trainer model certifies employees as on‑site instructors,...
Scale Adds VMware Migration Path for Dell VxRail
Scale Computing announced a migration pathway that lets organizations replace VMware on Dell VxRail appliances with the Scale HyperCore virtualization suite. The program lets customers repurpose existing VxRail hardware as standard PowerEdge servers, avoiding costly hardware refreshes and VMware licensing...
33DPQ – Pavan Muzumdar
Engineering.com launched the 33DPQ podcast, a concise weekly series that interviews industry leaders on additive manufacturing. The first episode features Pavan Muzumdar, COO of Automation Alley and CEO of Project Diamond, discussing why 3D printing remains confined to prototyping and...
The Disintermediation Paradox
Artificial intelligence is rapidly being embedded into product lifecycle management (PLM) tools, shifting vendors from traditional seat‑based licensing to usage‑or result‑based models. Leading providers such as Siemens, Dassault Systèmes, PTC, SAP and Aras are integrating AI via platforms like Nvidia...
Bambu Lab Launches X2D Dual-Extrusion 3D Printer
Bambu Lab unveiled the X2D, a dual‑extrusion desktop 3D printer starting at $649. The machine features an enclosed, temperature‑controlled chamber, 31 sensors, and a three‑stage HEPA filtration system to ensure consistent print quality. Automatic calibration runs before each job, while...
ENCY Software Releases Version 2.8 of CAD/CAM System
ENCY Software announced the release of ENCY CAD/CAM version 2.8, bringing faster toolpath calculations, enhanced simulation controls, and a suite of usability upgrades. The update lets users independently set background simulation depth and collision detection levels, while multithreaded rotary machining...
Agibot Introduces Five Robotic Platforms and Eight AI Models
AGIBOT unveiled five new robotic platforms and eight AI models at its 2026 Partner Conference, built on its “One Robotic Body, Three Intelligences” architecture. The lineup includes the A3 humanoid, G2 Air mobile manipulator, OmniHand 3 Ultra‑T dexterous hand, D2...
Siemens and Vulcan Partner on German Lithium Energy Project
Siemens and Vulcan Energy have signed a framework agreement for the Lionheart lithium‑hydroxide project in Germany’s Upper Rhine Valley. The deal makes Siemens the preferred supplier of automation, digital‑twin and data‑analytics technologies through 2035 and includes a 10‑year technology supply...
Artilux Unveils Inception Hybrid Optoelectronic AI Architecture
Artilux introduced Inception, a hybrid optoelectronic AI architecture that replaces traditional digital compute blocks with a photonics‑electronics systolic array. The design delivers orders‑of‑magnitude improvements in power and area efficiency while using mature CMOS processes and eliminating the need for active...
Kerun Launches Integrated Power Solutions for AI Data Centers
Kerun Intelligent Control Co., Ltd. unveiled an Integrated Transformer and Substation Solution designed for AI data centers and other high‑density computing facilities. The package combines K‑Factor harmonic‑resistant transformers, FR3 vegetable‑oil cooling fluid, and intelligent monitoring to boost power reliability, efficiency,...
Ultrasense Systems Unveils Ultrasonic Tactile Platform for AI
UltraSense Systems introduced an ultrasound‑based tactile intelligence platform for Physical AI, featuring a protected sub‑surface sensing architecture. The system uses acoustic return signatures to detect contact, localize touch points, and infer force while keeping the core sensors shielded from wear....
Yizumi Expands Molding Equipment Portfolio and Global Footprint
YIZUMI announced a major expansion of its molding equipment portfolio and global manufacturing footprint ahead of its YIZUMI CONNECT 2026 event in Nanxun, China. The company now offers a broader suite of technologies—including hydraulic A6 injection machines, electric FF series,...
Siemens and KION Partner to Digitalize Intralogistics
Siemens and KION have forged a strategic partnership to digitalize intralogistics using AI, automation and Siemens’ new Digital Twin Composer. The collaboration will capture sensor and camera data to build digital twins of machines and entire warehouses, enabling real‑time simulation...
Cadence and NVIDIA Expand Partnership for Agentic AI Design
Cadence and NVIDIA announced an expanded partnership that couples Cadence's agentic AI‑driven EDA and system design tools with NVIDIA's CUDA‑X, AI‑physics, and Omniverse libraries. The collaboration promises up to 100× speedups for solvers and a new AgentStack super‑agent that orchestrates...
Cadence Collaborates with Google on AI-Driven Chip Design
Cadence has teamed up with Google to embed Google’s Gemini large‑language model into its ChipStack AI Super Agent, a cloud‑native platform for chip design and verification. The integration runs on Google Cloud’s elastic compute, delivering up to ten‑fold productivity gains...
Molex to Acquire Teramount for Fiber-to-Chip Connectivity
Molex announced it will acquire Israel‑based Teramount Ltd., a developer of detachable fiber‑to‑chip connectivity solutions for high‑volume Co‑Packaged Optics (CPO) and silicon photonics. Teramount’s TeraVERSE platform uses a universal photonic coupler and wafer‑level self‑aligning optics to provide a passive, field‑serviceable...
Scale Computing Launches Velocity Partner Program
Scale Computing unveiled the Velocity Partner Program, a next‑generation channel initiative that swaps traditional volume‑based incentives for competency‑driven rewards. The program is designed to give partners greater autonomy, faster quote‑to‑close times, and predictable margins while reducing dependence on vendor resources....
Flexcompute Automates the Engineering Simulation Workflow with GeometryAI
Flexcompute unveiled GeometryAI, an AI‑driven preprocessing engine that automatically repairs raw CAD models into watertight geometry for simulation. The platform replaces labor‑intensive manual cleanup and the accuracy‑compromising shrink‑wrap methods by preserving critical small features while fixing gaps, overlaps, and duplicate...
InnovMetric Acquires German Partner Duwe-3d
InnovMetric has completed the acquisition of its long‑time German partner Duwe‑3d, ending a 27‑year collaboration. Duwe‑3d, the master distributor of PolyWorks in Germany, Austria and Switzerland, will become part of InnovMetric’s European division. The deal preserves existing technical contacts and...
3D Systems Adds SLA Printer and AddiTrak Software
3D Systems unveiled the SLA 825 Dual, a stereolithography printer that delivers a 22% larger build volume and up to 25% faster print speeds, targeting high‑volume industrial production. The company also launched AddiTrak, an on‑premise software platform that centralizes monitoring, analytics, and...
ALLPLAN Launches Steel Genie for Steel Estimating
ALLPLAN introduced Steel Genie, an AI‑driven tool that automatically extracts steel quantities from structural drawings and creates estimating‑level 3D models. The software identifies member types, dimensions, weight, and connection details, and incorporates an AISC‑based connection engine. By linking directly with...
ModuleWorks 2026.04 Adds GPU Machine Simulation
ModuleWorks released version 2026.04, adding GPU‑accelerated machine simulation and extending its VoluMill and SmartRoughing technologies to multi‑axis roughing and turning. The GPU support speeds stock updates and collision detection, while VoluMill now maintains stable cutting conditions across corners and closed...
Rapidus Opens Analysis Center and Chiplet Solutions Hub
Rapidus opened an Analysis Center adjacent to its IIM‑1 foundry in Chitose, Hokkaido, and launched full‑scale operations of the Rapidus Chiplet Solutions (RCS) hub. The RCS, initially a limited‑capacity R&D site at the Seiko Epson plant, has begun continuous production...
Aras Joins Alliance for OpenUSD for Digital Twins
Aras announced its membership in the Alliance for OpenUSD (AOUSD), a nonprofit effort to standardize OpenUSD for interoperable 3D workflows. The move positions Aras to bridge product lifecycle management (PLM) data with NVIDIA Omniverse‑based digital twins, enabling real‑time, high‑fidelity visualizations...
Kubotek Kosmos Updates 3D Framework to Version 8.0
Kubotek Kosmos released version 8.0 of its 3D Framework, adding full support for STEP AP242 Edition 4, STEP XML Part 28, and QIF file import. The update introduces persistent identifiers for traceability, expanded saved‑view capabilities, and new API functions for cloning tolerance...
FANUC Named a Top Workplace for the Sixth Consecutive Year
FANUC America has been recognized as a Top Workplace USA for the sixth year in a row, an award based solely on employee survey data collected by Energage and published by USA Today. The accolade highlights the company’s strong culture...
Protolabs Joins Space Foundation at Space Symposium
Protolabs announced its partnership with the Space Foundation ahead of the 41st Space Symposium in Colorado Springs, where it will exhibit its aerospace manufacturing capabilities. The company highlights its ITAR‑compliant, AS9100‑certified factories in the U.S. and Europe, emphasizing rapid, high‑mix,...
Stratasys Expands Software, Materials and 3D Printing
Stratasys announced a suite of updates spanning hardware, materials and software to push additive manufacturing beyond prototyping into production parts and medical devices. The new J850 Core printer delivers low‑cost PolyJet functionality for engineering teams, while the P3 MED Silicone 25A material...