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HPCwire

HPCwire

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Independent publication on high‑performance computing systems, accelerators, interconnects, and AI infrastructure.

Recent Posts

BSC Deploys AI at the Service of Companies at MWC
News•Feb 27, 2026

BSC Deploys AI at the Service of Companies at MWC

The Barcelona Supercomputing Center’s AI Factory took center stage at Mobile World Congress’s 4YFN showcase, unveiling a catalog of 24 AI‑driven services organized into six strategic pillars. By January 2026 the factory had already delivered 505 services, trained 314 participants and evaluated 92 EuroHPC initiatives, aiming to serve 2,000 clients with 3,000 services by March 2028. The booth featured 16 partner startups presenting solutions in health, quantum computing, urban intelligence and sustainability, alongside an interactive climate‑digital‑twin experience. The event underscored BSC’s role in translating supercomputing excellence into commercial AI impact across Europe.

By HPCwire
Welinq and Pasqal Accelerate Networked Quantum Computing with Neutral-Atom Tech
News•Feb 27, 2026

Welinq and Pasqal Accelerate Networked Quantum Computing with Neutral-Atom Tech

Welinq and Pasqal have deepened their partnership to accelerate networked quantum computing using neutral‑atom processors. Backed by a €4 million InterQo grant from Île‑de‑France Region and BPI France, the two firms will integrate photonic interconnects into Pasqal’s QPUs and deploy Welinq’s...

By HPCwire
Xanadu and Mitsubishi Chemical Detail Quantum Algorithms for EUV Semiconductor Research
News•Feb 27, 2026

Xanadu and Mitsubishi Chemical Detail Quantum Algorithms for EUV Semiconductor Research

Xanadu Quantum Technologies and Mitsubishi Chemical have published a pre‑print detailing quantum simulation algorithms aimed at improving extreme ultraviolet (EUV) lithography, a key step in advanced semiconductor manufacturing. The approach models the quantum‑driven radiation‑induced blur that limits pattern fidelity, using...

By HPCwire
ORNL Launches the Next-Generation Data Centers Institute
News•Feb 26, 2026

ORNL Launches the Next-Generation Data Centers Institute

Oak Ridge National Laboratory has launched the Next Generation Data Centers Institute (NGDCI) to tackle the exploding electricity demand of AI‑driven data centers. The institute will combine ORNL’s strengths in energy science, high‑performance computing, cybersecurity and grid research to make...

By HPCwire
Broadcom Ships 3.5D Face-to-Face Compute SoC
News•Feb 26, 2026

Broadcom Ships 3.5D Face-to-Face Compute SoC

Broadcom announced the start of shipments for the industry’s first 2nm custom compute SoC built on its 3.5D eXtreme Dimension System in Package (XDSiP) platform. The chip leverages Face‑to‑Face (F2F) 3D integration to combine 2.5D and 3D‑IC techniques, delivering unprecedented...

By HPCwire
CIQ Launches RLC Pro Enterprise Linux Subscription for Production AI and HPC Environments
News•Feb 26, 2026

CIQ Launches RLC Pro Enterprise Linux Subscription for Production AI and HPC Environments

CIQ announced Rocky Linux from CIQ Pro (RLC Pro), a commercially supported Enterprise Linux subscription that bundles long‑term support, FIPS 140‑3 validation, indemnification and direct bug‑fix services. The offering targets AI, high‑performance computing and regulated industries, promising 3‑5 year lifecycle stability without forced...

By HPCwire
Pawsey Expands High-Memory Resources on Setonix for Data-Intensive Workloads
News•Feb 26, 2026

Pawsey Expands High-Memory Resources on Setonix for Data-Intensive Workloads

Pawsey Supercomputing Research Centre has doubled the high‑memory CPU nodes on its Setonix system from eight to sixteen, each equipped with dual 64‑core AMD EPYC 7763 processors and 1 TB of shared RAM. The expansion responds to a user‑survey‑identified demand for...

By HPCwire
Berkeley Lab Explores Thermodynamic Computing for AI
News•Feb 26, 2026

Berkeley Lab Explores Thermodynamic Computing for AI

Lawrence Berkeley National Laboratory researchers unveiled a thermodynamic computing prototype that harnesses thermal noise to generate simple images, mimicking generative AI behavior. By exploiting fluctuations instead of suppressing them, the system flips conventional digital logic and operates via Langevin dynamics....

By HPCwire
Eyeing the Massive HPC Opportunity for Unlocking Agentic AI with Silicon Photonics
News•Feb 26, 2026

Eyeing the Massive HPC Opportunity for Unlocking Agentic AI with Silicon Photonics

Silicon photonics is emerging as a viable alternative to copper interconnects for high‑performance computing (HPC) systems that power agentic AI workloads. Nvidia’s NVL72 uses copper‑based NVLink, but its bandwidth and latency are straining under next‑generation inference demands. French startup Scintil...

By HPCwire
Supermicro Debuts High-Density MicroBlade Server Featuring AMD EPYC 4005
News•Feb 26, 2026

Supermicro Debuts High-Density MicroBlade Server Featuring AMD EPYC 4005

Supermicro unveiled its MicroBlade platform, the industry’s first blade server built around AMD’s EPYC 4005 series and delivering the highest compute density on the market. The 6U chassis can host up to 40 nodes, while a standard 48U rack can...

By HPCwire
NCC Croatia Brings CFD and HPC to Superyacht Engineering Workflows
News•Feb 25, 2026

NCC Croatia Brings CFD and HPC to Superyacht Engineering Workflows

NCC Croatia partnered with Lürssen Design Centre Kvarner to embed computational fluid dynamics (CFD) and high‑performance computing (HPC) into superyacht ventilation design. Engineers received hands‑on training and used OpenFOAM on NCC’s supercomputer to model a real‑world duct network. The simulations...

By HPCwire
Ciena Unveils New Pluggable Optical Engine to Meet Data Center AI Demands
News•Feb 25, 2026

Ciena Unveils New Pluggable Optical Engine to Meet Data Center AI Demands

Ciena introduced the Vesta 200 6.4T CPX, a pluggable co‑packaged optical (CPO) engine that delivers the industry’s highest density and up to 70% lower power consumption. The module supports 200 Gb/s per lane, retimer‑free linear‑drive operation and a 20 dB electrical loss budget, enabling...

By HPCwire
Simon Fraser University Signs MOUs to Advance Sustainability at Cedar Supercomputing Centre
News•Feb 25, 2026

Simon Fraser University Signs MOUs to Advance Sustainability at Cedar Supercomputing Centre

Simon Fraser University has signed memoranda of understanding with Cerio, Corix and Moment Energy to deepen the sustainability of its Cedar Supercomputing Centre, Canada’s most powerful academic HPC system. The centre already runs on clean hydroelectric power and boasts a...

By HPCwire
Marvell to Showcase PCIe 8.0 SerDes Demonstration at DesignCon 2026
News•Feb 24, 2026

Marvell to Showcase PCIe 8.0 SerDes Demonstration at DesignCon 2026

Marvell Technology announced it will showcase a PCIe 8.0 SerDes operating at 256 GT/s during DesignCon 2026 in Santa Clara. The demo, presented at booth #904, uses the TE Connectivity AdrenaLINE Catapult connector and the Alaska P PCIe 6.0 retimer platform. PCIe 8.0, slated for finalization...

By HPCwire
QEC4QEA to Support Development of Quantum-Enhanced Applications Across Europe
News•Feb 24, 2026

QEC4QEA to Support Development of Quantum-Enhanced Applications Across Europe

QEC4QEA, a new Quantum Excellence Centre funded by EuroHPC JU and Horizon Europe, receives roughly €4.9 million to accelerate quantum‑enhanced application development across Europe. The centre links end‑users with quantum developers, experts and computing providers, offering guidance, tools, training and hybrid quantum‑HPC resources....

By HPCwire
Cadence Completes €2.7B Acquisition of Hexagon’s Design and Engineering Business
Deals•Feb 23, 2026

Cadence Completes €2.7B Acquisition of Hexagon’s Design and Engineering Business

Cadence announced the completion of its acquisition of Hexagon AB’s Design and Engineering (D&E) business for an approximate €2.7 billion, paid 70% in cash and 30% in Cadence stock. The deal expands Cadence’s multiphysics portfolio and positions it to leverage the...

HPCwire
Aliro Raises $15M in Oversubscribed Funding Round
Deals•Feb 18, 2026

Aliro Raises $15M in Oversubscribed Funding Round

Aliro announced a $15 million oversubscribed funding round led by Gutbrain Ventures, with participation from Cisco Investments, Argon Ventures, and Wonderstone Ventures, the corporate VC of Murata. The capital will support expanded deployments and ecosystem partnerships for its physics‑based network...

HPCwire

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