European Chips Skills Academy Launches the ECSA Learning Platform
The European Chips Skills Academy (ECSA) has launched the ECSA Learning Platform, a free digital hub offering more than 60 introductory to intermediate semiconductor courses. Developed with industry and academic partners, the platform integrates a Knowledge Hub, community collaboration spaces, and a job‑internship marketplace. Learning analytics let users monitor progress, while all content remains free to ensure equal access across Europe. The initiative aims to strengthen the continent’s semiconductor talent pipeline and support the EU’s broader chip‑manufacturing ambitions.
Semiconductor-Based Quantum Pilot Line ‘SPINS’ Launched with EU Support
The EU has launched the €50 million SPINS pilot line, one of six quantum pilot facilities created under the Chips Act. Coordinated by imec, SPINS unites 25 RTOs, industry players and universities to develop semiconductor‑based spin‑qubit chips. The initiative targets three...
Stitching Precise Patterns – With Lasers
University of Pittsburgh engineers have devised a laser‑induced graphene (LIG) manufacturing method that uses an iron‑oxide ink layer to precisely control graphene formation on polymer films. The technique enables tunable electrode thickness and conductivity, and can create graphene on either...
Bureau Veritas Acquires Lotusworks
Bureau Veritas announced a €375 million agreement to acquire Lotusworks, a specialist in commissioning and quality assurance for mission‑critical assets. Lotusworks, based in Ireland, generated €131 million in 2025 revenue and serves semiconductor manufacturers and data‑center owners across the U.S. and Europe....
IVWorks Secures $4.5M Funding to Expand ‘reGaN’ Technology Into RF and AI Power Semiconductor Markets
IVWorks announced a $4.5 million financing round, bringing its total capital raised to $33 million, to accelerate deployment of its proprietary reGaN technology. The company will use the funds to scale mass‑production infrastructure and secure its supply chain for GaN epitaxial wafers...
SEMI Appoints Mary Bischoping as Senior Director of Public Policy and Advocacy
SEMI announced Mary Bischoping as its new Senior Director of Public Policy and Advocacy, based in Washington, D.C. Bischoping will steer SEMI’s engagement with U.S. lawmakers on supply‑chain resilience, intellectual‑property protection, tax policy, and emerging technologies such as AI and...
Molex Completes Acquisition of Smiths Interconnect
Global connector leader Molex has completed its largest acquisition to date, buying Smiths Interconnect, a UK‑based provider of ruggedized custom connectors, RF components and optical transceivers. The deal adds Smiths Interconnect’s semiconductor test and medical interconnect capabilities, expanding Molex’s data‑center...
Cohu Announces $30 Million Follow-On Orders for High-Performance Computing Test
Cohu announced two customers placed follow‑on orders worth $30 million for its Eclipse platform with active thermal control to test next‑generation high‑performance computing processors. The orders, to be delivered over the next few quarters, deepen Cohu’s footprint in the rapidly expanding...
ACM Research Introduces ACM Planetary Family Product Portfolio Structure
ACM Research announced a rebranding of its product line into the ACM Planetary Family, a process‑based portfolio organized around eight distinct series. Each series corresponds to a core step in semiconductor wafer and panel manufacturing, from cleaning to advanced packaging...
CEA-Leti, CEA-List and PSMC Collaborate to Integrate RISC-V and MicroLED Silicon Photonics Into 3D Stacking and Interposer for...
CEA‑Leti, CEA‑List and Powerchip Semiconductor Manufacturing Corporation (PSMC) announced a strategic partnership to fuse CEA‑List’s RISC‑V design expertise with CEA‑Leti’s silicon‑photonic microLED technology into PSMC’s 3D‑stacking and interposer platforms. The joint effort will embed short‑reach, high‑bandwidth optical links and customizable...
C-Hawk Expands Southeast Asia Manufacturing Capabilities and Capacity with New Malaysia and Vietnam Facilities
C-Hawk Technology announced the opening of two new manufacturing facilities in Southeast Asia—a 200,000‑square‑foot plant in Johor Baru, Malaysia, and a 96,000‑square‑foot site in Ho Chi Minh City, Vietnam. The Malaysian location expands precision‑plastic production and adds PFA tube‑bending, while the Vietnamese factory...
IBM Announces Strategic Collaboration with Arm
IBM announced a strategic collaboration with Arm to create dual‑architecture hardware that blends IBM’s enterprise‑grade reliability and security with Arm’s power‑efficient designs. The partnership targets AI and data‑intensive workloads, emphasizing virtualization, high‑availability, and ecosystem growth. By integrating Arm‑based software environments...
Graphene ‘Nano-Aquariums’ Reveal Atoms’ Hidden Life in Liquids
A Manchester research team built graphene‑based nano‑aquariums that seal attolitre‑scale liquid pockets between atom‑thin graphene windows, allowing transmission electron microscopy to image atomic behavior in a variety of organic solvents. Using the ePSIC facility, they filmed gold atoms at solid‑liquid...
PrismML Launches World’s First 1-Bit AI Model to Redefine Intelligence at the Edge
PrismML emerged from stealth to launch the world’s first commercially viable 1‑bit large language model, the 8‑billion‑parameter Bonsai 8B. Built on Caltech research and trained on Google v4 TPUs, the model delivers performance comparable to full‑precision 8B models while using...
Soft Sensor Gives Robots a Better Sense of Touch
Researchers from Zhejiang, Hangzhou Dianzi and Lishui universities unveiled a humanoid robotic hand equipped with an omnidirectional soft bending sensor that simultaneously tracks pitch and yaw at each finger joint. The hand features 18 active degrees of freedom and uses...
