News•Mar 11, 2026
POET Demos Hybrid Laser and Next-Gen High-Power External Light Source for AI at OFC
At OFC 2026 in Los Angeles, POET Technologies showcased its hybrid laser Blazar and next‑generation external light source Starlight. Blazar, a wafer‑level integrated multi‑channel laser, promises higher output power, multi‑wavelength operation and lower manufacturing cost compared with traditional DFB lasers. Starlight, featuring an eight‑channel high‑power engine, demonstrates advanced packaging for chip‑to‑chip AI data links and aligns with industry demand for greater compute bandwidth. POET also received the Lightwave Innovations Elite Score award for its Teralight 1.6 Tbps optical engine, underscoring its leadership in AI‑focused photonics.
By Semiconductor Today
News•Mar 11, 2026
La Luce Cristallina Releases Beta-Version of 200mm Barium Titanate Wafer
La Luce Cristallina announced the beta‑release of its 200 mm barium titanate (BaTiO₃) wafer, now available for customer evaluation in advanced electro‑optic modulators. The wafer’s ultra‑low‑voltage operation leverages BaTiO₃’s high Pockels coefficient, targeting co‑packaged optics for AI‑driven data‑center, telecom and datacom workloads. It...
By Semiconductor Today
News•Mar 10, 2026
NUBURU’s Lyocon Completes Proof-of-Concept for Portable Directed-Energy Laser Platform
NUBURU’s subsidiary Lyocon has completed a proof‑of‑concept for a portable directed‑energy laser dazzler aimed at counter‑drone defense. The system employs multi‑wavelength lasers (green, blue, IR) delivering 1‑10 W of power in a rifle‑mounted, modular architecture for rapid field deployment. Early trials...
By Semiconductor Today
News•Mar 10, 2026
Wolfspeed Unveils Foundation for AI Data-Center Advanced Packaging Leveraging 300mm Silicon Carbide
Wolfspeed announced that its 300 mm silicon carbide (SiC) technology platform can serve as a foundational material for advanced AI and high‑performance computing (HPC) heterogeneous packaging by decade’s end. The company recently produced a single‑crystal 300 mm SiC wafer and is collaborating...
By Semiconductor Today
News•Mar 10, 2026
Lumentum Promoted From S&P MidCap 400 to S&P 500 Index
Lumentum Holdings has been selected to join the S&P 500, moving from the MidCap 400 on March 23, 2026. The promotion reflects a sharp rise in market capitalization and liquidity. Inclusion places Lumentum among the 500 leading U.S. companies, expanding its investor base. CEO...
By Semiconductor Today
News•Mar 10, 2026
Spain’s VLC Photonics and Hitachi High-Tech America Announce Strategic Collaboration in North America
VLC Photonics, a Spanish fabless photonic integrated circuit (PIC) design house, has entered a strategic collaboration with Hitachi High‑Tech America to expand its North American footprint. The partnership leverages VLC’s multi‑platform PIC expertise and Hitachi’s equipment sales and global commercial...
By Semiconductor Today
News•Mar 10, 2026
Indra Leading GIGaNTE Project to Develop Autonomous Spanish Gallium Nitride and Advanced Packaging Technologies
Indra Group is spearheading the €9 million, four‑year GIGaNTE initiative to create a fully autonomous Spanish gallium‑nitride (GaN) and advanced packaging ecosystem. The project targets high‑reliability radar and communications systems for defence, developing proprietary GaN processes, monolithic microwave integrated circuits and...
By Semiconductor Today
News•Mar 10, 2026
NVIDIA Investing $2bn in Coherent’s R&D, Capacity Expansion and Operations as It Builds Out US-Based Manufacturing
NVIDIA announced a multi‑year strategic agreement with Coherent Corp, investing $2 billion to fund research, capacity expansion, and US‑based manufacturing. The deal includes a non‑exclusive purchase commitment and future access rights to Coherent’s advanced laser and optical networking products. By scaling...
By Semiconductor Today
News•Mar 9, 2026
AXT’s Q4/2025 Revenue Constrained by Delay in China Export Permits
AXT Inc reported an 11% drop in full‑year 2025 revenue to $88.3 m, driven by an 8.4% Q4 decline caused by delayed Chinese export permits for indium phosphide. Gross margin fell to 13.1% while the company posted a $18 m net loss...
By Semiconductor Today
News•Mar 9, 2026
BluGlass Enters AUS$1.25m Development Program with US Tier-1 Defence Prime for Visible GaN DFB Lasers and Gain Chips
BluGlass Ltd has secured a AUS$1.25 million, 14‑24‑month development program with a US tier‑1 defence prime to deliver visible GaN distributed feedback (DFB) lasers and gain chips. The initial AUS$560,000 purchase order will fund the first phase, with payments linked to...
By Semiconductor Today
News•Mar 9, 2026
Smartphone Production Grows 2.5% to 1.25 Billion Units in 2025
Global smartphone production rose 2.5% year‑on‑year in 2025, reaching about 1.254 billion units. Apple and Samsung each manufactured nearly 240 million devices, sharing the top spot. Q4 2025 saw strong iPhone 17 shipments and Samsung’s 11% YoY increase, while rivals trimmed output amid...
By Semiconductor Today
News•Mar 6, 2026
Marktech Adds 230nm and 265nm Deep UV, 310nm UVB and 340nm UVA LEDs
Marktech Optoelectronics announced an expanded UV LED portfolio that now includes deep‑UV emitters at 230 nm and 265 nm, a UVB chip at 310 nm, and a UVA part at 340 nm. The new lineup spans 230 nm to 400 nm and is offered in metal‑can,...
By Semiconductor Today
News•Mar 5, 2026
Wolfspeed Launches First Commercially Available 10kV SiC Power MOSFET
Wolfspeed announced the industry’s first commercially available 10 kV silicon‑carbide (SiC) power MOSFET, the CPM3‑10000‑0300A die. The device promises a 158,000‑year dielectric lifetime, sub‑10 ns rise time and up to 99% conversion efficiency. Wolfspeed says the technology can cut system cost by...
By Semiconductor Today
News•Mar 5, 2026
Circuits Integrated Hellas and Reach Power Sign Multi-Year Strategic MOU
Circuits Integrated Hellas (CIH) and Reach Power have signed a multi‑year memorandum of understanding to co‑develop integrated RF/mmWave and wireless power‑at‑a‑distance (WPDT) solutions. CIH will supply custom semiconductor designs, beamforming architectures and heterogeneous integration, while Reach contributes its proven power‑beaming...
By Semiconductor Today
News•Mar 5, 2026
Semtech Expands Data-Center Portfolio by Acquiring HieFo for $34m
Semtech Corp announced it has acquired HieFo Corp for approximately $34 million in cash. HieFo supplies indium phosphide (InP) optoelectronic devices, including lasers and gain chips, used in data‑center interconnects. The deal, cleared by CFIUS, expands Semtech’s domestic semiconductor portfolio and...
By Semiconductor Today
Deals•Feb 17, 2026
SDI Group Acquires PRP Optoelectronics for £9.3m
SDI Group plc announced the acquisition of PRP Optoelectronics Ltd for a total consideration of £11.3 million in cash, plus up to £0.9 million deferred, excluding £2.8 million of net cash. The deal adds micro‑LED and LED array capabilities to SDI’s Industrial &...
Semiconductor Today
Deals•Feb 11, 2026
NUBURU Completes First Tranche of Preferred Equity Restructuring
NUBURU announced the completion of the first tranche of its preferred equity restructuring, raising capital to support its operations. The transaction marks the initial step in a multi‑tranche financing plan.
Semiconductor Today