QPT Unveils AI-Driven Design Service for Optimizing Thermal Interface Layer
Quantum Power Transformation (QPT) introduced qDesign, an AI‑driven generative design service that automates the creation, simulation, and iteration of its patented qAttach thermal interface layer for power modules. The platform replaces weeks‑long human CAD cycles with minutes‑long AI‑generated topologies, delivering up to 15× better thermal performance and enabling >1 MHz hard‑switching in GaN motor drives and data‑center power supplies. QPT is offering qDesign as a partnered engineering service to semiconductor manufacturers ahead of its PCIM Europe 2026 showcase. The service provides traceable deliverables, including AI‑generated drawings and simulation reports.
CSA Catapult Translates Research Into Double Pulse Testing
The UK’s CSA Catapult has introduced a Double Pulse Testing (DPT) service that delivers high‑fidelity switching data for power semiconductor devices and modules. The automated platform can test up to 1.5 kV and 1 kA across a 25‑150 °C temperature range, extracting loss,...
Kyocera to Acquire Ushio’s Laser Diode Business
Kyocera Corp will acquire Ushio Inc.'s laser‑diode business through an absorption‑type split, with the share purchase slated for 1 April 2027. The transaction creates a new company that will house Ushio's GaAs‑based red laser assets, which Kyocera will then buy. Kyocera's subsidiary...
Covalent Expands Wafer-Level Characterization Through Oxford Instruments Collaboration
Covalent Corp announced a strategic partnership with Oxford Instruments to embed wafer‑level Raman and photoluminescence (PL) workflows into its semiconductor‑characterization suite. The joint solution leverages Oxford’s WITec360 Raman platform with dual 355 nm and 532 nm lasers, enabling full‑wafer (up to 300 mm)...
ElementUSA and Colorado School of Mines Awarded $67m by DOE for Construction of Rare-Earth Processing Plant
ElementUSA and the Colorado School of Mines received a $67 million grant from the U.S. Department of Energy to design, build and operate a rare‑earth element (REE) processing plant in St. John the Baptist Parish, Louisiana. The project expands ElementUSA’s existing...
ROHM’s 750V SiC MOSFET Adopted in Battery Backup Unit for AI Servers
ROHM announced that its 750 V silicon‑carbide (SiC) MOSFET, the SCT4013DLL, has been selected for battery backup units (BBUs) in AI server power supplies. The device operates within a ±400 V architecture and tolerates junction temperatures up to 175 °C, addressing the heat...
Indium Corp and Ames National Lab Team to Establish US Gallium Supply Chain
Indium Corp and the U.S. Department of Energy’s Ames National Laboratory have launched a research partnership to build a domestic gallium supply chain, a metal critical for semiconductors and optoelectronics. The collaboration will develop heat‑stable polymer resins and AI‑driven process...
University of Texas at Dallas and Attolight Launch New Demo Lab for Wide-Bandgap R&D
The University of Texas at Dallas and Swiss firm Attolight have opened a demonstration laboratory on campus equipped with Attolight’s Allalin CL‑SEM platform. The lab focuses on wide‑bandgap semiconductor materials such as GaN and SiC, offering nondestructive nanoscale defect detection...
Cree LED Launches XLamp XE-B LEDs for Directional Lighting
Cree LED announced the XLamp XE‑B series, an ultra‑compact 0.9 mm × 1.4 mm LED that delivers up to 60 % more intensity than comparable 1 mm × 1 mm devices. The new family expands the XLamp Element line with 17 colors plus full‑white options, targeting directional lighting in automotive,...
Wise Integration Unveiling Digital Control Roadmap for Next-Gen Power Conversion at PCIM
Wise Integration used its PCIM 2026 booth to unveil a digital‑control roadmap centered on the new WI73xxx generation and the upcoming WiseWare 2 platform. The company demonstrated scalable AC‑DC demo boards ranging from 240 W to 7 kW, showcasing how its WiseGan Digital First...
Aixtron’s CCS R&D System to Be Centerpiece of Penn State’s New Semiconductor Lab
Deposition equipment maker Aixtron SE announced that its Close Coupled Showerhead (CCS) R&D system will be the centerpiece of a new semiconductor research laboratory at Penn State’s Materials Research Institute. The lab, housed in the Millennium Science Complex, is funded...
Power Integrations Unveils Space-Saving, Ultra-Slim Auxiliary PSU Reference Designs for NVIDIA Kyber 800VDC AI Data Center
Power Integrations announced two ultra‑slim auxiliary power‑supply reference designs for NVIDIA Kyber 800 VDC AI data centers. The 15 W unit measures 30 mm × 30 mm × 7 mm, while the 35 W version is 80 mm × 60 mm × 8 mm. Both designs, based on the InnoMux‑2 1700 V GaN IC, claim at least 88 %...
Infineon Joins NVIDIA’s MGX AI Factory Ecosystem
Infineon Technologies has joined NVIDIA’s MGX AI Factory ecosystem, supplying 800 VDC power‑management solutions that integrate with NVIDIA’s modular MGX architecture. The partnership leverages Infineon’s silicon‑carbide (SiC) JFETs and gallium‑nitride (GaN) converters to deliver ultra‑compact, high‑efficiency bus conversion from grid to...
Purdue and Taiwan’s GCCS Partner to Scale Silicon Carbide Substrates to 8- and 12-Inches
Purdue University and Taiwan’s GeChi Compound Semiconductor Co (GCCS) have signed a five‑year MoU to scale silicon‑carbide (SiC) substrates to 8‑inch and 12‑inch diameters. The partnership blends GCCS’s crystal‑growth expertise with Purdue’s nanofabrication facilities to accelerate defect‑free wafer production. Joint...
Microchip Launches 3.3kV HV D3 mSiC Power Modules to Enable Solid-State Transformers for AI Data Centers
Microchip Technology announced 3.3 kV HV‑D3 mSiC power modules designed for solid‑state transformers in AI hyperscale data centers. The modules integrate SiC MOSFETs and Schottky diodes in a 62 mm package, offering 6 kV isolation and high thermal conductivity. They halve the number...
Wolfspeed Introduces 3.3kV SiC Power Modules in Two Industry-Standard Footprints
Wolfspeed announced two new 3.3 kV silicon‑carbide power‑module families – a high‑power half‑bridge baseplate line and a scalable baseplate‑less full‑bridge WolfPACK line – in industry‑standard footprints. The half‑bridge modules target >800 A applications such as solar, grid‑scale storage and wind, while the...
Infineon-Led European Project Moore4Power Launches
Infineon Technologies has launched the EU‑backed Moore4Power project, a three‑year R&D effort funded with €91 million (≈$99 million). The consortium brings together 62 companies, research institutes and SMEs from 15 European nations to develop heterogeneous power‑chiplet systems that combine Si, SiC and...
CSA Catapult a Core Technology Partner Providing SiC Power Module for Project SONATA
The UK’s Compound Semiconductor Applications (CSA) Catapult has been named a core technology partner for Project SONATA, an ATI‑funded initiative to develop an on‑aircraft electric taxi system with regenerative braking. CSA Catapult will design, build and validate custom silicon‑carbide (SiC) power...
Tower Signs Customer Contracts for $1.3bn Silicon Photonics Revenue for 2027
Tower Semiconductor announced $1.3 bn of silicon photonics contracts for 2027, backed by $290 m in prepaid capacity reservations. The deals cover more than 50 active customers and set the stage for a larger wafer commitment in 2028. Tower is ramping multi‑fab...
Infineon Expands XHP 2 CoolSiC MOSFET Power Module Portfolio
Infineon Technologies has added four new 2300 V CoolSiC MOSFET power modules to its XHP 2 portfolio, targeting high‑voltage renewable‑energy converters. The devices handle DC‑link voltages up to 1500 V, offer on‑resistance between 1 mΩ and 2 mΩ, and feature 4 kV or 6 kV isolation. Leveraging...
Cyient Launches India’s First GaN Power IC Family Leveraging Navitas Technology
Cyient Semiconductor has introduced India’s first gallium‑nitride (GaN) power IC family, comprising seven devices built on Navitas Semiconductor’s GaNFast platform. The portfolio, rated up to 650 V, targets high‑efficiency applications in AI data centers, telecom, consumer fast‑charging, industrial power and e‑mobility....
Micro-LED CPO Optical Transceiver Market to Reach $848m by 2030
TrendForce projects the micro‑LED CPO optical transceiver market to reach $848 million by 2030, driven by generative AI’s appetite for ultra‑fast data‑center links. The technology offers 1–2 pJ/bit power use and bit‑error rates below 10⁻¹⁰, positioning it alongside AEC and VCSEL solutions...
ITC Affirms Initial Determination that Innoscience Infringed Infineon GaN Patent
The U.S. International Trade Commission affirmed its December 2025 finding that China‑based Innoscience infringed Infineon Technologies' gallium‑nitride (GaN) patent, ordering bans on imports and sales of the company's 8‑inch GaN‑on‑silicon chips. The decision is subject to a 60‑day presidential review...
Aixtron Supplies Planetary G5+C MOCVD Systems to Renesas
Aixtron SE has delivered multiple Planetary G5+C metal‑organic chemical vapor deposition (MOCVD) systems to Renesas Electronics, expanding the Japanese firm’s gallium nitride (GaN) production capacity for high‑volume manufacturing. The equipment, already operational, supports Renesas’ push into power‑dense applications such as...
Xanadu and EVG Partner on Heterogeneous Integration and Wafer Bonding Processes for Photonic Quantum Systems
Xanadu Quantum Technologies and Austria’s EV Group have formed a strategic partnership to develop heterogeneous integration and wafer‑bonding processes for photonic quantum computers. EVG will supply industrial‑grade bonding and lithography tools to fabricate Xanadu’s multi‑material photonic chips, aiming to shift...
Veeco Receives $250m+ in Equipment Orders for Manufacturing InP Lasers
Veeco Instruments announced more than $250 million in orders for its Spector ion‑beam deposition, Lumina MOCVD, and WaferEtch wet‑processing systems to manufacture indium phosphide (InP) lasers. The orders come from leading 800 G and 1.6 T optical transceiver makers and will begin shipping...
AXT’s Revenue Grows 17% in Q1 After Greater-than-Expected Export Permits
AXT reported Q1 2026 revenue of $26.9 million, up 17% year‑over‑year and slightly above the $26 million forecast, driven primarily by a surge in indium‑phosphide (InP) sales. Export permits from China arrived better than expected, enabling higher InP shipments to U.S. AI...
ST Unveils 100W VIPerGaN Converters for Energy-Efficient Appliances
STMicroelectronics announced two new 100 W VIPerGaN high‑voltage converters—VIPerGaN100W and VIPerGaN100WB—targeting energy‑efficient appliances and consumer electronics. The devices handle 3.5 A and 4.2 A drain currents respectively, support a universal 85‑265 V AC input, and can deliver up to 125 W peak power. Built on...
Navitas Appoints Davin Lee as Independent Director
Navitas Semiconductor appointed veteran Davin Lee as an independent director, assigning him to the Compensation and Governance and Sustainability committees. Lee, who has over 30 years of experience at firms such as Renesas, Dialog and Altera, will stand for re‑election...
EU-Funded HiPower 5.0 Project Developing GaN-Based EV On-Board Chargers
The EU‑funded HiPower 5.0 project, led by Fraunhofer IZM, is creating a 22 kW gallium‑nitride (GaN) on‑board charger (OBC) that occupies only 4 L—about one‑third the size of today’s average 12 L units. By using monolithic bi‑directional GaN switches supplied by Infineon, the charger...
Latest Issue of Semiconductor Today Now Available
Semiconductor Today released its April 2026 issue, a free monthly magazine covering the latest advances in compound semiconductors and advanced silicon materials. The issue features articles on gallium arsenide, indium phosphide, nitrides, silicon carbide, silicon‑germanium and related devices, including nano‑ridge lasers...
Wolfspeed Appoints Executives to Strengthen Leadership Team
Wolfspeed Inc., a leading silicon‑carbide semiconductor maker, announced two senior hires to reinforce its leadership team. Brad Kohn returns as executive vice president, chief legal and global affairs officer, overseeing legal, compliance and policy functions. Sonja Burfeind joins as vice...
AOI Awarded $20.9m Texas Semiconductor Innovation Fund Grant
Applied Optoelectronics Inc (AOI) has secured a $20.9 million grant from the Texas Semiconductor Innovation Fund to fund a 210,000 ft² manufacturing expansion in Sugar Land, Texas. The new facility will become one of the nation’s largest production sites for AI‑focused data‑center...
Onsemi and Geely Expand Collaboration to Support Next-Gen 900V EV Architectures
onsemi and Geely have deepened a global partnership to embed onsemi’s EliteSiC silicon‑carbide technology into Geely’s SEA‑S‑based Super Electric Power (SEP) system. The collaboration targets 900 V vehicle architectures, promising faster acceleration, longer range and dramatically reduced charging times. By leveraging...
Beijing Intellectual Property Court Upholds Validity of Innoscience’s GaN Patents
China’s Beijing Intellectual Property Court upheld the validity of Innoscience’s two core gallium‑nitride (GaN) invention patents, rejecting invalidation attempts by Germany’s Infineon Technologies. The rulings follow favorable decisions by the China National Intellectual Property Administration in November 2025 that affirmed all...
Aeluma Appoints Willy Rachmady as VP of Strategic Partnerships and Ecosystem
Aeluma Inc. has appointed Willy Rachmady, Ph.D., as vice president of strategic partnerships and ecosystem. Reporting to CEO Jonathan Klamkin, Rachmady will oversee foundry alliances, customer engineering, and technology commercialization across silicon photonics and compound‑semiconductor platforms. He arrives with more...
Indium Corp Gains $3.2m DOE TRACE-Ga Grant to Establish Domestic High-Purity Gallium Recovery
Indium Corp of Clinton, New York has secured a $3.2 million grant from the U.S. Department of Energy’s TRACE‑Ga program to develop a domestic process for recovering high‑purity gallium from manufacturing by‑products. The initiative marks the first effort to re‑establish U.S....
Volta Metals Receives $215,000 Grant From Ontario Junior Exploration Program
Volta Metals Ltd secured the maximum $215,000 (≈ $159,000 USD) grant from Ontario’s Junior Exploration Program, covering up to 50% of eligible 2025‑2026 exploration costs. The funding targets the 4,750‑hectare Springer Rare Earth Element and Gallium Project, located 70 km east of Sudbury....
SweGaN Wins Commercial Orders Worth SEK25m From Global Customers
SweGaN AB announced commercial framework agreements worth roughly SEK 25 million ($2.8 million) from customers in Europe, Asia and the United States. The contracts, spanning data‑center power devices and defense‑grade RF components, will generate revenue over the next 6‑18 months. The company also appointed...
Aeluma Receives NASA Award for Integrated QD Lasers
Aeluma Inc., a Goleta‑based compound semiconductor firm, secured a NASA award to accelerate its integrated quantum‑dot (QD) laser platform for data‑communication and sensing. The company’s large‑diameter wafer heterogeneous integration leverages high‑throughput MOCVD to embed QD lasers directly on silicon, tackling...
Atomera Extends Collaboration with Synopsys to GaN Workflows
Atomera Inc. has broadened its long‑standing partnership with Synopsys Inc. to include gallium nitride (GaN) device modeling using Synopsys’ Sentaurus TCAD platform. The expanded effort will develop a GaN calibration methodology, produce marketing and calibrated simulation decks, and feed product...
CSA Catapult Issues Annual Report for 2024–25
The UK’s Compound Semiconductor Applications (CSA) Catapult released its 2024‑25 annual report, highlighting a series of strategic milestones. It opened the nation’s first open‑access advanced packaging facility with $3.1 million funding and joined the £5.5 million REACT sustainable electronics centre in Scotland....
Wolfspeed Appoints Tokyo-Based Regional President for Asia Pacific
Wolfspeed Inc., a leading silicon‑carbide semiconductor maker, announced the appointment of Yasuhisa Harita as regional president for Asia Pacific, effective June 1. Based in Tokyo, Harita will steer commercial strategy across Japan, Korea and the ASEAN nations, targeting revenue growth...
Bosch Sampling Third-Generation SiC Chips to Global Automakers
Bosch has begun sampling its third‑generation silicon carbide (SiC) power chips to automakers worldwide. The new chips deliver about 20% higher performance while being significantly smaller, enabling more chips per wafer and lower costs. Bosch has invested roughly $3.3 billion in...
TU Delft’s Karen Dowling Receives NWO Open Competition ENW-XS Grant
Dr Karen Dowling of TU Delft’s Microelectronics Department secured an NWO Open Competition ENW‑XS grant to study gallium nitride (GaN) for thermoelectric applications in space. Her project will model, fabricate and test 2‑D GaN layers across a temperature span from 500 K...
Quinas Advances ULTRARAM Development with Atomic-Scale Processing at KAUST Core Labs
Quinas Technology announced that it has successfully employed atomic‑layer etching (ALE) at KAUST Core Labs to fabricate its ULTRARAM quantum‑engineered memory structures. The process, supplied by Oxford Instruments Plasma Technology, delivers sub‑nanometre precision with ultra‑low damage, essential for the III‑V...
ROHM Develops 5th Generation SiC MOSFETs
ROHM Semiconductor announced its fifth‑generation EcoSiC silicon‑carbide MOSFETs, delivering roughly 30% lower on‑resistance at 175 °C compared with the prior generation. The devices target high‑efficiency power conversion in electric‑vehicle traction inverters, onboard chargers, AI‑server power supplies, and data‑center equipment. ROHM will...
CSconnected Supporting £436m for Welsh Economy and 3140 Jobs
The CSconnected compound semiconductor cluster in South Wales generated about $554 million in gross value‑added (GVA) and supported 3,140 jobs in 2025, a 19% and 14% year‑on‑year rise respectively. Direct employment reached 1,914 with an additional 1,226 indirect positions, while exports...
AXT Announces Public Offering
AXT Inc., a Fremont‑based producer of gallium arsenide, indium phosphide and germanium substrates, announced a public offering of common stock with a 30‑day overallotment option allowing underwriters to purchase up to an additional 15% of the shares. The offering is...
InPHRED Expands Into Data-Center Optical Interconnect Market with InP VCSEL and Micro-RC-LED Solutions
InPHRED Inc., a Boston‑based photonics startup, announced its entry into the data‑center optical interconnect market, leveraging its nanoporous platform to deliver InP VCSEL and micro‑RC‑LED solutions. The company aims to address ultra‑short‑reach chip‑to‑chip I/O and longer intra‑rack links, with Q1 2027...