Power Integrations Unveils Space-Saving, Ultra-Slim Auxiliary PSU Reference Designs for NVIDIA Kyber 800VDC AI Data Center

Why It Matters

The compact, high‑efficiency GaN converters enable AI data‑center builders to pack more compute power into the same rack space while cutting costs, a critical advantage as demand for high‑voltage, high‑density servers accelerates.

Key Takeaways

• 15 W design fits 30 mm × 30 mm, 7 mm thick
• 35 W design fits 80 mm × 60 mm, 8 mm thick
• Saves ~30% PCB space on NVIDIA Kyber racks
• Reduces BOM count by ~30% versus discrete SiC solutions
• Achieves ≥88% efficiency using 1700 V GaN InnoMux‑2

Pulse Analysis

The surge in generative‑AI workloads is driving data centers toward ever‑higher power densities. NVIDIA’s Kyber platform, with its 800 VDC liquid‑cooled blade architecture, exemplifies this shift, demanding auxiliary power supplies that can operate at extreme voltages while occupying minimal footprint. Traditional silicon‑carbide (SiC) converters meet the voltage requirement but consume valuable board real‑estate and add component count. In this context, Power Integrations’ GaN‑based solutions address a critical gap, offering a path to sustain performance growth without compromising space or thermal budgets.

Power Integrations introduced two reference designs—DER‑1114 (15 W) and DER‑1110 (35 W)—both built around the InnoMux‑2 1700 V GaN IC. The 15 W unit measures just 30 mm × 30 mm with a 7 mm profile, while the 35 W model occupies 80 mm × 60 mm at 8 mm thickness. Their ultra‑slim form factors free roughly 30 % of board area on densely packed power‑distribution boards, and the integrated GaN architecture trims the bill‑of‑materials by a comparable margin. Efficiency stays above 88 % across line and load, with peak performance reaching 90 % in discontinuous conduction mode.

The practical impact extends beyond hardware savings. By lowering component count and simplifying layout, these converters improve overall system reliability and accelerate time‑to‑market for AI‑focused servers. For OEMs building on NVIDIA Kyber, the designs provide a drop‑in solution that sidesteps the higher cost and larger footprint of discrete SiC parts, potentially reducing capital expenditures. As the industry standardizes on higher bus voltages, GaN‑based auxiliary PSUs are poised to become the preferred choice, prompting broader adoption of Power Integrations’ technology across next‑generation data‑center ecosystems.