Semiconductors News and Headlines

AI Is Starting to Out-Design Chip Engineers in Narrow Areas as LLMs Accelerate Software Chip Design Tool Development — "There...
NewsMay 22, 2026

AI Is Starting to Out-Design Chip Engineers in Narrow Areas as LLMs Accelerate Software Chip Design Tool Development — "There...

AI-driven tools are beginning to outperform human engineers in narrowly defined chip‑design tasks. Google DeepMind’s AlphaChip has generated superhuman layouts for multiple TPU generations, while Synopsys’ DSO.ai reports three‑fold productivity gains and up to 25% power reductions for customers. Berkeley...

By Tom's Hardware
Infineon Launches EU Flagship Project Moore4Power
NewsMay 22, 2026

Infineon Launches EU Flagship Project Moore4Power

Infineon is leading the EU‑backed Moore4Power project, uniting 62 European partners to develop heterogeneous power‑electronics platforms that blend silicon, SiC and GaN with sensing, control and communication functions. The initiative targets high‑impact sectors—wind turbines, electric‑vehicle charging and railway propulsion—to boost...

By Compound Semiconductor
EC Approves €66m for German SiC Facility
NewsMay 22, 2026

EC Approves €66m for German SiC Facility

The European Commission has approved a €288 million (≈$314 million) state‑aid package for two German semiconductor projects. €66 million (≈$72 million) will fund Zadient Materials Europe’s new plant in Bitterfeld to produce high‑purity silicon‑carbide (SiC) source material using a circular gas‑recovery process. The remaining...

By Compound Semiconductor
Amkor Expands Arizona Packaging Plans as AMD Joins Advanced Packaging Customers
NewsMay 22, 2026

Amkor Expands Arizona Packaging Plans as AMD Joins Advanced Packaging Customers

Amkor Technology announced the acquisition of an additional 67 acres adjacent to its existing 104‑acre campus in Arizona, paving the way for a new advanced‑packaging fab slated to begin production in 2028. The company confirmed a partnership with AMD to...

By SemiMedia Global
Imec Says AI Scaling Needs More Orchestration Across Research, Design, Manufacturing
NewsMay 22, 2026

Imec Says AI Scaling Needs More Orchestration Across Research, Design, Manufacturing

At ITF World 2026, imec CEO Patrick Vandenameele likened AI scaling to a violin that needs an orchestra, stressing that research, design, and manufacturing must operate in concert. He urged deeper collaboration among foundries, fabless firms, EDA vendors, equipment suppliers,...

By EE Times – Designlines/AI & ML
ST Gate Drivers Ensure High Energy Efficiency in Battery-Operated Equipment
NewsMay 22, 2026

ST Gate Drivers Ensure High Energy Efficiency in Battery-Operated Equipment

STMicroelectronics introduced the STDRIVE102 family of gate‑driver ICs for three‑phase brushless motors, adding SPI‑enabled STDRIVE102P and STDRIVE102BP variants. The devices operate from 6 V to 50 V, drive six external N‑channel MOSFETs, and feature an ultra‑low 50 nA standby current to maximize battery...

By EE Times Asia
Meta, Broadcom and Others to Launch $125 Million Semiconductor Research Hub at UCLA
NewsMay 21, 2026

Meta, Broadcom and Others to Launch $125 Million Semiconductor Research Hub at UCLA

Meta, Broadcom, Applied Materials, GlobalFoundries and Synopsys are investing $125 million to launch a five‑year Semiconductor Hub at UCLA's Samueli School of Engineering. The center will support research across chip design, equipment, software and manufacturing, aiming to accelerate AI‑powered chip innovations....

By CNBC – US Top News & Analysis
US To Award $2 Billion To Quantum Companies, Take Equity Stakes
NewsMay 21, 2026

US To Award $2 Billion To Quantum Companies, Take Equity Stakes

The U.S. Department of Commerce is set to award roughly $2 billion in grants to nine quantum‑computing firms, with the federal government taking equity stakes in each recipient. IBM will receive the largest portion—about $1 billion—and will pair it with an equal...

By Slashdot
Nvidia’s Jensen Huang Wants to Be King of a Brand-New Empire
NewsMay 21, 2026

Nvidia’s Jensen Huang Wants to Be King of a Brand-New Empire

Nvidia, the world’s most valuable chipmaker, announced its entry into the central processing unit market with Vera, its first standalone AI‑focused CPU launched in March. CFO Colette Kress said the product opens a new $200 billion total addressable market, with early...

By MarketWatch – ETF
Intel Says 14A Is on Track for 2028 Risk Production, 10A and 7A Now in Development
NewsMay 21, 2026

Intel Says 14A Is on Track for 2028 Risk Production, 10A and 7A Now in Development

Intel CEO Pat Gelsinger confirmed that development of the 10A and 7A process nodes is now under way, while the 14A node is on schedule for risk‑production in 2028 and volume shipments in 2029. The company’s latest consumer CPUs –...

By TechSpot
Anthropic Mulls Renting Microsoft AI Chips
NewsMay 21, 2026

Anthropic Mulls Renting Microsoft AI Chips

Anthropic is in early-stage talks to rent Microsoft’s Maia AI accelerator chips, adding a new compute option beyond its existing Azure and Nvidia arrangements. The discussion follows a $30 billion Azure commitment made in November 2025 and reflects the startup’s push...

By Mobile World Live
NVIDIA Predicts $1 Trn in GPU Sales, Moves in on CPUs
NewsMay 21, 2026

NVIDIA Predicts $1 Trn in GPU Sales, Moves in on CPUs

NVIDIA projects its graphics processors will generate roughly $1 trillion in revenue between 2025 and 2027, driven by surging demand for generative and agentic AI. The company just reported a record $81.6 billion in Q1 fiscal 2027 revenue, with its nascent CPU...

By The Stack (TheStack.technology)
New Semiconductor Building Blocks Make Power Converters Smaller, More Affordable
NewsMay 21, 2026

New Semiconductor Building Blocks Make Power Converters Smaller, More Affordable

Oak Ridge National Laboratory (ORNL) has demonstrated a power converter built with gallium‑nitride (GaN) semiconductors supplied by ROHM. The GaN devices switch 10‑20 times faster than traditional silicon, delivering higher efficiency while shrinking the converter’s size and weight. The compact,...

By Tech Xplore – Semiconductors
Infineon Expands CoolGaN BDS Portfolio with Compact 40 V Bidirectional GaN Switches
NewsMay 21, 2026

Infineon Expands CoolGaN BDS Portfolio with Compact 40 V Bidirectional GaN Switches

Infineon Technologies has added two compact 40 V bidirectional GaN switches, the IGK048B041S and IGK120B041S, to its CoolGaN BDS family. The devices shrink PCB footprint by up to 82% and halve component count by integrating two MOSFET functions into a single...

By SemiMedia Global