Semiconductors News and Headlines
Semiconductors News and Headlines
Nordson Electronics Solutions will demonstrate its ASYMTEK Vantage fluid dispensing system with a new Class‑100 cleanroom configuration at Productronica China. The company will also showcase the stand‑alone MARCH FlexTRAK plasma system, which provides high‑throughput surface treatment in a compact footprint. Nordson’s application manager, Kahn Huang, will present on AI‑enabled smart factories at the Electronic Intelligent Manufacturing Forum, while partners AMT and Ecelent exhibit additional dispensing and coating equipment. The event runs March 25‑27 in Shanghai, highlighting advanced packaging solutions for fast‑paced semiconductor innovation.
TechInsights hosted a data‑driven seminar for AWS automotive teams, highlighting a decisive shift from distributed electronic modules to centralized compute architectures in vehicles. The briefing detailed how high‑performance automotive SoCs, expanding memory bandwidth, and silicon‑carbide power devices are reshaping AI...
The European Chips Skills Academy (ECSA) has launched the ECSA Learning Platform, a free digital hub offering more than 60 introductory to intermediate semiconductor courses. Developed with industry and academic partners, the platform integrates a Knowledge Hub, community collaboration spaces,...
The EU has launched the €50 million SPINS pilot line, one of six quantum pilot facilities created under the Chips Act. Coordinated by imec, SPINS unites 25 RTOs, industry players and universities to develop semiconductor‑based spin‑qubit chips. The initiative targets three...
University of Pittsburgh engineers have devised a laser‑induced graphene (LIG) manufacturing method that uses an iron‑oxide ink layer to precisely control graphene formation on polymer films. The technique enables tunable electrode thickness and conductivity, and can create graphene on either...
IVWorks announced a $4.5 million financing round, bringing its total capital raised to $33 million, to accelerate deployment of its proprietary reGaN technology. The company will use the funds to scale mass‑production infrastructure and secure its supply chain for GaN epitaxial wafers...
A bipartisan group of U.S. senators has introduced the MATCH Act, shifting export controls on advanced wafer‑fabrication equipment from fab‑level to company‑level restrictions. The bill would bar DUV lithography, etching and deposition tools from reaching Chinese firms such as Huawei,...
The semiconductor foundry market hit a record $320 billion in 2025, with TSMC commanding 38% and growing 36% YoY, far outpacing rivals that collectively rose 8%. Its dominance stems from an unprecedented volume of sub‑5 nm wafers, aggressive price hikes, and a...
CEA‑Leti, CEA‑List and Powerchip Semiconductor Manufacturing Corporation (PSMC) announced a partnership to embed CEA‑List’s RISC‑V processor IP and CEA‑Leti’s microLED silicon‑photonic chiplets into PSMC’s 3D‑stacking and interposer platform. The integration replaces traditional copper interconnects with short‑reach, high‑bandwidth optical links, delivering...
Vishay Intertechnology has released the VODA1275, an automotive‑grade photovoltaic MOSFET driver built in a compact SMD‑4 package with an 8 mm creepage distance and a CTI‑600 mold compound. The driver offers 20 V open‑circuit voltage, 20 µA short‑circuit current, and an 80 µs turn‑on...
Over the past few years GaN HEMTs have moved beyond consumer chargers into high‑performance markets such as AI data‑center servers and humanoid robotics. EPC’s CEO Alex Lidow explained that the material’s low on‑resistance, ultra‑fast switching and high power density make it...
Indium Corporation has signed a long‑term offtake framework with Flash Metals USA, a Metallium subsidiary, to purchase critical metals recovered from electronic scrap using Flash Joule Heating technology. The agreement covers gallium, germanium, copper, tin, gold and indium, with an...
Japan’s state‑backed chipmaker Rapidus has moved its IIM‑1 plant in Hokkaido from construction to an operating pilot line, delivering working two‑nanometer gate‑all‑around prototypes. The company secured a ¥267.6 billion ($1.7 billion) financing round led by the government and over 30 private partners,...
Researchers at Loughborough University unveiled a nanoporous niobium‑oxide memristor that performs reservoir computing directly in hardware, achieving up to 2,000‑times lower energy consumption than conventional software solutions. The same chip accurately forecasted short‑term Lorenz‑63 chaos, recognized pixelated digits and executed...
NXP Semiconductors has launched the omlox Starter Kit, a turnkey solution that merges UWB hardware, software and analytics into a single platform built on the omlox open standard. The kit centers on NXP’s Trimension SR048 UWB SoC and MCX W72...
Intel’s upcoming Nova Lake‑S desktop processor line has a leaked 44‑core SKU, replacing the previously announced 42‑core model by using two identical 8P+12E compute tiles. The change frees up 6P+12E tiles, which could be sold as lower‑priced, locked non‑K variants...
Researchers at North Carolina State University and an international team have unveiled a new technique to generate orbital currents using chiral phonons. The method transfers angular momentum from circularly vibrating atoms directly to electrons in non‑magnetic, inexpensive materials. Published in...
Nvidia showcased Neural Texture Compression (NTC), an AI‑driven method that compresses game textures dramatically. In a demo, a scene that required 6.5 GB of VRAM with traditional block compression ran on just 970 MB using NTC, with no visible loss in image...
Samsung Electronics held its 2026 Device Solutions Division Mutual Growth Cooperation Day, honoring 17 top suppliers for achievements in technology, cost efficiency and ESG performance. KCTech received the highest technology innovation award for advancing localized CMP equipment, while Wonik IPS...
SEMI announced Mary Bischoping as its new Senior Director of Public Policy and Advocacy, based in Washington, D.C. Bischoping will steer SEMI’s engagement with U.S. lawmakers on supply‑chain resilience, intellectual‑property protection, tax policy, and emerging technologies such as AI and...
Cohu announced two customers placed follow‑on orders worth $30 million for its Eclipse platform with active thermal control to test next‑generation high‑performance computing processors. The orders, to be delivered over the next few quarters, deepen Cohu’s footprint in the rapidly expanding...
ACM Research announced a rebranding of its product line into the ACM Planetary Family, a process‑based portfolio organized around eight distinct series. Each series corresponds to a core step in semiconductor wafer and panel manufacturing, from cleaning to advanced packaging...
CEA‑Leti, CEA‑List and Powerchip Semiconductor Manufacturing Corporation (PSMC) announced a strategic partnership to fuse CEA‑List’s RISC‑V design expertise with CEA‑Leti’s silicon‑photonic microLED technology into PSMC’s 3D‑stacking and interposer platforms. The joint effort will embed short‑reach, high‑bandwidth optical links and customizable...
Infineon Technologies has unveiled the TDM24745T, a quad‑phase power module built on its TLVR (trans‑inductor voltage regulator) architecture for AI‑focused data centers. The 9 × 10 × 5 mm³ device packs four power stages, a TLVR inductor and decoupling capacitors, achieving a current density above...
Peak Nano and Advanced Conversion have teamed up to co‑develop DC‑link capacitors tailored for 800 V+ silicon‑carbide (SiC) inverter systems in electric vehicles and other e‑mobility platforms. The solution pairs Peak Nano’s NanoPlex LDF film, which holds a dissipation factor below...
STMicroelectronics launched the Smart STripFET F8 MOSFET series targeting automotive power‑distribution and battery‑management applications. The first part, STL059N4S8AG, is a 40 V, 420 A N‑channel device with a record‑low 0.59 mΩ RDS(on) in a compact PowerFLAT 5×6 package. Its high thermal conductivity, 175 °C rating...
Taiwan Semiconductor Manufacturing Co. (TSMC) will equip its second Japanese fab for 3 nm production starting in 2028, targeting a monthly output of roughly 15,000 12‑inch wafers. The plant joins an existing Japanese facility that began mass production in late 2024,...
Vishay introduced the VODA1275, an automotive‑grade MOSFET driver housed in an 8 mm SMD‑4 package with a 600 CTI mold compound, targeting high‑voltage EV and HEV systems. The device offers industry‑leading 80 µs turn‑on time—three times faster than rivals—alongside 1260 V peak isolation...
Japan's Mitsubishi Gas Chemical (MGC) announced a roughly 30% price increase across its electronic materials portfolio, including copper‑clad laminates, prepreg, and resin‑coated copper, effective April 1, 2026. The company attributes the hike to higher raw‑material costs, rising labor expenses, and increased...
AUROS Technology is finalizing qualification of its ultra‑precision thin‑film thickness metrology system with a leading domestic chipmaker, aiming to begin mass production this year. The tool measures film thickness at angstrom‑level accuracy, supporting etching, deposition and CMP processes, and could...
DEEPX announced on April 2 that its DX‑M1 neural processing unit has cleared Lotte Innovate’s proof‑of‑concept validation, prompting the two firms to move into a mass‑production phase. Lotte Innovate selected the DX‑M1 for its strong computational performance, efficient thermal management and...
The semiconductor industry is confronting a new supply bottleneck as China tightens export controls on tungsten, the raw material for tungsten hexafluoride (WF6) gas. Japanese WF6 producers, responsible for roughly 25% of global output, plan to cut production in the...
Mobilint announced a 70 billion won Series C round on April 1, backed by Praxis Capital Partners, POSCO Investment and K Partners. The funding will fuel development of next‑generation neural processing units, expand mass‑production capacity, and support global market entry. Mobilint’s AI chip portfolio...
Qualitas Semiconductor announced a design‑IP license agreement for its 2‑nanometer gate‑all‑around (GAA) MIPI C/D‑PHY, valued at roughly 1.3 billion won—about 21% of its projected 2024 revenue. The license, granted to a U.S. edge‑AI semiconductor firm, runs through March 30 2025 and carries no...
FuriosaAI announced mass production of its second‑generation Renegade AI chip, targeting 20,000 units in 2024 after an initial 4,000‑unit run. The chip upgrades to HBM3E memory, boosting capacity to 72 GB and delivering up to 20 petaflops per rack. Samsung SDS will...
MiTAC unveiled a next‑generation G‑Series server at NVIDIA GTC 2026, pairing dual AMD EPYC “Venice” CPUs with NVIDIA RTX Pro 6000 and 4500 Blackwell GPUs. The chassis places GPUs and Solidigm D7‑PS1010 PCIe Gen5 SSDs at the front, while NVIDIA ConnectX‑8 delivers eight 400 GbE...
C-Hawk Technology announced the opening of two new manufacturing facilities in Southeast Asia—a 200,000‑square‑foot plant in Johor Baru, Malaysia, and a 96,000‑square‑foot site in Ho Chi Minh City, Vietnam. The Malaysian location expands precision‑plastic production and adds PFA tube‑bending, while the Vietnamese factory...
IBM announced a strategic collaboration with Arm to create dual‑architecture hardware that blends IBM’s enterprise‑grade reliability and security with Arm’s power‑efficient designs. The partnership targets AI and data‑intensive workloads, emphasizing virtualization, high‑availability, and ecosystem growth. By integrating Arm‑based software environments...
PrismML emerged from stealth to launch the world’s first commercially viable 1‑bit large language model, the 8‑billion‑parameter Bonsai 8B. Built on Caltech research and trained on Google v4 TPUs, the model delivers performance comparable to full‑precision 8B models while using...
Embedded World 2026 showcased five new edge‑AI boards and modules aimed at industrial and IoT markets. Variscite’s VAR‑SMARC‑MX8M‑PLUS brings a 2.3 TOPS NPU and dual Gigabit Ethernet, while congatec’s Conga‑SMX95 pairs an NXP i.MX 95 CPU with a 2 TOPS eIQ Neutron accelerator...
Mitsubishi Electric has signed a memorandum of understanding to discuss integrating its power‑device operations with the semiconductor businesses of ROHM and Toshiba Electronic Devices, alongside Japan Industrial Partners and TBJ Holdings. The talks aim to create a globally competitive semiconductor...
USC researchers have built a memristor‑based memory chip that continues to function at 700 °C—hotter than molten lava—by stacking tungsten, hafnium oxide and a single‑atom graphene layer. The device stored data for over 50 hours without refresh, survived more than a billion...
NVIDIA announced a $2 billion investment in Marvell Technology to broaden its NVLink ecosystem and support custom AI infrastructure. The partnership will deliver NVLink Fusion, a high‑speed interconnect that lets customers build rack‑level heterogeneous AI systems using NVIDIA GPUs, CPUs, DPUs...
Kioxia has issued an end‑of‑life notice for its third‑generation 3D NAND products, including 64‑layer planar and sub‑96‑layer chips such as SLC, MLC and TLC. Sales will cease in September 2026 with final shipments ending by the close of 2028, giving customers...
Chinese AI and graphics chip makers have surged in 2025, capturing 41% of the domestic AI server market and cutting Nvidia's share to 55% from a claimed 95% peak. Huawei alone shipped over 812,000 AI chips, accounting for roughly half...
At GTC 2026, Nvidia announced record AI inference performance on the MLPerf v6.0 benchmark, driven by its Blackwell Ultra GPUs and a refreshed software stack. The company’s Dynamo inference framework and TensorRT‑LLM optimizations delivered up to 2.77× speed gains and cut...
Bourns announced an AEC‑Q‑compliant assembly option for its SSA‑2 analog current sensors, giving automotive, industrial and energy designers a qualified part without restarting the qualification process. The SSA‑2 series delivers precise current measurement, ultra‑low insertion loss and electrically isolated outputs...
Renesas introduced the TP65B110HRU, a 650‑V bidirectional GaN switch, at APEC 2026. The device merges a d‑mode GaN chip with silicon MOSFETs, offering 110 mΩ on‑resistance, a 3‑V gate threshold, and ±20‑V gate margin. Its true bidirectional operation enables single‑stage 500‑W solar...
Nexperia’s China unit is on the cusp of achieving fully localized semiconductor manufacturing, according to internal sources. The move will enable the Dutch‑headquartered, Chinese‑owned chipmaker to produce a broader portfolio of chips within mainland China. Local production is expected to...
DRAM prices stalled in March at $13 per 8 Gb DDR4 after an 11‑month rally, as supply agreements capped movement. Q1 pricing was largely set earlier, but quarterly contract prices still rose sharply from Q4. Samsung signaled a 40‑45% price hike...
