Semiconductors News and Headlines
Semiconductors News and Headlines
The 2026 memory market is rebounding, but the recovery is being reshaped by AI‑driven demand. TrendForce projects DRAM contract prices to climb 58‑63% QoQ and NAND Flash to surge 70‑75% QoQ in Q2. AI and data‑center expansion are pushing suppliers toward high‑margin products such as HBM, server DRAM, and enterprise SSDs, while traditional PC and consumer memory faces tighter allocation and higher costs. This creates a fragmented recovery, with infrastructure segments thriving and consumer segments lagging.
Infineon Technologies has launched the TDM24745T, a quad‑phase power module designed for AI server platforms. The compact 9 × 10 × 5 mm device integrates four power stages, a TLVR inductor and decoupling capacitors, achieving current densities above 2 A/mm² and peak currents up to 320 A....
Fujitsu and Rapidus announced a joint development of a 1.4 nm neural processing unit (NPU) aimed at AI inference in servers. The project, costing roughly 58 billion yen, will leverage Rapidus’s advanced node roadmap and Fujitsu’s Arm‑based Monaka CPU built on a...
onsemi announced that its next‑generation hybrid power integrated modules (PIMs) will be used in Sineng Electric’s 430 kW liquid‑cooled string energy storage system and 320 kW utility‑scale solar inverter. The FS7 IGBT and EliteSiC‑based F5BP modules deliver 32% higher power density and...
The article outlines a security framework for chiplet‑based systems, emphasizing that each chiplet must possess a verifiable identity tied to a platform‑wide trust chain. It describes two provisioning patterns—certificate‑based external provisioning and silicon‑derived (PUF) self‑generated keys—and explains how both feed...
Design teams moving to 3D‑IC architectures face intertwined power, thermal and mechanical challenges that can jeopardize yield and reliability. Traditional 2D verification tools fall short because stacked dies introduce new materials and complex inter‑dependencies. Siemens EDA’s Calibre 3DStress combined with...
The surge in AI infrastructure is creating a memory supercycle that pushes leading chipmakers to prioritize high‑margin products such as HBM, DDR5 and advanced NAND. DRAM prices are projected to jump roughly 90% quarter‑over‑quarter, while NAND could rise about 60%,...
Synopsys became the first company to earn ISO/PAS 8800 certification for its MACsec IP, a standard that secures Ethernet communication inside vehicles. The certification, validated by SGS TÜV Saar, confirms that the IP not only protects data integrity but also meets the...
The article examines how modern power electronics—especially multi‑level converters, silicon‑carbide (SiC) devices, and advanced power‑management ICs—are improving efficiency in electric vehicle (EV) and robot battery systems. It highlights fast‑charging challenges, noting that 15‑minute 0‑80% charges and 750 kW superchargers generate heat...
Bit flipping, once a rare reliability glitch, has become a systemic risk as semiconductor nodes shrink, clock speeds rise, and operating voltages drop, exposing aerospace, automotive and data‑center chips to silent data corruption. The phenomenon is driven by cosmic radiation,...
At Embedded World 2026, Synaptics demonstrated that artificial intelligence is moving off the cloud and onto the device, delivering real‑time, context‑aware capabilities at the edge. The company showcased the SYN765x platform, which bundles Wi‑Fi 7, Bluetooth 6.0 and on‑chip AI compute for...
Altera Corp. is deepening its two‑decade partnership with Arm by integrating its data‑center‑grade FPGAs with Arm’s new AGI CPU built on the Neoverse CSS V3 architecture. The combined solution targets AI‑focused data centers, promising low‑latency, highly flexible and scalable compute...
Molex announced the completion of its acquisition of Smiths Interconnect, the UK‑based subsidiary of Smiths Group, marking the largest deal in Molex’s history. The purchase adds a portfolio of ruggedized connectors, RF components, optical transceivers and semiconductor‑test expertise, extending Molex’s...
SEMI projects worldwide 300mm fab equipment spending to rise 18% to $133 billion in 2026 and surpass $150 billion in 2027, reaching $172 billion by 2029. The surge is driven by exploding AI chip demand for data‑center and edge workloads and by regional...
Taiwan is shifting its wide‑bandgap (WBG) strategy from pure device innovation to integrated packaging, testing, and system deployment. NIKO‑SEM, a fabless power‑semiconductor designer, has broadened its portfolio from silicon MOSFETs to silicon‑carbide (SiC) and gallium‑nitride (GaN) power modules. The island...
Infineon unveiled the TDM24745T quad‑phase power module, featuring a trans‑inductor voltage regulator (TLVR) architecture that delivers up to 320 A peak current in a 9×10×5 mm footprint. The module integrates four power stages, proprietary magnetics, and decoupling capacitors, achieving a current density...
Diodes has introduced the DMTH10H1M7SPGWQ, a 100‑V MOSFET that joins its existing 40‑80 V lineup for automotive applications. The device offers a low 1.5 mΩ on‑resistance, making it ideal for 48‑V BLDC motor drives in power‑steering and braking systems. Packaged in a...
Texas Instruments introduced two isolated DC/DC modules—UCC34141-Q1 and UCC33420—built on its IsoShield multichip packaging. The architecture co‑packs a planar transformer with the power stage, delivering up to three times the power density of traditional discrete solutions and shrinking board area...
Tower Semiconductor announced it will acquire full ownership of its 300mm Fab 7 in Uozu, Japan, while Nuvoton will take complete control of the 200mm Fab 5. The restructuring includes long‑term supply agreements to avoid any disruption for existing customers...
The World Trade Organization failed to extend the two‑year “Moratorium on Customs Duties on Electronic Transmissions” at its Yaoundé ministerial, allowing the measure to lapse. The moratorium has shielded digital goods, software services and semiconductor‑related data flows from tariffs for...
SEMI projects global 300mm fab equipment spending to rise 18% to $133 billion in 2026 and 14% to $151 billion in 2027. The surge is fueled by exploding AI chip demand for data centers and edge devices and by regional pushes for...
Intel announced a definitive agreement to repurchase Apollo’s 49% equity stake in the Fab 34 joint venture for $14.2 billion. The buy‑back will be financed with cash on hand and roughly $6.5 billion of new debt, aiming to restore full ownership of the...
EPC Space announced two new half‑bridge buck evaluation boards, the EPC7C010 (100 V/20 A) and EPC7C011 (200 V/10 A), built around radiation‑hardened eGaN HEMTs and isolated gate drivers. Both platforms are optimized for 350 kHz operation but can run from 50 kHz to 1.5 MHz, delivering peak...
AI workloads are pushing XPU power consumption from roughly 1‑1.5 kW today to over 5 kW by 2030. To handle the surge, hyperscale data centers are replacing traditional AC‑DC‑AC distribution with high‑voltage direct current (HVDC) architectures, using ±400 V or 800 V DC links....
SEC Co. has completed development of the Semi‑Scan‑SW, an automated inline X‑ray inspection system for high‑bandwidth memory (HBM) production. The tool detects internal defects as small as 3‑5 µm across HBM stacking, through‑glass‑via (TGV) and wafer‑level packaging (WLP) processes. SEC will...
Silvaco Group announced an expanded strategic partnership with Taiwan's Advanced Power Electronics Corp (APEC) to deepen the use of its Victory Device, Gateway, and SmartSpice simulation tools. The collaboration gives APEC broader access to Silvaco's TCAD and EDA solutions, aiming...
Apple announced a $400 million investment with U.S. suppliers Bosch, Cirrus Logic, TDK and Qnity Electronics to broaden domestic chip production, extending its broader $600 billion manufacturing plan. TDK will start U.S. sensor component fabrication for smartphone cameras, while Bosch will produce...
Japanese memory maker Kioxia announced it will discontinue a range of older NAND flash products built on 32 nm, 24 nm and 15 nm process nodes, including floating‑gate and BiCS FLASH gen.3 devices. The phase‑out covers SLC, MLC and TLC variants in wafer, BGA, TSOP,...
Semiconductor test equipment maker Aehr Test Systems announced an initial order from a major, unnamed networking supplier developing silicon‑photonic transceivers for hyperscale AI and cloud data centers. The order includes several FOX‑XP wafer‑level burn‑in systems capable of testing nine wafers...
Side‑channel leakage often surfaces only after first silicon, forcing expensive redesigns. The Inspector Pre‑Silicon framework embeds side‑channel analysis into RTL and gate‑level verification, generating test vectors and statistical metrics to identify leakage early. By providing actionable, module‑level insights throughout the...
Advanced nodes (5nm and below) accounted for over 50% of smartphone SoC shipments in 2025 and are projected to reach nearly 60% in 2026, according to Counterpoint Research. Samsung debuted its 2nm Exynos 2600 in the Galaxy S26, while Apple,...
Arrow Electronics has unified its global components business under a redesigned, omnichannel arrow.com platform, retiring the legacy MyArrow portal. The new site merges product selection, purchasing, services, and account management into a single digital workflow. It also embeds direct access...
Arm Holdings has launched the Arm AGI CPU, its first production silicon product aimed at AI data‑center workloads. The chip packs up to 136 Neoverse V3 cores, a 300‑watt TDP and can deliver more than twice the rack performance of...
The year‑long rally in DRAM prices paused in March as pre‑negotiated contracts locked the average 8 Gb DDR4 price at $13, ending 11 months of double‑digit growth. First‑quarter DRAM prices still surged 100‑115% versus the prior quarter, reflecting strong demand. TrendForce...
Telechips is accelerating its network gateway chip business, launching proof‑of‑concept projects with select global customers as it seeks a profitability turnaround. The company is simultaneously expanding AI‑integrated automotive semiconductor offerings for ADAS and autonomous driving, while upgrading its in‑vehicle infotainment...
Nvidia is investing another $2 billion in Marvell, extending a series of multi‑billion‑dollar bets aimed at shaping the AI datacenter supply chain. The partnership will have Marvell produce custom XPUs and NVLink Fusion‑compatible networking, leveraging its recent acquisition of XConn’s high‑bandwidth PCIe...
ZEISS introduced the Crossbeam 750 FIB‑SEM, a focused ion beam‑scanning electron microscope optimized for high‑accuracy sample preparation. The system features Gemini 4 electron optics and a high‑dynamic‑range Mill + SEM that provides a live, high‑resolution SEM view during any milling condition, enabling real‑time endpoint...
South Korean memory maker SK hynix has ordered a hybrid bonding inline system co‑developed by Applied Materials and BE Semiconductor Industries, valued at roughly 20 billion won. The equipment combines CMP and plasma modules with Besi’s die‑bonder, enabling mass‑production of next‑generation...
Metallium Ltd's US arm, Flash Metals USA, has signed a long‑term off‑take agreement with Indium Corp to purchase recovered gallium, germanium, copper, tin, gold and indium from Metallium's recycling operations. The contract runs for an initial ten years with automatic...
South Korean AI chip startup Mobilint has completed silicon proof‑of‑concept validation for its second‑generation NPU, Regulus, developed for Shinsegae Group’s AI‑powered checkout kiosks. The chip, fabricated on TSMC’s 12‑nm process, is slated for mass production in the second quarter and...
Samsung Electronics is rolling out hybrid bonding inspection equipment, partnering with Onto Innovation’s picosecond laser ultrasound system that is already being validated on mass‑production lines. The joint development targets detection of microscopic voids and overlay errors in high‑bandwidth memory (HBM)...
South Korean AI chip designer Rebellions Inc. closed a 640 billion won pre‑IPO funding round, valuing the company at 3.4 trillion won. The round, led by the state‑backed Korea National Growth Fund with 250 billion won, also included contributions from KDB and Mirae...
University of Florida researchers released a technical paper introducing a causal‑inference framework for analog‑mixed‑signal (AMS) circuit design. The method builds a directed‑acyclic graph from SPICE simulation data and estimates average treatment effects (ATE) to rank design parameters. Tested on three...
Semiconductor Today’s March 2026 issue spotlights rapid advances in compound semiconductors, noting a projected market size of roughly $5.2 bn by 2031 growing at a 14% CAGR. The publication highlights the ALP‑4‑SiC project for quantum photonic circuits, new growth methods for...
STMicroelectronics has launched two phase‑shift control ICs, the STNRG599A and STNRG599B, targeting resonant‑converter power supplies and lighting drivers. The devices operate up to 750 kHz, provide zero‑voltage switching, and improve no‑load efficiency while offering built‑in safety features such as X‑capacitor discharge...
Fujitsu announced plans to develop a dedicated AI inference NPU using Rapidus' 1.4 nm process, with an estimated development cost of ¥58 billion (about $363 million). The project, funded roughly two‑thirds by the New Energy and Industrial Technology Development Organization, will be designed...
Kioxia announced it will cease production of all 2D (planar) NAND flash and its third‑generation BiCS 3D NAND, with final shipments scheduled for December 31 2028. The phase‑out covers legacy 32nm, 24nm and 15nm planar nodes as well as early 64‑layer BiCS3...
QuantumDiamonds GmbH announced Peter Lemmens as Managing Director Asia, coinciding with the launch of a new regional hub in Taiwan. The hire leverages Lemmens' 25‑year semiconductor leadership and deep Taiwan network to accelerate adoption of the company’s quantum‑diamond microscopy (QDM)...
Researchers at UC Davis have demonstrated that halide perovskite crystals undergo rapid, reversible lattice distortions when illuminated, a phenomenon termed photostriction. Using laser excitation and X‑ray probing, they showed the effect can be tuned by adjusting the crystal composition, light wavelength,...
Apple’s latest M5 Pro and M5 Max chips are closing the performance gap with dedicated gaming PCs. Benchmarks by YouTuber Andrew Tsai show the M5 Pro delivering roughly 60 fps in upscaled 1440p on titles like Cyberpunk 2077, while the 40‑core M5 Max sustains similar frame rates...
