Infineon Launches EU Flagship Project Moore4Power

Why It Matters

Moore4Power accelerates Europe’s transition to sustainable, high‑efficiency power electronics, strengthening the continent’s clean‑energy agenda and industrial competitiveness.

Key Takeaways

• 62 European partners join Infineon's Moore4Power for heterogeneous integration
• Combines silicon, SiC, GaN chips with sensing and communication functions
• Targets 99% e‑mobility efficiency and 30% rail loss reduction
• AI models and digital twins aim to shrink development to one week
• Digital Product Passport embedded in modules provides real‑time health data for reuse

Pulse Analysis

Europe’s power‑electronics market has long lagged behind Asia and the United States, largely because traditional silicon‑only designs cannot meet the efficiency and integration demands of modern clean‑energy systems. Moore4Power, built on the success of the 2025 PowerizeD Chips JU project, represents a coordinated push to adopt a “More than Moore” philosophy, where silicon, silicon‑carbide (SiC) and gallium‑nitride (GaN) technologies coexist on modular chiplet architectures. This heterogeneous approach lets designers allocate each material to the function where it excels, delivering higher power density, lower losses and smaller footprints—critical advantages for next‑generation converters.

The project zeroes in on three high‑impact verticals: wind turbine converters, electric‑vehicle bidirectional chargers and railway traction drives. In wind applications, smarter converters can extract more energy from each turbine blade, while e‑mobility targets near‑loss‑free charging with up to 99% efficiency. Rail systems stand to gain at least a 30% reduction in propulsion losses, translating into substantial operational cost savings and CO₂ cuts. By aligning with the EU’s Clean Industrial Deal, Moore4Power not only promises greener performance but also positions European manufacturers to compete for global contracts in these fast‑growing markets.

Beyond hardware, Moore4Power reimagines the development cycle. AI‑driven models and digital twins enable parallel hardware‑software design, slashing the traditional weeks‑long validation window to a single week from fab sample to datasheet release. The integration of a Digital Product Passport directly into power modules provides continuous telemetry on operating conditions, health status and remaining life, facilitating predictive maintenance and end‑of‑life reuse. These innovations collectively lower total cost of ownership, extend product lifespans and feed into Europe’s circular‑economy objectives, setting a new benchmark for sustainable semiconductor development.