EU Project Team Aims to Significantly Reduce Onboard Charger Size Using GaN Chips
The EU‑funded HiPower 5.0 consortium is developing a 22 kW onboard charger that occupies just four litres, a third of the volume of current 12‑litre designs. The size cut is driven by bidirectional gallium‑nitride (GaN) switches supplied by Infineon, which combine the function of two silicon devices. Fraunhofer IZM leads system‑level integration, embedding components directly into printed‑circuit boards to reduce losses. The three‑year project, running to June 2028, is backed by roughly $36.7 million in EU funds and additional German support.
UK Gov't Teases New "AI Hardware Plan"
The UK government announced a forthcoming “AI Hardware Plan” aimed at capturing a 5% share of the global AI chip market. The initiative will debut at London Tech Week in June, backed by an initial £100 million ($125 million) fund for domestic...
US Halts Chip Gear Shipments To China’s Hua Hong
The U.S. Commerce Department has issued “is‑informed” letters to domestic semiconductor equipment makers, ordering them to stop shipments to Hua Hong’s Chinese fabs. Companies such as Lam Research, Applied Materials and KLA are among those notified. The move targets Hua Hong’s Fab 6...
BYD Hikes ADAS Price 21% as AI Demand Triggers DRAM Shortage
BYD announced a 21% price increase for its God’s Eye B ADAS, raising the option from roughly $1,450 to about $1,680 per vehicle starting in May. The hike targets select models across the Dynasty, Ocean, and Fang Cheng Bao lineups, while customers who...
SK Hynix Begins Mass Production of 192GB AI Server Memory
SK hynix has entered mass production of a 192GB SOCAMM2 memory module built on its sixth‑generation 10nm‑class LPDDR5X process. The module, aimed at AI servers, delivers more than double the bandwidth of conventional RDIMMs while cutting power use by over...
PCB Prices Rise on Supply Disruptions and AI Demand
PCB prices are climbing as supply of high‑purity PPE resin tightens after a Saudi petrochemical attack and copper‑foil costs surge 30% year‑to‑date. AI server demand remains strong, prompting chipmakers like AMD, Samsung and SK Hynix to increase PCB orders. Daeduck Electronics...
Microchip Launches PQC-Ready Root of Trust Controllers for Secure Platforms
Microchip Technology unveiled the TS1800 root‑of‑trust controller and the TS50x secure‑boot family, both engineered to run post‑quantum cryptography (PQC) algorithms. The TS1800 provides external root‑of‑trust functions with hardware acceleration for NIST‑standard PQC schemes such as ML‑DSA, LMS and ML‑KEM, while...
Supermicro Expands Data Center Building Block Portfolio
Super Micro Computer broadened its Data Center Building Block Solutions portfolio with two Arm‑based server platforms powered by the new Arm AGI CPU and added Open Compute Project (OCP) ORv3‑compliant rack offerings. The Arm servers come in 2U and 5U...
SCX.ai Doubles Down on AI Inferencing
Australian AI infrastructure startup SouthernCrossAI (SCX.ai) has joined Equinix’s Fabric AI ecosystem, making its ASIC‑powered inference nodes available to enterprises, government agencies, and developers across the network. The expansion will use SambaNova’s next‑generation SN50 Reconfigurable Dataflow Unit chips, delivering energy‑efficient,...
Texas A&M Begins $226M Semiconductor Institute Work
Texas A&M University broke ground on a $226 million semiconductor institute on its RELLIS campus, adding roughly 80,000 sq ft of research and training space. The project is funded by $113.7 million from the Texas Semiconductor Innovation fund and $48.1 million from Permanent University Fund...
Thailand Partners With UTAC to Strengthen Advanced Semiconductor Packaging Skills
Thailand’s National Science and Technology Development Agency (NSTDA) has signed a cooperation agreement with UTAC Thailand to boost advanced semiconductor packaging skills. The partnership will deliver joint training, research and workforce‑development programs that connect wafer fabrication with downstream packaging. It...
Archer Materials Advances Quantum and Biochip Platforms Ahead of Key 2026 Prototypes
Archer Materials reported notable advances in its quantum computing, sensing and medical diagnostics platforms during the March quarter while staying debt‑free with $10.3 million in cash. The company moved its 12CQ qubit program into the readout stage, completed the first phase...
IEEE Honors 2026 Recognizes Global Leaders in Engineering, AI, and Semiconductor Innovation
IEEE announced its 2026 honors slate, recognizing leading engineers, AI researchers, and semiconductor innovators worldwide. The ceremony highlighted the IEEE Medal of Honor awarded to AI pioneer Dr. Jane Doe, alongside new Fellowships for breakthroughs in chip lithography and quantum...
Amazon.com Inc (AMZN) Q1 2026 Earnings Call Transcript
Amazon posted $181.5 billion revenue, up 17% YoY, and a record 13.1% operating margin. AWS revenue jumped 28% YoY, adding $2 billion sequentially and reaching a $150 billion annualized run rate, with a $364 billion backlog that excludes a $100 billion Anthropic deal. The custom...
Everspin Technologies Inc (MRAM) Q1 2026 Earnings Call Transcript
Everspin Technologies reported Q1 2026 revenue of $14.9 million, a 14% year‑over‑year increase, driven by a 28% rise in MRAM product sales. The company secured a new two‑and‑a‑half‑year, $40 million subcontract with a U.S. prime defense contractor to provide Toggle MRAM technology....
Intel Says Software, Not More Cache, Is Key to Beating AMD in Gaming
Intel is reshaping its five‑year roadmap to prioritize software over raw silicon for gaming performance. VP Robert Hallock emphasized that optimized code, not just more cores or cache, will drive gains, unveiling the Binary Optimization Tool (BOT) that can boost...
NXP Rallies After Stronger Auto Market Bolsters Forecast
NXP Semiconductors lifted its second‑quarter revenue outlook to $3.35‑$3.55 billion, topping analysts’ consensus of $3.27 billion. The upbeat guidance reflects a rebound in automotive chip demand after a prolonged industry slowdown and lingering tariff worries. Shares jumped in late trading as investors...
Intel Reports Better-Than-Expected Results Due to Strong AI Demand
Intel posted a strong Q1 2026, with revenue climbing 7% to $13.6 billion, topping analysts’ expectations by over $1 billion. Non‑GAAP earnings per share surged to $0.29, far exceeding the $0.01 consensus. Growth was driven by robust demand for the new Series 3...
Lumai Debuts Iris Optical Compute System for Real-Time LLM Inference
Lumai announced the Iris optical compute server family, with the Iris Nova becoming the first commercial system to run billion‑parameter LLMs such as Llama 8B and 70B in real time. The photonic architecture replaces silicon transistors with a three‑dimensional light‑based...
Wide-Input Op Amps Deliver Precision Signal Conditioning
STMicroelectronics introduced the dual TSB192 precision op‑amp, targeting sensor‑heavy applications such as industrial automation, medical equipment, and electric‑vehicle battery‑management systems. The device uses a zero‑drift architecture to achieve a 20 µV maximum input offset and 100 nV/°C temperature drift, while consuming only...
Enterprises Need to Think Beyond GPUs for Agentic AI, Analysts Say
Enterprises are moving beyond GPU‑centric AI as agentic AI workloads prioritize inference over training. Analysts note that CPUs are re‑emerging as the orchestration layer, while specialized ASICs deliver higher efficiency and lower total cost of ownership. Major cloud providers are...
The Chip That Made Hardware Rewriteable
The IEEE honored the first field‑programmable gate array (FPGA) with a Milestone plaque at AMD’s former Xilinx campus on March 12, recognizing the 1985 XC2064 as the origin of reconfigurable silicon. That chip introduced 64 programmable logic blocks and configurable routing,...
Compact 3-A Buck Converter Powers Smart Meters, Consumer Appliances
STMicroelectronics introduced the DCP3603, a monolithic 3‑amp buck converter, at APEC 2026. The tiny 3 × 1.6 mm device operates from 3.3‑ to 36 V input and offers fixed 500 kHz or 1 MHz switching frequencies with forced‑PWM or pulse‑skipping modes. It integrates power switches and compensation, requiring...
Microarchitecture Tailored to 3D-Stacked Near-Memory Processing LLM Decoding (U. Of Edinburgh, Peking U., Cambridge Et Al.)
Researchers from Edinburgh, Peking, Cambridge and other institutions released a paper proposing a new micro‑architecture for 3D‑stacked near‑memory processing (NMP) that targets large‑language‑model (LLM) decoding. By swapping traditional MAC‑tree compute units for a compact, reconfigurable systolic array and leveraging an...
NVIDIA Adds 12GB GeForce RTX 5070 Laptop GPU Option
NVIDIA announced a 12 GB version of its GeForce RTX 5070 laptop GPU, built on 24 Gb GDDR7 memory chips. The new configuration joins the existing 8 GB model, giving notebook makers a higher‑capacity option without redesigning the core GPU. By leveraging higher‑density memory,...
Alumina Nanowires Improve Thermal Management in Advanced Packaging (Georgia Tech Et Al.)
Georgia Tech researchers demonstrated that epoxy composites reinforced with ultralong Al₂O₃ nanowires dramatically improve thermal interface material (TIM) performance for 2.5D/3D semiconductor packaging. At a 28 wt% filler loading, a vertically aligned nanowire architecture achieved 0.78 W/(m·K) out‑of‑plane conductivity—72 % higher than conventional...
Advancing the Chiplet Ecosystem
Arm unveiled its Chiplet System Architecture (CSA), a set of partitioning and connectivity standards designed to unify the emerging chiplet ecosystem. Chiplets enable modular SoC designs that can mix CPUs, GPUs, NPUs, memory and I/O, delivering higher performance with lower...
Demand Surge Fuels Taiwan Semiconductor Manufacturing Company’s (TSM) Rally
Taiwan Semiconductor Manufacturing Company (TSM) posted a 25% revenue jump in Q1 2026, with March sales up 45% year‑over‑year, as AI compute demand accelerates. The stock surged 18.81% in the past month and 135.98% over the last 52 weeks, closing...
Altair Semiconductor Spins Off From Sony to Focus on 5G IoT and eRedCap Strategy
Altair Semiconductor has completed a spin‑off from Sony Semiconductor Solutions, backed by $50 million in new funding led by Pitango Group. The independent company will double‑down on low‑power cellular IoT chipsets and a 5G eRedCap roadmap, highlighted by the upcoming ALT1550...
Infineon Provides MEMS Technology for Valeo’s Ground Projection Module Based on Laser Beam Scanning Presented at 2026 Auto Beijing
Infineon and Valeo unveiled a short‑distance ground projection module at Auto Beijing 2026, integrating Infineon’s 2D MEMS mirror and controller into Valeo’s high‑definition, bi‑color projector. The system delivers superior brightness, contrast and resolution for daytime visibility and is positioned for...
ACM Research Ships First PECVD SiCN System for Advanced Semiconductor Applications
ACM Research announced the shipment of its first plasma‑enhanced chemical vapor deposition (PECVD) silicon carbonitride (SiCN) system to a leading semiconductor maker. The equipment, part of the Saturn Series, features a world‑first three‑station deposition architecture that splits film growth across...
Sandisk Open-Sources Accelerated SSD Pre-Conditioning Algorithm
SanDisk has open‑sourced its accelerated SSD pre‑conditioning algorithm, SPRandom, as an extension to the FIO testing tool. The method reduces the traditional conditioning window—from up to 250 hours for 256 TB drives—to roughly 6½ hours, a drop of more than 95 percent. SPRandom writes...
Liquid Instruments Lands $50M to Scale AI-Driven Test and Measurement Platform
Liquid Instruments announced a $50 million Series C round, bringing its total funding above $100 million. The capital, co‑led by Keysight Technologies and Australia’s National Reconstruction Fund, will accelerate development of its AI‑driven, software‑defined test platform. The company’s flagship Moku device uses FPGA...
Tenstorrent Unveils Next-Gen Servers for Fast Tokens, No Disaggregation Needed
Tenstorrent introduced its Galaxy Blackhole AI server, a 6U rack housing 32 Blackhole chips that deliver 23 PFLOPS of FP8 performance and handle both pre‑fill and decode without disaggregation. The system can run in Regular or Blitz mode, with Blitz achieving...
Sapphire NITRO+ PhantomLink X870EA and Radeon RX 9070 XT Review
Sapphire has launched the NITRO+ PhantomLink ecosystem, pairing its custom AM5 motherboard X870EA with the Radeon RX 9070 XT GPU. The centerpiece is a proprietary PhantomLink connector that routes power directly from the motherboard to the graphics card, removing traditional external power...
Nokia, Blaize, and Datacomm Diangraha Unite to Deliver Hybrid AI Inference Across Indonesia and Southeast Asia
Blaize, Nokia and Indonesia’s PT Datacomm Diangraha announced a three‑way strategic partnership to deliver hybrid AI inference infrastructure across Indonesia and the broader APAC region. The collaboration combines Nokia’s networking and telco‑grade GPU capabilities with Blaize’s programmable, energy‑efficient edge AI compute, and...
Indium Corporation Joins India’s IDSPS Industry Consortium Partnership
Indium Corporation announced its participation in India’s Design, Semiconductor, Packaging and Systems (IDSPS) consortium, a government‑backed initiative to boost semiconductor R&D, workforce development and supply‑chain capacity. The program brings together roughly 50 leading faculty members from institutions such as the...
Tech's Hyperscalers Face Wall Street for First Time Since U.S. Iran War Sent Oil Prices Soaring
Tech hyperscalers—including Alphabet, Amazon, Meta and Microsoft—are set to report earnings amid heightened geopolitical tension after the U.S. and Israel’s attacks on Iran. The conflict has driven oil prices up roughly 50%, disrupted helium production, and intensified an existing memory...
Onsemi and Geely Expand Collaboration to Support Next-Gen 900V EV Architectures
onsemi and Geely have deepened a global partnership to embed onsemi’s EliteSiC silicon‑carbide technology into Geely’s SEA‑S‑based Super Electric Power (SEP) system. The collaboration targets 900 V vehicle architectures, promising faster acceleration, longer range and dramatically reduced charging times. By leveraging...
Omdia Lifts 2026 Semiconductor Outlook as AI-Driven Memory Constraints Intensify
Omdia has lifted its 2026 semiconductor revenue outlook to a 62.7% increase, driven by surging AI‑related demand and persistent memory shortages. The firm expects DRAM revenue to nearly double and NAND to grow to almost four times its 2025 level,...
Vendor Slaps Extra 'Memory Fee' On Each Tech Purchase Amid Global Chip Crunch — the More You Buy, the More...
Ubiquiti announced a new “Memory Surcharge” of up to 5.8% on products sold through its official online store, effective April 24 2026. The fee is a direct response to persistent global memory and storage shortages that have driven component costs higher. Prices...
Intel Lifts Margins by Selling Lower-Grade Chips as AI Demand Tightens CPU Supply
Intel reported first‑quarter revenue of $13.6 billion, surpassing the $12.36 billion forecast, and a non‑GAAP gross margin of 41%, well above its 34.5% guidance. The margin lift stems from a new sales approach that packages lower‑yield, edge‑die CPUs as discounted SKUs instead...
ROHM Launches NFC Wireless Power Chipset for Compact Wearables
ROHM introduced the ML7670 receiver and ML7671 transmitter, an NFC‑based wireless power chipset that delivers up to 250 mW to compact wearables such as smart rings and bands. The solution operates in the 13.56 MHz NFC band, enabling a much smaller antenna...
What the DRAM Crunch Teaches Us About System Design
Rising DRAM prices—now three to four times last year’s levels—and tightening supply are reshaping AI system design. High‑capacity memory for data‑center workloads faces long lead times, while 1‑2 GB modules remain relatively stable. Companies are turning to edge AI accelerators that...
ASML as the Last Polite Monopolist
TSMC has publicly challenged ASML’s €350 million (≈$381 million) price for its upcoming High‑NA EUV lithography tools, highlighting a rare clash between the world’s sole EUV supplier and its dominant fab customer. The article argues that while equipment catalogs are open, the...
Broadcom Hits $2 Trillion Market Cap as Google Reveals New AI Chips
Broadcom’s market value topped $2 trillion after Google unveiled its eighth‑generation Tensor Processing Units, which now come as two distinct chips—a training‑focused TPU 8t and an inference‑focused TPU 8i. The dual‑chip approach promises roughly 80 % better performance per dollar for inference, potentially doubling...
Banana Pi BPI-SM10 Brings RISC-V AI Platform With 60 TOPS Performance
Banana Pi unveiled the BPI‑SM10 development board, a RISC‑V platform powered by the 8‑core SpacemiT K3 processor. The board integrates a dedicated AI accelerator capable of 60 TOPS and supports up to 32 GB of LPDDR5‑6400 memory while consuming 18‑35 W. It offers extensive...
Beijing Intellectual Property Court Upholds Validity of Innoscience’s GaN Patents
China’s Beijing Intellectual Property Court upheld the validity of Innoscience’s two core gallium‑nitride (GaN) invention patents, rejecting invalidation attempts by Germany’s Infineon Technologies. The rulings follow favorable decisions by the China National Intellectual Property Administration in November 2025 that affirmed all...
Aeluma Appoints Willy Rachmady as VP of Strategic Partnerships and Ecosystem
Aeluma Inc. has appointed Willy Rachmady, Ph.D., as vice president of strategic partnerships and ecosystem. Reporting to CEO Jonathan Klamkin, Rachmady will oversee foundry alliances, customer engineering, and technology commercialization across silicon photonics and compound‑semiconductor platforms. He arrives with more...
ST Redefines Entry-Level MCU Performance and Value
STMicroelectronics introduced the STM32C5, a new entry‑level microcontroller built on its 40 nm process, promising noticeably faster execution than typical low‑cost MCUs. The chip targets a wide range of consumer and industrial devices, from smart thermostats to EV chargers, while keeping...