Sitan Semiconductor, Changelight Form Partnership, Deepening Micro-LED Industry Chain Collaboration
Xiamen‑based Sitan Semiconductor and Changelight have signed a strategic partnership to create a vertically integrated micro‑LED supply chain for automotive displays. The collaboration links Sitan’s CMOS driver and module‑packaging expertise with Changelight’s sapphire epitaxy and chip production, targeting die‑to‑die and wafer‑to‑wafer processes. Both firms already hold development contracts with Tier 1 auto suppliers and aim to lower costs while meeting stringent automotive reliability standards. The goal is a domestic, closed‑loop ecosystem that can challenge foreign component dominance.
Samsung Reveals Next-Gen Stretchable Display
Samsung Display unveiled a stretchable microLED instrument cluster at SID Display Week 2026, delivering a world‑leading 200 PPI resolution—about 67 percent higher than its 120 PPI predecessor. The panel uses a novel bridge structure that doubles pixel density while preserving electrical performance during...
India Approves Compound Semiconductor Plant
The Indian government has approved a $336 million investment by Crystal Matrix to build the country’s first commercial GaN‑based microLED and miniLED fab in Gujarat’s Dholera zone. The integrated facility will produce 6‑inch wafers and assemble display modules, targeting a yearly...
Cloudberry VC Launches Europe's First Semiconductor Venture Fund
Cloudberry VC, a Helsinki‑London venture firm, has launched Europe’s first dedicated semiconductor fund, closing an initial €30 million (~$32.5 million) round. About 85% of the capital came from international investors, and strategic limited partners such as GlobalFoundries and Radiant Opto‑Electronics are on...
Greenock Semiconductor Plant Boosts Efficiency Through Smarter Use of Data
Engineers at Diodes Incorporated’s Greenock wafer fab have teamed with the National Manufacturing Institute Scotland to overhaul how production data is captured and analysed. By swapping manual spreadsheet workflows for Python‑based pipelines and specialist semiconductor tools, the plant now generates...
AMD Ryzen 7 PRO 9755 Surfaces With Slight Multi-Core Performance Gain
AMD’s Ryzen 7 PRO 9755 has surfaced in the PassMark database, indicating a new addition to the company’s Ryzen PRO 9000 desktop family. The chip matches the 9745’s 8‑core/16‑thread design and 65 W TDP but delivers a modest 2.7% multi‑core performance gain, while single‑thread scores...
Dell, AMD Expand On-Prem AI Platform with Instinct MI350P GPU Support
Dell and AMD announced that Dell PowerEdge XE7745, R7725 and XE9785 servers will support AMD Instinct MI350P (and MI355X) GPUs, delivering up to 4,600 teraflops of peak performance and 144 GB of HBM3e memory per card. The solution offers a drop‑in,...
Fraunhofer IZM’s Novel SiC Inverter Hits 99% Efficiency in a 1-Liter Package for 800 V EV Drives
Fraunhofer IZM unveiled a 500‑kW silicon‑carbide inverter that occupies just one liter, delivering more than 99 % peak efficiency for 800‑V electric‑vehicle drives. The design embeds twelve SiC MOSFETs per phase directly on the PCB, uses a flat aluminum heat sink...
The Need for Speed: How Domestic Manufacturing Accelerates Delivery of Mission-Critical Technology
Intel’s Government Technologies VP argues that U.S. defense superiority now hinges on speed, not just capability. He highlights how legacy acquisition models and offshore supply chains slow microelectronics delivery, jeopardizing deterrence. Emerging practices—hardware‑accurate digital twins, emulation, and Intel’s domestic 18A...
Schematik
Schematik, backed by Lightspeed Venture Partners in a 2026 pre‑seed round, is launching one of the first generative AI platforms that translates plain‑English design requests into hardware code, wiring diagrams, component lists, and assembly instructions. Founder Sam Beek, who previously...
Memory Is No Longer a Commodity – The Industry Hasn't Fully Caught Up
The global semiconductor market is on track to hit $1.2 trillion this year, with memory projected to capture 30‑35% of that total. A shift from a fragmented DRAM landscape to an oligopoly dominated by Samsung, SK Hynix, Micron and emerging player CXMT...
Nanoscale Design Channels Hybrid Light–Vibration Waves to Carry Heat More Efficiently
Researchers at the National University of Singapore have demonstrated that surface phonon polaritons—hybrid light‑vibration waves—can channel heat across nanoscale silicon‑dioxide bridges with far less loss than conventional phonon diffusion. By adding a micrometer‑scale grating to a suspended micro‑thermometer, they boosted...
A Tough Question
Infineon still controls 77% of Qimonda, a DRAM subsidiary that has become a financial drain. Qimonda recently cut 600 jobs in Dresden and is paying roughly $5,450 per former Infineon employee who jumps ship. Infineon has written down the Qimonda...
Defense Department Increases Microelectronics Workforce Program Contract to $100M
The U.S. Department of Defense has raised its investment in the Scalable Asymmetric Lifecycle Engagement (SCALE) microelectronics workforce program to more than $100 million, extending funding through fiscal year 2027. The boost supports 35 partner universities, expanding hands‑on training for veterans...
Cost-Effective High-Performance Flip Chip MicroLeadFrame®(fcMLF®) Package Introduction
Amkor Technology unveiled its flip‑chip MicroLeadFrame (fcMLF) package, merging flip‑chip interconnects with traditional leadframe construction. The solution targets automotive and commercial markets that demand smaller footprints, superior thermal and electrical performance, and proven reliability. By using copper‑pillar bumps and a...
Single Switch Controls Sequential Operation of Multiple Power Supplies
A simple analog circuit uses a charging capacitor and comparators to sequence the power‑up and power‑down of multiple DC supplies with a single ON/OFF switch. The design first enables 5 V, then after a programmable delay adds 15 V, and reverses the...
Keysight Adds PCIe 7.0 Receiver Test Application
Keysight Technologies announced a new PCIe 7.0 receiver (RX) test application that extends its PCIe 7.0 portfolio to cover end‑to‑end transmitter and receiver validation. The solution pairs the M8050A BERT system with the M8042A pattern generator, M8043A error analyzer, and N5991PB7A automation...
'Regardless of the Type of Offer, Available Capacity Is Essentially Zero Right Now': SK Hynix Is Reportedly Being Swamped with...
SK Hynix, the world’s second‑largest memory maker, is inundated with unprecedented offers from big‑tech firms seeking to secure DDR5 and NAND chips amid a global memory shortage. Reuters reports that capacity is effectively zero, with no allocation possible for individual...
ADATA Expects Memory Shortage to Continue as AI Demand Grows
ADATA Technology warned that AI‑driven demand is tightening the global memory market, keeping DRAM and NAND supplies scarce through next year. Prices for DRAM have already risen in the first half of 2025, while NAND flash is expected to gain...
Micron Says AI Memory Shortage Could Last Until 2028
Micron CEO Sanjay Mehrotra warned that the AI‑driven memory shortage could persist until 2028 as demand for DRAM and NAND outpaces production capacity. AI‑related memory now accounts for more than half of the industry’s addressable market this year, while traditional...
Decoupled by Design: How Gateworks and NXP Are Rethinking Edge AI Architecture
Gateworks and NXP have launched the GW16168 M.2 AI accelerator, pairing NXP’s Ara240 discrete neural processing unit with a 16 GB LPDDR4‑backed card that delivers roughly 40 eTOPS at a typical 12 W power envelope. The decoupled architecture lets industrial single‑board computers...
Sony, TSMC Agree to Cooperate on Next-Generation Image Sensor Development
Sony Semiconductor Solutions and Taiwan Semiconductor Manufacturing Co. announced a joint venture to develop and produce next‑generation image sensors at Sony's new plant in Kumamoto, Japan. Sony will hold a majority stake, leveraging its sensor design expertise while TSMC contributes...
TSMC’s Sales Grow Slowest in Months Even as AI Buildout Persists
Taiwan Semiconductor Manufacturing Co. (TSMC) reported April sales up 17.5% to NT$410.7 billion (about $13.1 billion), the slowest monthly growth since October. The modest rise reflects a plateau in smartphone and consumer‑electronics demand, even as AI‑driven chip orders stay robust. Analysts expect...
OpenAI's Secret Sauce for Networking Is Now an Open Protocol. What Does It Mean for Inference?
OpenAI unveiled Multipath Reliable Connection (MRC), an open networking protocol designed to speed and stabilize data transfer between GPU clusters in massive supercomputers. The protocol, developed with AMD, Broadcom, Intel, Microsoft and NVIDIA, can link more than 130,000 GPUs using...
Baidu Chip Unit Kunlunxin Eyes US$14.7b Valuation in Hong Kong IPO: Sources
Kunlunxin, Baidu's AI‑chip subsidiary, is targeting a Hong Kong IPO with a valuation of at least 100 billion yuan (approximately US$14.7 billion). The unit recently launched its XPU‑R processor, aiming to power large‑language models and reduce reliance on foreign silicon. By listing in...
When Cloud Giants Meddle in Markets
Hyperscale cloud providers are buying massive volumes of DRAM and high‑bandwidth memory to fuel AI workloads, effectively hoarding a finite supply. Their pre‑emptive procurement pushes component prices higher for downstream enterprise buyers, inflating refresh costs and lengthening lead times. As...
GCT Taps Satellite Partner to Speed 5G Rollout
GCT Semiconductor has signed a reference platform agreement with a major satellite communications provider to speed the creation of 5G user equipment that works across satellite and terrestrial networks. The deal builds on an earlier chipset licensing pact and delivers...
ITC Affirms Initial Determination that Innoscience Infringed Infineon GaN Patent
The U.S. International Trade Commission affirmed its December 2025 finding that China‑based Innoscience infringed Infineon Technologies' gallium‑nitride (GaN) patent, ordering bans on imports and sales of the company's 8‑inch GaN‑on‑silicon chips. The decision is subject to a 60‑day presidential review...
Delft-Based FrostByte Secures a Cool €1.3 Million to Scale Cryogenic Electronics for Quantum Computing
Delft‑based FrostByte, a spin‑off from TU Delft and QuTech, announced a €1.3 million (≈$1.4 million) funding round led by InnovationQuarter Capital, Graduate Ventures, Paeonia Group, UNIIQ and an angel investor. The capital will fund team expansion, scale production of cryogenic switches, and...
Aixtron Supplies Planetary G5+C MOCVD Systems to Renesas
Aixtron SE has delivered multiple Planetary G5+C metal‑organic chemical vapor deposition (MOCVD) systems to Renesas Electronics, expanding the Japanese firm’s gallium nitride (GaN) production capacity for high‑volume manufacturing. The equipment, already operational, supports Renesas’ push into power‑dense applications such as...
Chip Industry Week In Review
The chip industry is seeing massive new investments, from ASE and WUS’s $1.1 billion advanced‑packaging hub in Taiwan to SpaceX’s proposed "Terafab" semiconductor complex in Texas that could total up to $119 billion. Apple is quietly discussing U.S. production of its main...
SiTime Posts 88% Revenue Growth on AI Infrastructure Demand
SiTime reported first‑quarter 2026 revenue of $113.6 million, an 88.3% year‑over‑year increase driven by soaring demand for precision timing in AI data‑center and high‑performance computing systems. While the company posted a GAAP net loss of $5.2 million, non‑GAAP earnings surged to $38.9 million,...
Infrared LEDs Support In-Cabin Sensing for Vehicle Safety
ams OSRAM introduced its OSLON Black IR:6 C‑Series infrared LEDs, a 940 nm high‑power solution designed for camera‑based in‑cabin driver and occupant monitoring. The LEDs suppress the visible red‑glow effect, delivering low‑visibility illumination that works across changing lighting conditions. By targeting...
Infineon Rad-Hard Chips Performed Flawlessly on Artemis II
NASA’s Artemis II mission completed a 10‑day crewed flight that set a new record for distance from Earth, while simultaneously proving the reliability of Infineon Technologies’ radiation‑hardened semiconductor portfolio. Infineon’s IR HiRel rad‑hard devices powered critical Orion systems, including power supply, control...
Delta Electronics Showcases Advance Semiconductor Packaging Solutions at SEMICON SEA 2026
Delta Electronics used SEMICON Southeast Asia 2026 to unveil a suite of AI‑enabled smart manufacturing solutions aimed at accelerating advanced semiconductor packaging. The showcase highlighted precision motion hardware such as the ASDA‑W3 multi‑axis servo and sub‑micron Linear Positioning Link, as...
AMD Powers Zyphra Cloud
Zyphra has partnered with AMD to power its Zyphra Cloud full‑stack AI platform using AMD Instinct MI355X GPUs on TensorWave’s purpose‑built infrastructure. The service launches with Zyphra Inference, a serverless offering that supports frontier open‑weight models such as DeepSeek V3.2,...
Iren’s Stock Soars as a Major Nvidia Investment Overshadows Revenue Shortfall
Iren’s shares surged after the company disclosed a strategic partnership with Nvidia that includes a five‑year right to purchase 30 million shares at $70 each, valuing the deal at up to $2.1 billion. The collaboration will see Iren deploy 5 gigawatts of infrastructure...
Focused Helium Ions Create Ferroelectric Regions in Aluminum Nitride for Lower-Power Chips
Scientists at Oak Ridge National Laboratory have demonstrated that a tightly focused helium‑ion beam can write ferroelectric regions directly into aluminum nitride (AlN). The ion‑induced defects enable polarization switching with roughly 40% less energy and a stronger piezoresponse. Because AlN...
Elon Musk’s Texas Chip Plant Could Cost $119B, Filings Show
Elon Musk’s SpaceX has filed plans for a massive semiconductor complex in East Texas dubbed “Terafab,” with projected costs soaring to $119 billion. The facility, which would serve Tesla, xAI and SpaceX, includes a $3 billion research fab in Austin and an...
Integrated Voltage Regulators Help Pull Heat Out of Processors
AI accelerators in data centers are moving power conversion beneath the processor to cut parasitic losses and improve transient response. Empower Semiconductor’s Crescendo integrated voltage regulator (IVR) packs the converter, inductors and capacitors into an ultra‑thin chip, offering up to...
Kensington Boosts Charging Efficiency with New GaN Products
Kensington has broadened its USB‑C gallium‑nitride charging line with a 70W three‑port adapter, a 140W four‑port adapter, and a 240W USB‑C to USB‑C cable. The GaN‑based devices deliver high‑speed power while staying compact and cool, thanks to superior efficiency over...
AMD Instinct MI350P PCIe Targets Air-Cooled Enterprise AI Servers
AMD unveiled the Instinct MI350P PCIe GPU, a dual‑slot accelerator aimed at AI inference in existing air‑cooled data‑center servers. The card packs 144 GB of HBM3E memory delivering up to 4 TB/s bandwidth and claims up to 2,299 TFLOPS (4,600 TFLOPS MXFP4) performance. It...
Nota AI Signs AI Optimization Technology Supply and Strategic Partnership Agreement with Mobilint Accelerating Commercialization of On-Device AI on Domestic...
Nota AI, a specialist in AI model compression, has signed a strategic supply agreement with Korean NPU maker Mobilint to embed its NetsPresso® optimization platform into Mobilint’s MLA100 and MLA400 chips. The partnership aims to deliver low‑power, high‑performance edge AI...
AMD's Next Epyc Server Chip Debuts This Year with 256 Cores and 70% Better Performance
AMD confirmed that its next‑generation Epyc Venice processors, built on the Zen 6 architecture, will ship later this year. The chips will use TSMC’s 2 nm process, delivering up to 256 cores, a 70% performance uplift and roughly double the CPU‑to‑GPU bandwidth...
Semiconductor Design and Verification Services | ASIC, SoC & IC Development Partners
Semiconductor design and verification services guide companies from architecture through tape‑out, covering ASIC, SoC, FPGA, analog, and mixed‑signal projects. The offering includes RTL coding, IP integration, functional and formal verification, DFT, physical design, and post‑silicon validation. AnySilicon connects firms with...
Semiconductor Manufacturing Cost Breakdown | Wafer, Packaging, Test & ASIC Cost Factors
AnySilicon published a detailed guide that breaks down every cost component involved in semiconductor manufacturing, from design and NRE to wafer fabrication, packaging, test, and logistics. The guide highlights how process node, wafer diameter, die size, yield, mask set expense,...
Tiny xMEMS Chip Aims to Keep SSDs From Losing Their Cool
xMEMS introduced a 1 mm‑thick µCooling chip that actively moves air inside solid‑state drives, preventing thermal throttling that can shave 20‑30% off sustained throughput. The piezoMEMS device uses tiny piezoelectric paddles to generate up to 28 cc/s of airflow while consuming just...
RF Amplifiers Expand High-Power Range
Rohde & Schwarz has broadened its BBA300 broadband amplifier family with two new single‑band models delivering 500 W and 1 kW P1dB output power. The BBA300‑DE500 and BBA300‑DE1000 operate continuously from 1 GHz to 6 GHz without the need for band switching, improving efficiency...
Controllers Bring PQC to Boot and Root of Trust
Microchip introduced the TS1800 root‑of‑trust controller and the TS50x secure‑boot controller, expanding its TrustShield portfolio with hardware‑accelerated post‑quantum cryptography (PQC). The TS1800, built on a 192 MHz Cortex‑M4F, offers full platform root‑of‑trust features, OCP compliance, and up to double the processing...
SCALINX Joins GlobalFoundries GlobalSolutions Ecosystem to Expand High-Speed Data Converter SoC Solutions
SCALINX has joined GlobalFoundries' GlobalSolutions ecosystem, gaining visibility on the partner portal and offering its mixed‑signal ASIC design services on GF’s low‑power 40 nm and FDX processes. The company unveiled new high‑performance data‑converter IP—a 14‑bit, 4 GS/s ADC and a 14‑bit, 8 GS/s...