Intel's Upcoming 42-Core Nova Lake SKU Allegedly Upgraded to 44 Cores — New Config Frees up 6P+12E Tiles that Could...
Intel’s upcoming Nova Lake‑S desktop processor line has a leaked 44‑core SKU, replacing the previously announced 42‑core model by using two identical 8P+12E compute tiles. The change frees up 6P+12E tiles, which could be sold as lower‑priced, locked non‑K variants that still include on‑die big last‑level cache (bLLC). Intel may brand the highest‑end, 288 MB bLLC models as a new "Core Ultra X" segment, intensifying competition with AMD’s Zen 6 X3D. The launch is now expected in the second half of 2026 or possibly 2027 due to supply constraints.
Opening the Door to More Efficient Orbitronic Devices
Researchers at North Carolina State University and an international team have unveiled a new technique to generate orbital currents using chiral phonons. The method transfers angular momentum from circularly vibrating atoms directly to electrons in non‑magnetic, inexpensive materials. Published in...
Nvidia AI Tech Claims to Slash Gaming GPU Memory Usage by 85% with Zero Quality Loss — Neural Texture Compression...
Nvidia showcased Neural Texture Compression (NTC), an AI‑driven method that compresses game textures dramatically. In a demo, a scene that required 6.5 GB of VRAM with traditional block compression ran on just 970 MB using NTC, with no visible loss in image...
Samsung Electronics Names KCTech, Wonik IPS Among Top Suppliers at 2026 Partner Day
Samsung Electronics held its 2026 Device Solutions Division Mutual Growth Cooperation Day, honoring 17 top suppliers for achievements in technology, cost efficiency and ESG performance. KCTech received the highest technology innovation award for advancing localized CMP equipment, while Wonik IPS...
SEMI Appoints Mary Bischoping as Senior Director of Public Policy and Advocacy
SEMI announced Mary Bischoping as its new Senior Director of Public Policy and Advocacy, based in Washington, D.C. Bischoping will steer SEMI’s engagement with U.S. lawmakers on supply‑chain resilience, intellectual‑property protection, tax policy, and emerging technologies such as AI and...
Cohu Announces $30 Million Follow-On Orders for High-Performance Computing Test
Cohu announced two customers placed follow‑on orders worth $30 million for its Eclipse platform with active thermal control to test next‑generation high‑performance computing processors. The orders, to be delivered over the next few quarters, deepen Cohu’s footprint in the rapidly expanding...
ACM Research Introduces ACM Planetary Family Product Portfolio Structure
ACM Research announced a rebranding of its product line into the ACM Planetary Family, a process‑based portfolio organized around eight distinct series. Each series corresponds to a core step in semiconductor wafer and panel manufacturing, from cleaning to advanced packaging...
CEA-Leti, CEA-List and PSMC Collaborate to Integrate RISC-V and MicroLED Silicon Photonics Into 3D Stacking and Interposer for...
CEA‑Leti, CEA‑List and Powerchip Semiconductor Manufacturing Corporation (PSMC) announced a strategic partnership to fuse CEA‑List’s RISC‑V design expertise with CEA‑Leti’s silicon‑photonic microLED technology into PSMC’s 3D‑stacking and interposer platforms. The joint effort will embed short‑reach, high‑bandwidth optical links and customizable...
Infineon Launches TLVR Quad-Phase AI Power Module
Infineon Technologies has unveiled the TDM24745T, a quad‑phase power module built on its TLVR (trans‑inductor voltage regulator) architecture for AI‑focused data centers. The 9 × 10 × 5 mm³ device packs four power stages, a TLVR inductor and decoupling capacitors, achieving a current density above...
OpenLight Pushes Photonic Integration as AI Networks Drive Optical Scaling
OpenLight unveiled a photonic design platform that lets customers create custom photonic integrated circuits using standard semiconductor design tools, with lasers integrated directly onto the chip. The model mirrors fabless semiconductor companies, aiming to bring silicon‑scale economies to optics and...
Peak Nano and Advanced Conversion Partner on DC-Link Capacitors for 800 V+ SiC EV Inverters
Peak Nano and Advanced Conversion have teamed up to co‑develop DC‑link capacitors tailored for 800 V+ silicon‑carbide (SiC) inverter systems in electric vehicles and other e‑mobility platforms. The solution pairs Peak Nano’s NanoPlex LDF film, which holds a dissipation factor below...
ST Introduces STripFET F8 MOSFET Series for Automotive
STMicroelectronics launched the Smart STripFET F8 MOSFET series targeting automotive power‑distribution and battery‑management applications. The first part, STL059N4S8AG, is a 40 V, 420 A N‑channel device with a record‑low 0.59 mΩ RDS(on) in a compact PowerFLAT 5×6 package. Its high thermal conductivity, 175 °C rating...
TSMC to Bring 3nm Production to Second Japan Fab by 2028
Taiwan Semiconductor Manufacturing Co. (TSMC) will equip its second Japanese fab for 3 nm production starting in 2028, targeting a monthly output of roughly 15,000 12‑inch wafers. The plant joins an existing Japanese facility that began mass production in late 2024,...
Vishay Launches First 8mm SMD-4 Automotive MOSFET Driver for EV Systems
Vishay introduced the VODA1275, an automotive‑grade MOSFET driver housed in an 8 mm SMD‑4 package with a 600 CTI mold compound, targeting high‑voltage EV and HEV systems. The device offers industry‑leading 80 µs turn‑on time—three times faster than rivals—alongside 1260 V peak isolation...
MGC Raises Semiconductor Materials Prices 30% as Packaging Material Costs Rise
Japan's Mitsubishi Gas Chemical (MGC) announced a roughly 30% price increase across its electronic materials portfolio, including copper‑clad laminates, prepreg, and resin‑coated copper, effective April 1, 2026. The company attributes the hike to higher raw‑material costs, rising labor expenses, and increased...
AUROS Technology Targets Mass Supply of 1nm-Level Metrology Tools This Year
AUROS Technology is finalizing qualification of its ultra‑precision thin‑film thickness metrology system with a leading domestic chipmaker, aiming to begin mass production this year. The tool measures film thickness at angstrom‑level accuracy, supporting etching, deposition and CMP processes, and could...
DEEPX Expands NPU Partnership With Lotte Innovate After PoC Approval
DEEPX announced on April 2 that its DX‑M1 neural processing unit has cleared Lotte Innovate’s proof‑of‑concept validation, prompting the two firms to move into a mass‑production phase. Lotte Innovate selected the DX‑M1 for its strong computational performance, efficient thermal management and...
Tungsten Supply Risks Mount as China Controls Exports, Japan Cuts WF6 Output
The semiconductor industry is confronting a new supply bottleneck as China tightens export controls on tungsten, the raw material for tungsten hexafluoride (WF6) gas. Japanese WF6 producers, responsible for roughly 25% of global output, plan to cut production in the...
Mobilint Raises 70 Billion Won in Series C Funding
Mobilint announced a 70 billion won Series C round on April 1, backed by Praxis Capital Partners, POSCO Investment and K Partners. The funding will fuel development of next‑generation neural processing units, expand mass‑production capacity, and support global market entry. Mobilint’s AI chip portfolio...
Qualitas Semiconductor Signs 2nm Edge AI IP License Deal Worth 1.3 Billion Won
Qualitas Semiconductor announced a design‑IP license agreement for its 2‑nanometer gate‑all‑around (GAA) MIPI C/D‑PHY, valued at roughly 1.3 billion won—about 21% of its projected 2024 revenue. The license, granted to a U.S. edge‑AI semiconductor firm, runs through March 30 2025 and carries no...
FuriosaAI to Mass Produce Second-Gen AI Chip, Supply to Samsung SDS Cloud From July
FuriosaAI announced mass production of its second‑generation Renegade AI chip, targeting 20,000 units in 2024 after an initial 4,000‑unit run. The chip upgrades to HBM3E memory, boosting capacity to 72 GB and delivering up to 20 petaflops per rack. Samsung SDS will...
MiTAC Shows Servers with Next-Gen CPUs and Solidigm SSDs at NVIDIA GTC 2026
MiTAC unveiled a next‑generation G‑Series server at NVIDIA GTC 2026, pairing dual AMD EPYC “Venice” CPUs with NVIDIA RTX Pro 6000 and 4500 Blackwell GPUs. The chassis places GPUs and Solidigm D7‑PS1010 PCIe Gen5 SSDs at the front, while NVIDIA ConnectX‑8 delivers eight 400 GbE...
C-Hawk Expands Southeast Asia Manufacturing Capabilities and Capacity with New Malaysia and Vietnam Facilities
C-Hawk Technology announced the opening of two new manufacturing facilities in Southeast Asia—a 200,000‑square‑foot plant in Johor Baru, Malaysia, and a 96,000‑square‑foot site in Ho Chi Minh City, Vietnam. The Malaysian location expands precision‑plastic production and adds PFA tube‑bending, while the Vietnamese factory...
IBM Announces Strategic Collaboration with Arm
IBM announced a strategic collaboration with Arm to create dual‑architecture hardware that blends IBM’s enterprise‑grade reliability and security with Arm’s power‑efficient designs. The partnership targets AI and data‑intensive workloads, emphasizing virtualization, high‑availability, and ecosystem growth. By integrating Arm‑based software environments...
PrismML Launches World’s First 1-Bit AI Model to Redefine Intelligence at the Edge
PrismML emerged from stealth to launch the world’s first commercially viable 1‑bit large language model, the 8‑billion‑parameter Bonsai 8B. Built on Caltech research and trained on Google v4 TPUs, the model delivers performance comparable to full‑precision 8B models while using...
Embedded World 2026: Boards and Modules (Part 3)
Embedded World 2026 showcased five new edge‑AI boards and modules aimed at industrial and IoT markets. Variscite’s VAR‑SMARC‑MX8M‑PLUS brings a 2.3 TOPS NPU and dual Gigabit Ethernet, while congatec’s Conga‑SMX95 pairs an NXP i.MX 95 CPU with a 2 TOPS eIQ Neutron accelerator...
Mitsubishi Electric Enters ROHM–Toshiba Chip Integration Talks
Mitsubishi Electric has signed a memorandum of understanding to discuss integrating its power‑device operations with the semiconductor businesses of ROHM and Toshiba Electronic Devices, alongside Japan Industrial Partners and TBJ Holdings. The talks aim to create a globally competitive semiconductor...
This Chip Keeps Working at 700°C, Surviving Lava-Like Heat
USC researchers have built a memristor‑based memory chip that continues to function at 700 °C—hotter than molten lava—by stacking tungsten, hafnium oxide and a single‑atom graphene layer. The device stored data for over 50 hours without refresh, survived more than a billion...
NVIDIA Invests $2 Billion in Marvell to Expand NVLink AI Ecosystem
NVIDIA announced a $2 billion investment in Marvell Technology to broaden its NVLink ecosystem and support custom AI infrastructure. The partnership will deliver NVLink Fusion, a high‑speed interconnect that lets customers build rack‑level heterogeneous AI systems using NVIDIA GPUs, CPUs, DPUs...
Kioxia Killing Off Old NAND Chippery
Kioxia has issued an end‑of‑life notice for its third‑generation 3D NAND products, including 64‑layer planar and sub‑96‑layer chips such as SLC, MLC and TLC. Sales will cease in September 2026 with final shipments ending by the close of 2028, giving customers...
China's Homegrown Silicon Suppliers Gain Traction as Nvidia Struggles to Get Its Chips Into the Market — Huawei, Cambricon and...
Chinese AI and graphics chip makers have surged in 2025, capturing 41% of the domestic AI server market and cutting Nvidia's share to 55% from a claimed 95% peak. Huawei alone shipped over 812,000 AI chips, accounting for roughly half...
Nvidia Software Pushes MLPerf Inference Benchmarks To New Highs
At GTC 2026, Nvidia announced record AI inference performance on the MLPerf v6.0 benchmark, driven by its Blackwell Ultra GPUs and a refreshed software stack. The company’s Dynamo inference framework and TensorRT‑LLM optimizations delivered up to 2.77× speed gains and cut...
Bourns Adds AEC-Q Option to SSA-2 Current Sensors
Bourns announced an AEC‑Q‑compliant assembly option for its SSA‑2 analog current sensors, giving automotive, industrial and energy designers a qualified part without restarting the qualification process. The SSA‑2 series delivers precise current measurement, ultra‑low insertion loss and electrically isolated outputs...
650-V Bidirectional GaN Could Rewrite the Power-Conversion Playbook
Renesas introduced the TP65B110HRU, a 650‑V bidirectional GaN switch, at APEC 2026. The device merges a d‑mode GaN chip with silicon MOSFETs, offering 110 mΩ on‑resistance, a 3‑V gate threshold, and ±20‑V gate margin. Its true bidirectional operation enables single‑stage 500‑W solar...
Nexperia's China Unit Nears Fully Local Production of Chips: Company Sources
Nexperia’s China unit is on the cusp of achieving fully localized semiconductor manufacturing, according to internal sources. The move will enable the Dutch‑headquartered, Chinese‑owned chipmaker to produce a broader portfolio of chips within mainland China. Local production is expected to...
DRAM Pauses After Rally as NAND Extends Gains, Q2 Rebound Expected
DRAM prices stalled in March at $13 per 8 Gb DDR4 after an 11‑month rally, as supply agreements capped movement. Q1 pricing was largely set earlier, but quarterly contract prices still rose sharply from Q4. Samsung signaled a 40‑45% price hike...
Memory Market Rebounds, but AI Demand Reshapes Recovery
The 2026 memory market is rebounding, but the recovery is being reshaped by AI‑driven demand. TrendForce projects DRAM contract prices to climb 58‑63% QoQ and NAND Flash to surge 70‑75% QoQ in Q2. AI and data‑center expansion are pushing suppliers...
Infineon Launches TLVR Power Module for AI Server Power Demand
Infineon Technologies has launched the TDM24745T, a quad‑phase power module designed for AI server platforms. The compact 9 × 10 × 5 mm device integrates four power stages, a TLVR inductor and decoupling capacitors, achieving current densities above 2 A/mm² and peak currents up to 320 A....
Fujitsu, Rapidus Team up on 1.4nm AI Chip for Servers
Fujitsu and Rapidus announced a joint development of a 1.4 nm neural processing unit (NPU) aimed at AI inference in servers. The project, costing roughly 58 billion yen, will leverage Rapidus’s advanced node roadmap and Fujitsu’s Arm‑based Monaka CPU built on a...
Onsemi’s Hybrid Power Integrated Modules Used in Sineng Electric’s Solar and Energy Storage Solutions
onsemi announced that its next‑generation hybrid power integrated modules (PIMs) will be used in Sineng Electric’s 430 kW liquid‑cooled string energy storage system and 320 kW utility‑scale solar inverter. The FS7 IGBT and EliteSiC‑based F5BP modules deliver 32% higher power density and...
Developing A Security Framework For Chiplet-Based Systems
The article outlines a security framework for chiplet‑based systems, emphasizing that each chiplet must possess a verifiable identity tied to a platform‑wide trust chain. It describes two provisioning patterns—certificate‑based external provisioning and silicon‑derived (PUF) self‑generated keys—and explains how both feed...
Automated Multiphysics For Successful 3D-IC Design
Design teams moving to 3D‑IC architectures face intertwined power, thermal and mechanical challenges that can jeopardize yield and reliability. Traditional 2D verification tools fall short because stacked dies introduce new materials and complex inter‑dependencies. Siemens EDA’s Calibre 3DStress combined with...
AI Demand Resets Memory Market Priorities, Tightening NOR Flash Availability
The surge in AI infrastructure is creating a memory supercycle that pushes leading chipmakers to prioritize high‑margin products such as HBM, DDR5 and advanced NAND. DRAM prices are projected to jump roughly 90% quarter‑over‑quarter, while NAND could rise about 60%,...
World First: MACsec IP Receives ISO/PAS 8800 Certification For Automotive And Physical AI Security
Synopsys became the first company to earn ISO/PAS 8800 certification for its MACsec IP, a standard that secures Ethernet communication inside vehicles. The certification, validated by SGS TÜV Saar, confirms that the IP not only protects data integrity but also meets the...
Moving Electrons, Not Just Vehicles
The article examines how modern power electronics—especially multi‑level converters, silicon‑carbide (SiC) devices, and advanced power‑management ICs—are improving efficiency in electric vehicle (EV) and robot battery systems. It highlights fast‑charging challenges, noting that 15‑minute 0‑80% charges and 750 kW superchargers generate heat...
The One Bit Problem That Can Break a System
Bit flipping, once a rare reliability glitch, has become a systemic risk as semiconductor nodes shrink, clock speeds rise, and operating voltages drop, exposing aerospace, automotive and data‑center chips to silent data corruption. The phenomenon is driven by cosmic radiation,...
Embedded World 2026: Bringing Edge AI Into The Real World
At Embedded World 2026, Synaptics demonstrated that artificial intelligence is moving off the cloud and onto the device, delivering real‑time, context‑aware capabilities at the edge. The company showcased the SYN765x platform, which bundles Wi‑Fi 7, Bluetooth 6.0 and on‑chip AI compute for...
Altera and Arm Partner on Programmable Solutions for AI Data Centers
Altera Corp. is deepening its two‑decade partnership with Arm by integrating its data‑center‑grade FPGAs with Arm’s new AGI CPU built on the Neoverse CSS V3 architecture. The combined solution targets AI‑focused data centers, promising low‑latency, highly flexible and scalable compute...
Molex Completes Acquisition of Smiths Interconnect
Molex announced the completion of its acquisition of Smiths Interconnect, the UK‑based subsidiary of Smiths Group, marking the largest deal in Molex’s history. The purchase adds a portfolio of ruggedized connectors, RF components, optical transceivers and semiconductor‑test expertise, extending Molex’s...
SEMI Forecasts Chip Equipment Investments to Reach Beyond $150B in 2027
SEMI projects worldwide 300mm fab equipment spending to rise 18% to $133 billion in 2026 and surpass $150 billion in 2027, reaching $172 billion by 2029. The surge is driven by exploding AI chip demand for data‑center and edge workloads and by regional...