From Embedded Systems to Edge AI: How STMicroelectronics Is Enabling Vietnam’s Electronics Industry
STMicroelectronics is deepening its foothold in Vietnam as the country moves from a manufacturing hub to a design‑centric semiconductor ecosystem. The company has nurtured local talent for nearly two decades, supplying free microcontroller kits to universities and hosting hands‑on Tech Day events for engineers, OEMs, and startups. With 80,000‑100,000 engineering graduates entering the workforce each year, Vietnam is poised to capitalize on edge AI, where ST’s STM32Cube.AI and NanoEdge AI Studio lower development barriers. ST sees this convergence of talent, Industry 4.0 automation, and embedded intelligence as a long‑term growth engine.
Lam Research Corp (LRCX) Q3 2026 Earnings Call Transcript
Lam Research reported record 2025 revenue of $20.6 billion, up 27% year‑over‑year, with gross margin at a historic 49.9% and operating margin of 34.1%. Diluted EPS rose 49% to $4.89, and the December quarter delivered $5.34 billion in revenue, marking ten straight...
ANU Spinout Raises $36 Million Series A to Make AI Chips
Australian National University spin‑out Syenta announced a AU$36 million (≈US$26 million) Series A round, led by Playground Global and the National Reconstruction Fund. The capital will accelerate commercialisation of its lithography‑free Localized Electrochemical Manufacturing (LEM) process, which promises 40% fewer steps and higher...
Photonic Chip Generates Milliwatt-Level UV Light, 100 Times Brighter than Before
Researchers at the University of Twente and Harvard have demonstrated a photonic chip that generates several milliwatts of ultraviolet (UV) light, a power level roughly 100 times higher than prior on‑chip attempts. The breakthrough relies on converting two red photons...
Arm Exec: New AGI CPU Has Big On-Prem Potential—But Limited Channel Play For Now
Arm unveiled its first silicon product, the AGI CPU, aimed at on‑prem AI data centers handling agentic workloads. The 136‑core, 300‑watt processor promises more than double the rack performance of traditional x86 CPUs and could save up to $10 billion per...
Trends in Semiconductor Manufacturing: Wafer-Level and Panel-Level Packaging
The semiconductor packaging landscape is shifting from pure wafer‑level packaging (WLP) to a process‑centric model that emphasizes wet processing, electrochemical plating (ECP) and plasma‑enhanced CVD (PECVD). Heterogeneous integration and chiplet designs are pushing both WLP and emerging panel‑level packaging (PLP)...
Quinas Advances ULTRARAM Development with Atomic-Scale Processing at KAUST Core Labs
Quinas Technology announced that it has successfully employed atomic‑layer etching (ALE) at KAUST Core Labs to fabricate its ULTRARAM quantum‑engineered memory structures. The process, supplied by Oxford Instruments Plasma Technology, delivers sub‑nanometre precision with ultra‑low damage, essential for the III‑V...
Power Electronics Market to Exceed US$65 Billion by 2036
The IDTechEx report projects the global power‑electronics market to climb from $25.5 billion in 2026 to $65.2 billion by 2036, a 10% compound annual growth rate. Wide‑bandgap semiconductors—silicon carbide (SiC) and gallium nitride (GaN)—are gaining traction, with SiC set to dominate electric‑vehicle...
Intel Handheld Gaming Chip Core G3: Can It Challenge AMD in 2026?
Intel unveiled its Core G3 handheld gaming chip, built on Panther Lake silicon, aiming to break AMD's long‑standing dominance in low‑power, high‑performance portable PCs. The chip targets a 15‑20 W power envelope, a sweet spot for extended gaming sessions, and leverages recent...
Syenta Gets $26M Series A for Advanced Chip Packaging
Australian semiconductor startup Syenta announced a $26 million Series A round led by Playground Global and the National Reconstruction Fund, bringing its total capital to over $36 million. The funding will accelerate commercialization of its Localized Electrochemical Manufacturing (LEM) process, which promises 40%...
Samsung Electro-Mechanics Introduces 1000–1500 V MLCCs for EV Inverter and OBC Designs
Samsung Electro‑Mechanics has entered mass production of ultra‑high‑voltage multilayer ceramic capacitors (MLCCs) rated between 1000 V and 1500 V. The new 1210‑size parts deliver 1.2 nF to 33 nF with C0G or X8G dielectrics, offering near‑zero temperature drift from –55 °C to 150 °C. Designed for...
ROHM Develops 5th Generation SiC MOSFETs
ROHM Semiconductor announced its fifth‑generation EcoSiC silicon‑carbide MOSFETs, delivering roughly 30% lower on‑resistance at 175 °C compared with the prior generation. The devices target high‑efficiency power conversion in electric‑vehicle traction inverters, onboard chargers, AI‑server power supplies, and data‑center equipment. ROHM will...
ST Expands Analog Portfolio with High-Accuracy Op Amps
STMicroelectronics has launched the TSB192 dual operational amplifier, a high‑accuracy part that works across a 4 V to 36 V supply range. It delivers a typical 20 µV input offset and 100 nV/°C drift, while consuming only 1.9 mA per channel. The device offers an...
LG Innotek Secures Automotive Wi-Fi 7 Supply Agreement
LG Innotek has landed a $68 million supply deal to provide its automotive Wi‑Fi 7 communication module to an unnamed European parts maker, with mass production slated for 2027. The compact module, roughly one‑sixth the size of a credit card, supports a...
A Conversation with GF’s Pioneer Silicon Photonics Leader and Optica Fellow Dr. Yusheng Bian
Dr. Yusheng Bian, GlobalFoundries’ silicon‑photonic pioneer, was recently named an Optica Fellow for his decade‑long work turning silicon photonics from research into high‑volume CMOS production. He explains how AI‑driven data‑center demand is displacing copper interconnects with pluggable and co‑packaged optical...
What’s the Impact of AI on Analog Design
The article argues that the impact of AI on analog design is still uncertain, noting that past technology forecasts have often missed the mark. It highlights two concrete AI applications: using generative tools to streamline component selection, such as choosing...
SK Hynix Pledges to Expand Scope of Supplier Collaboration in AI Era
SK hynix announced at its supplier council’s annual meeting that it will broaden the depth and scope of collaboration with partners as the AI era reshapes the memory market. The company will shift subcommittee agenda setting to suppliers, introduce advanced...
DEEPX and Hyundai Motor Group Robotics LAB Partner to Develop Next-Generation Physical AI Compute Platform for Robotics
DEEPX and Hyundai Motor Group’s Robotics LAB announced a strategic partnership to co‑develop a Physical AI computing platform for next‑generation robots. The effort centers on DEEPX’s DX‑M2 ultra‑low‑power chip, designed to run large generative AI models in real time on...
Scientists Sculpt Einstein Onto a Crystal Using only Light
Researchers at XPANCEO, together with Nobel laureate Konstantin Novoselov, demonstrated that the van der Waals semiconductor arsenic trisulfide (As₂S₃) can be permanently reshaped using only continuous‑wave light. The crystal exhibits an unprecedented photorefractive index shift of up to Δn≈0.3 under low‑intensity UV exposure,...
CargoLand by LGG Targets Taiwan as a Strategic Hub for Semiconductor Flows Between Asia and Europe
CargoLand by LGG reported handling 1.32 million tonnes in 2025, a 14% increase, and is expanding its 100% freighter‑focused model to serve high‑value, time‑sensitive cargo. The company is positioning Taiwan‑Europe semiconductor flows as a strategic corridor, leveraging airline partnerships and its...
Laser Bursts Flip Nanoscale Magnetic Vortices at Blistering Speeds, Opening a Path to Brain-Like Spintronics
Researchers at Nankai University and collaborators have demonstrated coherent helicity switching of nanoscale magnetic vortices using femtosecond laser pulses combined with an out‑of‑plane magnetic field. The technique flips the vortex rotation within a few hundred picoseconds in a Ni‑Fe (80/20)...
Here's Why the AI Infrastructure Story Is Just Getting Bigger for GOOGL
Alphabet is expanding its AI‑chip supply chain by partnering with Marvell Technology to co‑develop a memory‑processing unit and an inference‑focused TPU, complementing its existing ties with Broadcom and MediaTek. The company has pledged $175‑$185 billion in capital expenditures for 2026, underpinned...
Kioxia Debuts Fast QLC Slablet SSD for PC Makers
Kioxia has launched the EG7 SSD, a QLC‑based successor to its BG7 drive, offering identical capacity options (256 GB to 2 TB) and near‑identical performance, with a modest boost to 6.2 GB/s sequential writes. The drive uses 218‑layer 3D NAND, is DRAM‑less, and...
CSconnected Supporting £436m for Welsh Economy and 3140 Jobs
The CSconnected compound semiconductor cluster in South Wales generated about $554 million in gross value‑added (GVA) and supported 3,140 jobs in 2025, a 19% and 14% year‑on‑year rise respectively. Direct employment reached 1,914 with an additional 1,226 indirect positions, while exports...
Arrow Electronics Reference Design Board Features Bourns, Microchip, Amphenol Technologies
Arrow Electronics has released a 10BASE‑T1S reference design board co‑developed with Microchip, Bourns and Amphenol. The platform centers on Microchip’s LAN8670 PHY, an IEC 63171‑6‑compliant Amphenol connector, and Bourns’ SM91081AL isolation transformer and common‑mode choke. It lets engineers evaluate signal integrity,...
Advantest Announces Strategic Partnership with Applied Materials and Joins EPIC Platform
Advantest Corporation became the first automated test equipment (ATE) firm to join Applied Materials' EPIC (Equipment and Process Innovation and Commercialization) platform in Sunnyvale. The partnership links Advantest’s Innovation Center with Applied’s EPIC Center, creating a joint R&D pipeline for...
Benchmark, Foundation and Eclipse Poised for Win with Cerebras IPO
AI chipmaker Cerebras Systems is preparing for an initial public offering, positioning its early backers Benchmark, Foundation and Eclipse for substantial gains. The venture firms were the first investors, providing the $27 million Series A round in 2016. Since then, Cerebras has...
AXT Announces Public Offering
AXT Inc., a Fremont‑based producer of gallium arsenide, indium phosphide and germanium substrates, announced a public offering of common stock with a 30‑day overallotment option allowing underwriters to purchase up to an additional 15% of the shares. The offering is...
Samsung Targets May Samples for HBM4E, Eyes Nvidia AI Demand
Samsung Electronics announced it will produce early samples of its seventh‑generation HBM4E memory as early as May 2026, with shipments to Nvidia slated after internal testing. The new HBM4E chip targets up to 16 Gbps per pin and roughly 4 TB/s total...
Japan Quake May Disrupt Semiconductor Supply Chain, Hit NAND and Photoresist Output
A magnitude 7.7 earthquake struck Japan’s northeast coast on April 20, prompting safety shutdowns at several semiconductor facilities. Kioxia halted production at its Iwate NAND flash plants, which represent roughly 5‑8% of global supply, while Tokyo Electron stopped operations at...
Shin-Etsu to Raise Silicone Prices as Costs Pressure Semiconductor Materials
Shin‑Etsu Chemical announced a worldwide price increase of more than 10% for all silicone products, effective May 1. The hike reflects rising crude oil, naphtha, energy, packaging and logistics costs that have squeezed margins. Silicone, a key material for thermal management...
The Changing ASICs Landscape: The Shift Toward Chip Disaggregation
AI’s rapid growth is forcing ASIC designers to move away from monolithic dies toward modular, disaggregated architectures. By partitioning functions onto smaller, specialized dies and using advanced 2.5D, wafer‑to‑wafer and die‑to‑die packaging, companies can achieve better power, performance, and time‑to‑market...
Infineon Adopts RISC-V for Automotive MCUs, Raising Questions for Hyundai Motor Roadmap
Infineon Technologies, the world’s leading automotive MCU supplier, announced a new family of RISC‑V‑based microcontrollers to join its AURIX line. The move targets software‑defined vehicle (SDV) functions such as zonal controllers, while legacy power‑train and body applications will stay on...
Research Bits: Apr. 21
Researchers at the University of Michigan demonstrated a compute‑in‑memory (CIM) implementation of state‑space models using a 65 nm CMOS resistive‑RAM crossbar, achieving vector‑matrix multiplication within 4.6 bits of the ideal result while dramatically cutting energy use. In Tokyo, scientists from the Institute...
Xbox Project Helix Leak Suggests Shift to Standard PC Hardware Design
A leak suggests Microsoft’s upcoming Xbox Project Helix will forgo a custom APU in favor of a PC‑like architecture built from off‑the‑shelf AMD components. The platform is rumored to pair RDNA 5 graphics with Zen 6 or Zen 6c CPU cores, mirroring modern gaming...
Nordic SoC Powers Holyiot Smart Badges
Holyiot Technology has embedded Nordic Semiconductor’s nRF54L15 system‑on‑chip into its Inkcard‑A1 e‑ink smart badge, delivering twice the processing power and three‑fold efficiency of the prior generation. The Bluetooth LE‑enabled badge can refresh images, QR codes or text in under six seconds...
Infineon Retains Top Automotive Chip Supplier Position for 6th Consecutive Year
Infineon Technologies retained its position as the world’s leading automotive semiconductor supplier in 2025, marking a sixth consecutive year at the top. The firm held a 12.8% global market share, slightly down from 13.2% in 2024, while expanding its automotive...
Lattice and TI Join Forces to Advance Real-Time Edge AI Sensor Fusion
Lattice Semiconductor and Texas Instruments have teamed up to simplify sensor integration for edge AI, pairing TI’s mmWave radar and camera technologies with Lattice’s low‑power Holoscan Sensor Bridge FPGA solution. The joint architecture streams synchronized sensor data directly into GPU‑accessible...
Google Is Building a Four-Partner Chip Supply Chain to Challenge Nvidia in AI Inference
Google is constructing the AI industry’s most diversified custom‑chip supply chain, enlisting Broadcom, MediaTek, Marvell and Intel to design and produce next‑generation TPUs. The current Ironwood inference chip, now shipping in the millions, offers 42.5 FP8 exaflops per super‑pod and powers...
Digital Signal Controllers Zero in on AI Data Center Power Supplies
Microchip Technology unveiled the dsPIC33AK256MPS306, a 200 MHz 32‑bit digital signal controller designed for AI‑driven data‑center power supplies and motor‑control applications. The device packs a double‑precision floating‑point unit, 40 MSPS 12‑bit ADCs, sub‑100 ps PWM timing, and high‑speed comparators, enabling deterministic control loops...
InPHRED Expands Into Data-Center Optical Interconnect Market with InP VCSEL and Micro-RC-LED Solutions
InPHRED Inc., a Boston‑based photonics startup, announced its entry into the data‑center optical interconnect market, leveraging its nanoporous platform to deliver InP VCSEL and micro‑RC‑LED solutions. The company aims to address ultra‑short‑reach chip‑to‑chip I/O and longer intra‑rack links, with Q1 2027...
Authorized Distributor Mouser Electronics Offers Engineers the Latest Technologies From Texas Instruments
Mouser Electronics, an authorized global distributor of Texas Instruments (TI) solutions, now offers over 70,000 TI parts—about 48,000 of which are in stock and ready to ship. The catalog includes the latest TI power‑management ICs, ultra‑low‑offset op‑amps, SPI I/O expanders,...
Novel Solid-State Transformer Supports 800-V DC Power in AI Data Centers
Navitas Semiconductor and EPFL unveiled a 250‑kW solid‑state transformer (SST) that converts 3.3 kV AC to 800 V DC, targeting AI‑driven data centers. The device uses a single‑stage modular bridge‑rectifier topology and Navitas’s ultra‑high‑voltage SiC MOSFETs, eliminating bulky low‑frequency transformers. Demonstrated at...
Positron AI Enters Nvidia Turf With Oracle Deal
Positron, a fledgling AI‑chip designer, announced its first commercial deployment by supplying inference chips to Oracle’s cloud platform. The deal involves tens of millions of dollars in air‑cooled rack systems optimized for mixture‑of‑experts (MOE) workloads. Positron’s upcoming Asimov chip, built...
Asrock's New HUDIMM Standard Wants to Make DDR5 Affordable Again, by Cutting It in Half
ASRock unveiled HUDIMM, a new DDR5 memory standard that cuts the traditional two‑sub‑channel architecture in half, halving bandwidth and density to lower costs. Co‑developed with Intel and TeamGroup, Intel will support HUDIMM on its 600, 700 and 800‑series chipsets. The...
Here's Why RAM Prices Won't Be Dropping Anytime Soon
Nikkei Asia reports the global DRAM shortage will persist until around 2027, with U.S. and South Korean suppliers able to meet only about 60% of demand. Samsung’s fourth RAM fab won’t reach full‑scale output until at least 2027, and its...
AOI Receives New $71m Upsized Order for 800G Data-Center Transceivers
Applied Optoelectronics Inc (AOI) secured a $71 million upsized order for 800 G single‑mode data‑center transceivers from a major hyperscale customer, bringing total orders from that client to $124 million since mid‑March. The deal more than doubles AOI's backlog with the customer and...
GaN Breaks the 250 W Barrier in Flyback Power Supplies
Power Integrations has launched the TOPSwitchGaN family, extending the single‑ended flyback converter’s practical power ceiling from the traditional 200‑250 W limit to 440 W. By replacing silicon MOSFETs with gallium‑nitride HEMTs, the new devices achieve lower on‑resistance, reduced gate charge and output...
Honda Considers an Analog Spin for Software-Defined Vehicles
Honda Motor Co. is teaming with Texas‑based semiconductor maker Mythic to co‑develop an analog compute‑in‑memory system‑on‑chip for its upcoming software‑defined vehicles. The partnership leverages Mythic’s memory‑centric architecture, which the company claims can deliver up to 100 times the energy efficiency of...
EDA AI Agents: Intelligent Automation in Semiconductor & PCB Design
Siemens has launched the Fuse™ EDA AI System and Fuse™ EDA AI Agent, a purpose‑built platform that merges generative and agentic AI across its entire semiconductor and PCB design suite. The solution tackles five core industry challenges—proprietary expertise, rigid on‑premise...