Wonik QnC to Expand Gumi Plant to Meet Surging Semiconductor Demand
Wonik QnC announced an expansion of its Gumi plant in South Korea, with construction slated to begin next month and production ramp‑up expected in the first half of next year. The project represents an investment of less than 5% of the company’s 943.6 billion‑won (≈$726 million) revenue from last year. Utilization rates at its quartz facilities are already near full capacity, especially in Korea (88.9%) and the United States (95%). Analysts now expect Wonik QnC to break the 1 trillion‑won (≈$770 million) revenue threshold this year.
Genesem Wins 6 Billion-Won HBM Backend Equipment Order From SK Hynix
Genesem announced a 6 billion‑won ($4.4 million) contract with SK Hynix to supply high‑bandwidth memory (HBM) backend equipment, roughly 10.6% of its prior‑year revenue. The order, running through Sept. 15, is expected to center on vacuum mounters that protect ultra‑thin DRAM wafers. Payment terms...
ASML Targets More Than Doubling EUV Output Capacity by 2027
ASML announced plans to more than double its low‑numerical‑aperture (Low‑NA) EUV lithography output, targeting at least 80 systems by 2027 versus 44 shipped in 2023. The company says improvements in component supply, faster assembly, and higher wafer‑throughput (260 wafers per...
Samsung Tests Domestic EUV Mask Blanks in 4nm Foundry Production Line
Samsung Electronics has begun testing EUV blank masks from South Korean supplier S&S Tech in its high‑volume 4‑nanometer foundry line, marking the first use of domestically produced masks in mass production. The move follows earlier R&D‑level trials and targets a...
Rebellions Supplies 'Rebel100' AI Chip to KT for LLM Inference
South Korean AI chip startup Rebellions has delivered its second‑generation Rebel100 NPU to telecom giant KT, aiming to boost cost efficiency for large language model (LLM) inference. The 4‑nanometer, HBM3E‑equipped chip can perform up to one quadrillion operations per second...
ROHM Launches Free Web Tool for Power Semiconductor Loss and Thermal Simulation
ROHM has launched a free, browser‑based PLECS simulator that lets engineers evaluate power semiconductor loss and thermal performance without installing software. The tool, licensed from Plexim, currently includes only ROHM parts and supports 20 circuit topologies, delivering results in seconds...
Neosem to Supply PCIe 5.0 SSD Test Equipment to U.S. Client in 6.2 Billion-Won Deal
Neosem announced a contract to supply its fourth‑generation CPU‑based PCIe 5.0 SSD test system to an undisclosed U.S. customer, valued at roughly 6.21 billion won (about $4.6 million). The deal represents roughly 9.7% of Neosem’s projected 2025 revenue of 63.9 billion won (≈$48 million). Neosem...
Samsung Electronics Seeks Police Probe Over Circulation of Non-Union Employee List
Samsung Electronics filed a criminal complaint and asked police to investigate after a list of non‑union employees was circulated internally. The list, shared via a group messaging channel, detailed names, identification numbers, departments and union membership status. Union leader Choi...
YC Corp Wins 42 Billion Won Samsung Memory Tester Upgrade Contract
YC Corp announced it has secured a contract worth 42.16 billion won (about $31 million) to upgrade Samsung Electronics' MT6133 LPE‑B memory testers. The agreement covers board replacements in the systems across Samsung’s domestic fabs and will be completed by Dec. 31, with...
Analog Devices Opens Advanced Backend Facility in Thailand
Analog Devices (ADI) opened an advanced backend manufacturing facility in Chonburi, Thailand, upgrading its local operations from a test‑only site to a full‑scale production base that includes wafer‑level processing, chip‑scale packaging (CSP) and final IC testing. CEO Vincent Roche described...
Techvalley Supplies HBM Inspection Equipment to Samsung Electronics and SK Hynix
Techvalley has delivered custom Teraton 3D X‑ray CT systems to Samsung Electronics and SK Hynix for advanced packaging research, including high‑bandwidth memory (HBM) and through‑glass vias. The scanners achieve sub‑micron resolution—0.5 µm on the Teraton 7 and 0.9 µm on the Teraton 5—and complete...
Samsung Electronics Union Demands Up to 40 Trillion Won in Bonuses After Record Profit
Samsung Electronics' labor union has escalated its bonus demand to a pool of roughly 40.5 trillion won ($3 billion), representing 15% of an assumed 270 trillion‑won ($20 billion) semiconductor operating profit. The demand follows a record first‑quarter profit of 57.2 trillion won ($4.3 billion) and dwarfs...
Global PC Shipments Rise in First Quarter on Inventory Build Ahead of Memory Price Increases
Global PC shipments rose between 2.5% and 4% year‑on‑year in Q1, reaching roughly 64 million units according to Gartner, IDC and Omdia. The increase stemmed mainly from distributors and vendors building inventory ahead of anticipated DRAM and NAND price hikes, rather...
STMicroelectronics Unveils Lower-Cost PMICs With Reduced Power Rails
STMicroelectronics introduced two lower‑cost power‑management ICs, the STPMIC1L and STPMIC2L, aimed at STM32 microprocessor families. Both chips trim the number of power rails and shrink the package footprint, cutting the STPMIC1 price by about 21% to $1.34 and the STPMIC2L...
PowerCube Semi Supplies Gallium Oxide Sensors to HL Mando
PowerCube Semi has begun mass‑producing gallium‑oxide (Ga₂O₃) sensors for HL Mando, supplying the components since December 2023 under a 2023 development agreement. The sensors power HL Mando’s electric spark detection device, HAECHIE, which was unveiled at CES 2025 and can interrupt...
TLB Plans 120 Billion Won Rights Offering to Build Vietnam Plant, Double PCB Capacity
TLB announced a rights offering of about 120 billion won (≈US$92 million) to fund a second PCB plant in Vietnam. The new facility will add roughly 20,000 square meters of monthly capacity, matching its Korean plant and enabling full‑process HDI production for AI‑driven...
Panmnesia Wins Government Project to Develop AI Accelerator Link Controller
Panmnesia announced on April 8 that it secured a South Korean government‑backed project to develop AI accelerator link controllers and switches using open‑standard interconnects. The initiative, part of the K‑Cloud AI semiconductor program, focuses on UALink and Ethernet technologies, with silicon...
YC Chem to Split Shares Amid Improving Earnings Outlook
YC Chem announced a 2-for-1 stock split, halving the par value from 1,000 to 500 won and raising shares outstanding to about 20.2 million. The move, slated for mid‑April, aims to improve liquidity on the KOSDAQ after a trading suspension. The...
Korea Semiconductor Industry Association Pledges Energy-Saving Measures Amid Middle East Risks
The Korea Semiconductor Industry Association announced new energy‑saving initiatives as Middle East tensions raise supply risks. Companies will adopt flexible work schedules, cut lighting, promote public transport, and lower standby power. They will also pursue longer‑term efficiency upgrades tailored to...
SK Hynix Begins Supplying 321-Layer QLC Consumer SSD to Dell
SK hynix has begun shipping its new PQC21 consumer SSD, a 321‑layer quad‑level cell (QLC) drive in a compact 2230 form factor, to Dell Technologies. The drive is offered in 1 TB and 2 TB capacities and features Periphery‑Under‑Cell architecture, die‑packaging technology,...
SEMES Sees Diverging Performance Between Front-End and Back-End Equipment in 2025
SEMES reported mixed 2025 results, with front‑end equipment revenue climbing 16% to roughly $610 million, while back‑end sales fell 31% to about $304 million. The company boosted R&D spending by 49% to approximately $139 million, raising its intensity to 7.36% of revenue. New...
Samsung, SK Hynix Secure Long-Term U.S. Helium Supply Deals
Samsung Electronics and SK hynix have secured long‑term helium supply agreements with Germany's Linde and U.S. Air Products, shifting their procurement to U.S. sources. The contracts were accelerated after Iran’s attacks on Qatar’s Ras Laffan complex raised fears of a...
Mobilint, Lotte Innovate to Pilot NPU Deployment in Industrial Sites
Mobilint and Lotte Innovate have signed a memorandum of understanding to pilot neural processing unit (NPU) deployments across Lotte Group’s manufacturing and distribution sites. The collaboration will focus on on‑device and edge AI applications, including humanoid robots that leverage vision‑language‑action...
AMD Embedded+ Platform Used to Develop AI Security System
AMD announced that its Embedded+ platform, which fuses a Ryzen embedded processor with a Versal adaptive SoC, was used by Fujisoft to build an AI‑powered industrial security system. The solution runs on a single board, leveraging the CPU for high‑performance...
SK Hynix CEO Kwak Noh-Jung Exercises Stock Options, Acquires 2,329 Shares
SK hynix CEO Kwak Noh‑Jung exercised stock options on April 6, acquiring 2,329 common shares at 138,980 won ($106) per share for a total purchase of about 323 million won (~$0.25 million). Based on the closing price, the market value of the newly acquired...
Samsung Electro-Mechanics Supplies Glass Substrate Samples to Apple
Samsung Electro-Mechanics has begun supplying glass substrate samples to Apple, expanding beyond its earlier collaboration with Broadcom. The glass core replaces organic material in flip‑chip BGA substrates, offering superior flatness and lower thermal expansion, which is critical as AI chips...
Genesem Secures Orders From Three Major Indian Semiconductor Packaging Customers
Genesem has secured three major Indian semiconductor packaging contracts, including a 5 billion‑won (~$3.8 million) order from company C and a 15 billion‑won (~$11.3 million) order from company K. The company projects Indian revenue of 20‑25 billion won (~$15‑$19 million) this year, roughly a quarter of...
Samsung Electronics Names KCTech, Wonik IPS Among Top Suppliers at 2026 Partner Day
Samsung Electronics held its 2026 Device Solutions Division Mutual Growth Cooperation Day, honoring 17 top suppliers for achievements in technology, cost efficiency and ESG performance. KCTech received the highest technology innovation award for advancing localized CMP equipment, while Wonik IPS...
AUROS Technology Targets Mass Supply of 1nm-Level Metrology Tools This Year
AUROS Technology is finalizing qualification of its ultra‑precision thin‑film thickness metrology system with a leading domestic chipmaker, aiming to begin mass production this year. The tool measures film thickness at angstrom‑level accuracy, supporting etching, deposition and CMP processes, and could...
DEEPX Expands NPU Partnership With Lotte Innovate After PoC Approval
DEEPX announced on April 2 that its DX‑M1 neural processing unit has cleared Lotte Innovate’s proof‑of‑concept validation, prompting the two firms to move into a mass‑production phase. Lotte Innovate selected the DX‑M1 for its strong computational performance, efficient thermal management and...
Qualcomm Joins Korea's 'Challenge AX' Program to Support AI Startups
Qualcomm announced its participation in South Korea’s Challenge AX program, a government‑backed initiative linking AI startups with large corporations. The company will act as a demand‑side partner alongside LG Electronics, offering joint development of robot control, autonomous mobile robots, and on‑device...
Tungsten Supply Risks Mount as China Controls Exports, Japan Cuts WF6 Output
The semiconductor industry is confronting a new supply bottleneck as China tightens export controls on tungsten, the raw material for tungsten hexafluoride (WF6) gas. Japanese WF6 producers, responsible for roughly 25% of global output, plan to cut production in the...
Mobilint Raises 70 Billion Won in Series C Funding
Mobilint announced a 70 billion won Series C round on April 1, backed by Praxis Capital Partners, POSCO Investment and K Partners. The funding will fuel development of next‑generation neural processing units, expand mass‑production capacity, and support global market entry. Mobilint’s AI chip portfolio...
Qualitas Semiconductor Signs 2nm Edge AI IP License Deal Worth 1.3 Billion Won
Qualitas Semiconductor announced a design‑IP license agreement for its 2‑nanometer gate‑all‑around (GAA) MIPI C/D‑PHY, valued at roughly 1.3 billion won—about 21% of its projected 2024 revenue. The license, granted to a U.S. edge‑AI semiconductor firm, runs through March 30 2025 and carries no...
FuriosaAI to Mass Produce Second-Gen AI Chip, Supply to Samsung SDS Cloud From July
FuriosaAI announced mass production of its second‑generation Renegade AI chip, targeting 20,000 units in 2024 after an initial 4,000‑unit run. The chip upgrades to HBM3E memory, boosting capacity to 72 GB and delivering up to 20 petaflops per rack. Samsung SDS will...
NVIDIA Invests $2 Billion in Marvell to Expand NVLink AI Ecosystem
NVIDIA announced a $2 billion investment in Marvell Technology to broaden its NVLink ecosystem and support custom AI infrastructure. The partnership will deliver NVLink Fusion, a high‑speed interconnect that lets customers build rack‑level heterogeneous AI systems using NVIDIA GPUs, CPUs, DPUs...
SEC Develops Inline X-Ray Inspection Tool for HBM Production
SEC Co. has completed development of the Semi‑Scan‑SW, an automated inline X‑ray inspection system for high‑bandwidth memory (HBM) production. The tool detects internal defects as small as 3‑5 µm across HBM stacking, through‑glass‑via (TGV) and wafer‑level packaging (WLP) processes. SEC will...
DRAM Price Rally Pauses in March, Seen Resuming in Second Quarter
The year‑long rally in DRAM prices paused in March as pre‑negotiated contracts locked the average 8 Gb DDR4 price at $13, ending 11 months of double‑digit growth. First‑quarter DRAM prices still surged 100‑115% versus the prior quarter, reflecting strong demand. TrendForce...
Telechips Advances Network Gateway Chip Business, Seeks Global Customers
Telechips is accelerating its network gateway chip business, launching proof‑of‑concept projects with select global customers as it seeks a profitability turnaround. The company is simultaneously expanding AI‑integrated automotive semiconductor offerings for ADAS and autonomous driving, while upgrading its in‑vehicle infotainment...
SK Hynix Orders Hybrid Bonding Equipment From Applied Materials and Besi
South Korean memory maker SK hynix has ordered a hybrid bonding inline system co‑developed by Applied Materials and BE Semiconductor Industries, valued at roughly 20 billion won. The equipment combines CMP and plasma modules with Besi’s die‑bonder, enabling mass‑production of next‑generation...
Mobilint Seeks to Supply NPU Chips for Shinsegae AI Checkout Systems
South Korean AI chip startup Mobilint has completed silicon proof‑of‑concept validation for its second‑generation NPU, Regulus, developed for Shinsegae Group’s AI‑powered checkout kiosks. The chip, fabricated on TSMC’s 12‑nm process, is slated for mass production in the second quarter and...
Samsung Electronics Adopts Hybrid Bonding Inspection Equipment
Samsung Electronics is rolling out hybrid bonding inspection equipment, partnering with Onto Innovation’s picosecond laser ultrasound system that is already being validated on mass‑production lines. The joint development targets detection of microscopic voids and overlay errors in high‑bandwidth memory (HBM)...
Rebellions Raises 640 Billion Won in Pre-IPO Round as First Korea National Growth Fund Pick
South Korean AI chip designer Rebellions Inc. closed a 640 billion won pre‑IPO funding round, valuing the company at 3.4 trillion won. The round, led by the state‑backed Korea National Growth Fund with 250 billion won, also included contributions from KDB and Mirae...
Samsung Electronics Union Leader's Remarks Spark Controversy Amid Strike Push
Samsung Electronics’ union leader Choi Seung‑ho announced a rally on April 23 and a general strike in May, warning that employees who do not join could face reporting, reassignment or dismissal. The union’s hard‑line stance follows a 2024 strike that caused...
Samsung Electronics Launches Silicon Photonics Foundry Business
Samsung Electronics' foundry division announced its entry into the silicon photonics market, unveiling a roadmap that moves from photonic integrated circuits (PICs) this year to optical engines in 2027 and turnkey co‑packaged optics (CPO) by 2029, with a next‑generation CPO...
LG Chem Targets 2 Trillion Won in Semiconductor and Automotive Electronics Materials Revenue by 2030
LG Chem announced a plan to double its semiconductor and automotive electronics materials revenue to 2 trillion won (about $1.5 billion) by 2030, up from roughly 1 trillion won today. The company created a new advanced R&D unit under its Advanced Materials Research Institute to...