The additive‑free, highly conductive graphene dough unlocks scalable, low‑cost manufacturing of printed electronics and high‑performance energy storage, addressing key bottlenecks in graphene commercialization.
Traditional graphene production often relies on surfactants, polymers, or other additives that compromise electrical performance and add processing complexity. By coupling selective oxidation with mechanical exfoliation, the new edge‑functionalized graphene dough sidesteps these issues, preserving pristine basal planes while introducing functional groups only at the edges. This chemistry not only maintains a conductivity of 900 S cm⁻¹ but also renders the material highly dispersible in a range of solvents, enabling straightforward formulation without toxic stabilizers. The resulting amphiphilic, porous network behaves like a soft solid that can be shaped, molded, or extruded, opening pathways for additive manufacturing techniques previously unsuitable for graphene.
The dough’s unique rheology allows it to be directly 3D‑printed into intricate architectures, such as conductive scaffolds and paper‑based circuits, without post‑processing sintering steps. Edge functional groups provide sites for further chemical modification, demonstrated by the creation of a paramagnetic graphene dough through metal ion coordination. Its ability to reabsorb solvents after drying confirms a highly porous, reversible structure, making it compatible with diverse inks and substrates. This versatility bridges the gap between laboratory‑scale graphene flakes and industrial‑scale printable components.
Energy storage is a natural extension of the dough’s properties. When saturated with ionic liquids, the porous matrix offers extensive surface area for charge accumulation, delivering a gravimetric capacitance of 210 F g⁻¹ and an impressive energy density of 262.5 Wh kg⁻¹—metrics that rival conventional supercapacitor electrodes. Such performance, combined with the material’s moldability, enables the fabrication of free‑standing, 3D‑printed supercapacitors that can be integrated directly into devices. The breakthrough positions additive‑free EFG dough as a catalyst for next‑generation printed electronics and high‑energy‑density storage solutions, potentially accelerating market adoption of graphene‑based technologies.
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