NVIDIA’s Next Flagship Project? A Leak Suggests the RTX TITAN Blackwell or RTX 5090 Ti Could Launch in the Third...
A leak reported by Overclocking.com and echoed by several outlets suggests NVIDIA is developing a new high‑end Blackwell GPU, tentatively called the GeForce RTX 5090 Ti or RTX Titan Blackwell, slated for a Q3 2026 launch. The rumored card would sit above the current RTX 5090, potentially offering around 23,000 CUDA cores, 32 GB of GDDR7 memory, and a power draw of 700‑750 W. NVIDIA has not confirmed the project, and sources differ on whether it would be marketed as a GeForce “Ti” model or a prestige‑focused TITAN. If released, it would likely be a limited‑edition halo product aimed at collectors and extreme enthusiasts.
AMD Makes a Big Splash with the MI355X in MLPerf Inference 6.0: Over One Million Tokens per Second in Multi-Node...
AMD announced that its Instinct MI355X GPU achieved over one million tokens per second in multi‑node inference, topping the new MLPerf Inference 6.0 suite. The benchmark showed 1,042,110 tokens/s on Llama 2 70B and 1,031,070 tokens/s on GPT‑OSS‑120B across 11‑12 nodes, with 92‑93% scaling efficiency. MLPerf 6.0 introduces...
Intel Officially Lists the Core Ultra X9 378H in ARK: Panther Lake Gets Another X9 SKU
Intel has officially added the Core Ultra X9 378H to its ARK database, confirming a new Panther Lake mobile SKU. The processor packs 16 cores—four performance, eight efficient, and four low‑power cores—alongside an 18 MB cache, up to 5.0 GHz turbo, and a 25 W base...
AMD Expands Ryzen AI Embedded P100: More Zen 5 Cores, Up to 80 TOPS, and ROCm for Edge AI
AMD announced an expanded Ryzen AI Embedded P100 line featuring eight to twelve Zen 5 cores, RDNA 3.5 graphics, an XDNA 2 NPU and up to 80 system TOPS. The new chips claim up to 39% higher multithreaded performance and up to 2.1‑times the TOPS...
Cisco Warns of Critical IMC Vulnerabilities – Ironically, the Server Manager Itself Has Become a Point of Entry
Cisco issued critical advisories on April 1, 2026 for its Integrated Management Controller (IMC), revealing an authentication‑bypass flaw (CVE‑2026‑20093) that grants unauthenticated admin access and a suite of command‑injection/RCE bugs (CVE‑2026‑20094‑20097) that let even read‑only users execute code as root. Cisco provides...
Intel Serpent Lake with an NVIDIA RTX Tile and “Copper Shark”? A Leak Meets an Already Confirmed Intel-NVIDIA Alliance
A recent leak suggests Intel’s upcoming "Serpent Lake" SoC could embed an NVIDIA RTX GPU tile, while a new P‑core codename "Copper Shark" has surfaced. The rumor aligns with the Intel‑NVIDIA collaboration announced in September 2025 to develop x86 SoCs with...
NVIDIA Is Reportedly Shifting Its GeForce Lineup to the RTX 5060 and 8GB Models in 2026 – the Leak Comes...
NVIDIA is reportedly refocusing its 2026 GeForce roadmap on the RTX 5060, RTX 5060 Ti 8 GB, and RTX 5070, emphasizing smaller 8‑GB memory configurations. The shift aligns with a tight global DRAM market and rising AI‑driven memory demand that have pushed VRAM costs higher. Internal...
OpenAI Pulls the Plug on macOS Signatures Following a Supply Chain Incident
OpenAI disclosed a supply‑chain attack that compromised the Axios library used in its macOS app‑signing workflow on March 31, 2026. The breach gave attackers access to the certificate used to sign ChatGPT Desktop, Codex, Codex‑cli and Atlas, prompting OpenAI to revoke and...
Intel Brings Fab 34 Back: The Repurchase of the Apollo Stake Marks a Change of Course in Ireland
Intel announced on April 1, 2026 that it will repurchase Apollo’s 49 percent stake in its Fab 34 joint venture in Leixlip, Ireland, for an estimated $14.2 billion. The transaction will be funded with existing cash and roughly $6.5 billion of new debt. Fab 34, a high‑volume...
MacBook Pro on the Verge of a Major Shift: Rumors About the M6, OLED, and Touch Features Are Gaining Momentum
Multiple outlets citing Bloomberg report that Apple is planning a major redesign of its 14‑ and 16‑inch MacBook Pro. The rumored refresh would feature OLED panels, a hole‑punch or Dynamic Island‑style front camera, and touch input, all powered by the upcoming...
Japan’s Semiconductor Push Is Getting More Expensive: Rapidus Receives an Additional 631.5 Billion Yen for Its 2-Nm Roadmap
Japan announced an additional ¥631.5 bn ($3.96 bn) for Rapidus to accelerate its 2‑nm logic chip roadmap. The infusion lifts total government R&D backing to ¥2.354 tn (about $14.8 bn) as the company readies a pilot line in Chitose and verifies 2‑nm GAA transistors...
Motherboard Updates Suddenly Become Mandatory: Secure Boot Certificates Are Forcing Manufacturers and Users to Take Action Before June 2026
Microsoft will retire the 2011 Secure Boot certificates in June 2026 (with additional expirations in October), replacing them with 2023 versions. OEMs such as ASUS and MSI have already warned that BIOS updates must include the new KEK and DB...
Samsung and AMD Strengthen Memory Partnership: HBM4 for MI455X and DDR5 for EPYC Venice Are Officially Confirmed
Samsung and AMD have formalized a three‑pronged memory partnership that includes Samsung's next‑gen HBM4 for the upcoming Instinct MI455X accelerator, DDR5 for AMD's sixth‑generation EPYC "Venice" CPUs, and exploratory foundry services for future AMD silicon. Samsung’s HBM4 will use a 1‑c...
MediaTek Dimensity 9600 Pro Leaked: New CPU Cluster, LPDDR6, and UFS 5.0 Point to a Noticeably More Aggressive Flagship SoC
MediaTek’s rumored Dimensity 9600 Pro chipset features a 2‑3‑3 octa‑core layout with two high‑performance “Canyon” cores and a clock speed approaching 5 GHz. The leak also claims support for next‑generation LPDDR6 memory and UFS 5.0 storage, marking a generational jump from the Dimensity 9500’s LPDDR5X...
Intel Arc Pro B70 in Its First Teardown: Early Disassembly Reveals How Intel Has Packaged Big Battlemage for Workstation Use
Intel’s Arc Pro B70 has been dissected in its first public teardown, revealing a purpose‑built workstation design rather than a repurposed gaming card. The reference model uses a blower‑style cooler with a large vapor‑chamber heatsink, directing airflow out the rear for optimal...
