Europe Launches New Chip/Packaging R&D Projects

Key Takeaways

• Moore4Power secures €91M (~$106M) for advanced power‑chip packaging.
• Project unites 62 partners across 15 EU nations under Infineon leadership.
• RESOLVE targets 1,000× energy‑efficiency boost for electronics by 2032.
• EU funds €288M (~$335M) for Zeiss EUV lithography and SiC plant.
• New initiatives span quantum, 2D semiconductors, and optical interconnects.

Pulse Analysis

Europe’s semiconductor push is gaining momentum with two high‑profile R&D consortia. Moore4Power, a €91 million (≈$106 million) effort led by Infineon, focuses on heterogeneous integration—stacking silicon, SiC, GaN and ancillary functions into a single package. By leveraging the strengths of each material, the project promises higher efficiency, greater reliability and smaller footprints for power electronics, a critical component in electric vehicles, renewable‑energy converters and industrial drives. The consortium’s breadth—62 partners across 15 nations—ensures a pan‑European supply chain that can rival Asian incumbents.

Parallel to packaging advances, the RESOLVE program tackles the next frontier: ultra‑efficient electronic systems. Backed by CEA‑Leti, Fraunhofer and Imec, RESOLVE will develop 15 strategic technologies and aim for a 1,000‑fold improvement in energy efficiency by 2032. Its dual‑track approach—combining deep R&D with rapid industry transfer—means prototypes will move from lab benches to production lines faster, strengthening Europe’s semiconductor sovereignty and supporting AI‑driven workloads that demand low‑power, high‑performance chips.

Beyond these headline projects, the EU is pouring €288 million (≈$335 million) into Zeiss’s high‑NA EUV lithography and a new ultra‑pure SiC fab, while the UK’s EXPRESS program explores 2D TMDC materials for neuromorphic and quantum applications. Together, these initiatives create a dense ecosystem of advanced packaging, novel materials, and quantum research, positioning Europe as a diversified hub for next‑generation semiconductor innovation. Companies that tap into this funding landscape can accelerate product cycles, reduce import dependence, and capture emerging market segments ranging from electric mobility to edge AI.