The Latest News In Metrology

Key Takeaways

• Park Systems enters AFM probe manufacturing via RMN acquisition
• NX1 AFM provides atomic resolution without vacuum environments
• QuantumDiamonds' QDm.1 offers non‑destructive 3D failure analysis
• Eurofins adds EIS for battery and supercapacitor diagnostics
• Monochromated EELS enhances atomic‑scale material characterization

Pulse Analysis

The semiconductor metrology landscape is shifting toward tighter supply‑chain control as equipment makers seek to internalize critical components. Park Systems’ purchase of Rocky Mountain Nanotechnology gives it direct access to ultra‑sharp platinum probes, reducing dependence on third‑party suppliers and potentially lowering costs for high‑performance AFM tools. By establishing a new probe fab in South Korea and maintaining the Utah plant during transition, Park ensures continuity for existing customers while positioning itself to innovate probe designs that meet the growing demand for nanoscale electrical measurements.

At the same time, quantum‑sensing technologies are breaking new ground in failure analysis. QuantumDiamonds’ QDm.1 leverages diamond‑based magnetometry to map current flow in three dimensions, a capability essential for diagnosing defects in 2.5D/3D stacked dies, backside power networks, and wide‑bandgap materials such as GaN and SiC. The non‑destructive nature of the system shortens debug cycles for advanced packaging, a critical advantage as chip manufacturers race to improve yield and time‑to‑market for increasingly complex architectures.

Beyond imaging, metrology services are expanding into electrochemical and spectroscopic domains to support emerging energy‑storage technologies. Eurofins EAG’s addition of electrochemical impedance spectroscopy provides detailed insight into battery degradation mechanisms, while its new monochromated electron energy‑loss spectroscopy pushes TEM resolution to the atomic level. These capabilities enable semiconductor and materials researchers to characterize both electrical performance and structural properties in a single workflow, reinforcing the role of comprehensive metrology as a strategic differentiator in the fast‑evolving chip ecosystem.