EPC Adds Compact 3-Phase BLDC Motor Drive Inverter

Why It Matters

The inverter’s GaN‑based miniaturization raises power density and efficiency for robotics and drone manufacturers, shortening development cycles and cutting system weight.

Key Takeaways

• EPC91132 measures 23 mm, fits tiny drone motors
• Uses EPC33110 GaN module with 11.7 mΩ on‑resistance
• Operates from 5 V to 80 V single‑supply
• Flexible breakout‑ring supports multiple form‑factor configurations
• Boosts efficiency and power density for humanoid robots

Pulse Analysis

Gallium‑nitride (GaN) technology is reshaping power electronics by delivering faster switching, lower losses and higher thermal tolerance than traditional silicon. EPC’s new reference design leverages its in‑house EPC33110 GaN monolithic IC, which consolidates three half‑bridges, drivers and level shifters into a tiny QFN package. This integration slashes board space and component count, allowing the EPC91132 to achieve a 23 mm diameter without sacrificing performance. For OEMs, the result is a plug‑and‑play inverter that can be rapidly adapted to diverse motor sizes while maintaining tight efficiency targets.

The robotics and unmanned‑air‑vehicle sectors are racing toward ever‑smaller, lighter actuation solutions. Humanoid hands require precise, high‑torque drives that fit within a palm‑sized envelope, while micro‑drones need propulsion units that add minimal weight yet deliver reliable power. By offering a single‑supply 5 V‑80 V range and a breakout‑ring that can be removed for a bare‑minimum footprint, EPC’s inverter aligns with these design pressures. Its low on‑resistance (11.7 mΩ) translates to reduced heat generation, extending motor life and enabling higher duty cycles—critical factors for continuous‑operation robots and long‑duration flight missions.

Competitively, the EPC91132 positions the company alongside other GaN innovators such as Infineon and Texas Instruments, but its distinctive modular breakout architecture provides a flexibility edge. System integrators can prototype quickly, swapping form‑factor rings to match specific motor housings without redesigning the PCB. As the market for compact, high‑performance motion control expands, manufacturers that adopt GaN‑based drives like EPC’s are likely to see faster time‑to‑market, lower BOM costs and improved system efficiency, reinforcing the strategic value of monolithic GaN integration.