GlobalFoundries Accelerates Adoption of Co-Packaged Optics for Advanced AI Data Centers with SCALE Optical Module Solution

Why It Matters

SCALE gives AI data‑center builders a standards‑based, high‑density optical link, shortening time‑to‑volume and reducing power costs. Its OCI MSA compliance could set a new industry baseline for next‑generation compute fabrics.

Key Takeaways

• SCALE is first OCI MSA‑compatible co‑packaged optics platform.
• Supports 8λ and 16λ bi‑directional DWDM on silicon photonics.
• Offers 50 Gbps and 100 Gbps micro‑ring modulators with TSV power delivery.
• Enables 2.5D/3D stacking via copper pads down to sub‑45 µm.
• Boosts bandwidth density and energy efficiency for AI data center interconnects.

Pulse Analysis

The surge in generative‑AI workloads is straining traditional copper interconnects, prompting a shift toward optical solutions that can deliver terabits per second with lower latency. Co‑packaged optics (CPO) integrates photonic and electronic components within a single package, eliminating the electrical‑to‑optical conversion bottleneck. GlobalFoundries’ SCALE leverages its mature silicon‑photonic platform to meet the OCI Multi‑Source Agreement, offering a ready‑to‑deploy standard that eases integration for OEMs and cloud providers.

SCALE’s technical edge lies in its dense wavelength‑division multiplexing (DWDM) capabilities—demonstrated at 8λ and 16λ per fiber—and its suite of high‑speed photonic devices, including 50 Gbps and 100 Gbps micro‑ring modulators. Through‑silicon vias (TSVs) provide robust power delivery, while copper pad pitches as fine as sub‑45 µm enable 2.5D/3D stacking on silicon interposers. These features translate to markedly higher bandwidth density per rack unit and a reduction in energy per bit, addressing the power‑budget constraints of hyperscale data centers.

By delivering the first OCI‑MSA‑compliant CPO module, GlobalFoundries not only differentiates itself from rivals still focused on discrete optics but also sets a de‑facto benchmark for the industry. Early adopters can accelerate time‑to‑market for AI accelerators, while the detachable‑fiber architecture preserves serviceability and testability. As AI models continue to scale, the demand for such high‑performance, energy‑efficient interconnects will grow, positioning GF to capture a significant share of the emerging optical‑interconnect market.