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HomeIndustryTelecomBlogsTejas Networks Unveils Hyper-Scalable DCI Platform at MWC Barcelona
Tejas Networks Unveils Hyper-Scalable DCI Platform at MWC Barcelona
TelecomHardware

Tejas Networks Unveils Hyper-Scalable DCI Platform at MWC Barcelona

•March 4, 2026
TelecomDrive
TelecomDrive•Mar 4, 2026
0

Key Takeaways

  • •TJ1600‑D3 supports 400 Gbps‑1.2 Tbps per wavelength
  • •Shelf capacity reaches 51.2 Tbps
  • •3‑RU form factor with redundant power modules
  • •Energy‑efficient design for AI‑heavy traffic
  • •Positions India as global telecom equipment supplier

Summary

Tejas Networks introduced the TJ1600‑D3, a hyper‑scalable data‑center interconnect (DCI) platform, at MWC 2026 in Barcelona. The WDM optical transport system delivers line rates from 400 Gbps to 1.2 Tbps per wavelength and can scale to 51.2 Tbps of shelf capacity within a compact 3‑RU chassis. Powered by advanced DSPs and redundant power modules, it targets carriers and enterprises needing energy‑efficient, carrier‑grade connectivity for AI‑driven workloads. The launch was highlighted by Union Minister Jyotiraditya Scindia, underscoring India’s growing role in telecom innovation.

Pulse Analysis

The surge in AI compute and edge‑focused services has reshaped network traffic, pushing operators to seek terabit‑class data‑center interconnect solutions. Traditional 100 Gbps links are no longer sufficient for the massive data flows generated by large‑scale cloud platforms and hyperscale web‑scalers. In this context, Tejas Networks’ TJ1600‑D3 arrives as a timely answer, offering a flexible, high‑capacity optical transport platform that can adapt to both performance‑driven and power‑constrained deployments.

Technically, the TJ1600‑D3 distinguishes itself with line rates ranging from 400 Gbps up to 1.2 Tbps per wavelength and an aggregate shelf capacity of 51.2 Tbps, all housed in a 3‑RU chassis. The use of next‑generation digital signal processors and modular DSP chipsets enables fine‑grained traffic sleds that balance throughput and energy consumption. Redundant controllers, fans, and universal AC/DC power inputs enhance resilience, positioning the product as carrier‑grade while maintaining a low power‑per‑bit footprint—key differentiators against incumbents such as Ciena and Infinera.

Strategically, the launch signals a maturation of India’s telecom hardware ecosystem, moving beyond legacy equipment to compete in the high‑value DCI segment. By delivering a home‑grown, export‑ready solution, Tejas Networks can capture market share in over 75 countries where cost‑effective, scalable optical gear is in demand. The product also aligns with national initiatives to boost indigenous technology, potentially attracting further government support and fostering a robust supply chain for future generations of AI‑centric networking equipment.

Tejas Networks Unveils Hyper-Scalable DCI platform at MWC Barcelona

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