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Taiwan’s flat‑panel manufacturers are pivoting from traditional LCD production to advanced packaging, satellite antennas, and micro‑LED co‑packaged optics (CPO) to meet exploding AI‑driven data‑center bandwidth demands. Bandwidth requirements have surged from 400 Gb/s to as high as 3.2 Tb/s, prompting a shift toward optical interconnects that dramatically cut power consumption. Innolux is deploying Fan‑Out Panel‑Level Packaging (FOPLP) on 620 × 750 mm glass, while AUO leverages its micro‑LED expertise for high‑speed optical links and flat‑panel satellite solutions. This diversification aims to revive margins and capture growth in the space, automotive and data‑center ecosystems.
AI‑driven data‑center expansion is turning optical interconnects into a strategic bottleneck as bandwidth requirements climb to 800 Gbps and beyond. The constraint centers on indium phosphide (InP) substrates, which are essential for high‑speed electro‑absorption modulated lasers and other photonic components. A...
The post examines the escalating demand for short‑reach interconnects as AI models grow larger and data centers shift to massive GPU clusters. It compares copper‑based options—DAC, ACC, and AEC—with optical solutions like AOC and emerging Co‑Packaged Optics (CPO). Active Electrical...
