CEO Interview with Moti Margalit of SonicEdge

Key Takeaways

• 6.5 × 4 × 1 mm solid‑state speaker replaces voice‑coil drivers
• Modulated 400 kHz ultrasound creates full‑range 2 Hz‑40 kHz audio
• 28+ patents; CES 2026 partnership with global semiconductor manufacturer
• Targeted for AI glasses, earbuds, hearing aids, smartwatches
• Enables chip‑scale acoustic arrays for directional, private listening

Summary

SonicEdge, led by CEO Moti Margalit, is commercializing a solid‑state speaker that uses modulated 400 kHz ultrasound to generate full‑range audio from a 6.5 × 4 × 1 mm MEMS die. The company holds more than 28 patents and announced a development contract with a leading AI‑glasses maker and a chip‑integration partnership with a global semiconductor manufacturer at CES 2026. Its technology replaces traditional voice‑coil drivers, delivering higher efficiency and dramatically smaller form factors for wearables, hearables and smartphones. SonicEdge is also expanding into acoustic arrays and combined speaker‑microphone modules for next‑generation AI devices.

Pulse Analysis

The ultrasonic‑modulation approach pioneered by SonicEdge flips conventional acoustics on its head. Instead of moving a diaphragm at audible frequencies, a MEMS membrane vibrates at 400 kHz, creating an ultrasonic carrier that is amplitude‑modulated into sound across a 2 Hz‑40 kHz spectrum. This physics‑first design eliminates voice‑coils, magnets and bulky diaphragms, delivering far more acoustic output per milliwatt and per cubic millimeter than legacy drivers. The result is a chip‑scale speaker that can be fabricated alongside standard semiconductors, unlocking form‑factor freedom that has long constrained wearables and hearables.

Market pressure for ever‑thinner, smarter devices makes this breakthrough timely. AI‑enabled glasses, true‑wireless earbuds, hearing aids and smartwatches all struggle with the mechanical speaker’s size, power draw and acoustic limits. SonicEdge’s signed development deal with a leading AI‑glasses OEM and its CES 2026 integration partnership with a major semiconductor foundry mean the technology can be embedded directly into audio chipsets, streamlining supply chains and reducing bill‑of‑materials costs. OEMs gain a differentiating audio platform that supports always‑on voice assistants, low‑latency translation and immersive media without sacrificing design aesthetics.

Looking ahead, SonicEdge’s roadmap extends beyond single‑die speakers. The SonicTwin module pairs a speaker with a microphone on the same silicon, enabling tighter acoustic feedback loops for active noise cancellation and health monitoring. Array‑based configurations promise beam‑forming capabilities that deliver private, directional sound—an emerging premium feature for shared spaces. Moreover, the underlying ultrasonic pump can be repurposed for chip cooling, gas sensing and micro‑fluidics, opening adjacent revenue streams. As semiconductor manufacturers adopt this architecture, the competitive landscape could shift from incremental MEMS improvements to a wholesale replacement of the speaker component, positioning SonicEdge as a foundational player in the next wave of immersive, ultra‑compact consumer electronics.