Jetway F35-ARU1 Combines Core Ultra SoC in 3.5-inch Form Factor

Key Takeaways

• Core Ultra 5/7 CPUs with 15 W TDP
• Integrated NPU enables on‑board AI acceleration
• Dual DDR5‑6400 slots support up to 128 GB RAM
• Two 2.5 GbE ports offer TSN and redundancy
• 12–36 V input suits industrial power environments

Summary

Jetway unveiled the F35‑ARU1, a 3.5‑inch sub‑compact motherboard built around Intel Core Ultra 5 225U and Core Ultra 7 255U processors. Both CPUs run at a 15 W TDP and include integrated graphics, an AI‑focused NPU, and support for DDR5‑6400 memory up to 128 GB. The board offers dual 2.5 GbE Ethernet with TSN, multiple PCIe 4.0 M.2 slots, and a wide 12‑36 V industrial power range. Availability and pricing remain undisclosed.

Pulse Analysis

The rise of edge computing has pushed manufacturers to pack more horsepower into ever‑smaller footprints. Jetway’s F35‑ARU1 exemplifies this shift by marrying Intel’s latest Core Ultra line—originally designed for thin laptops—with a rugged 3.5‑inch form factor. The inclusion of an on‑chip neural processing unit (NPU) means developers can run inference workloads locally, reducing latency and bandwidth costs that traditionally required cloud off‑load. Compared with legacy embedded boards that relied on separate AI accelerators, the integrated approach simplifies board design and firmware stacks.

Beyond AI, the F35‑ARU1’s technical specs address the demanding needs of industrial environments. Dual DDR5‑6400 SO‑DIMM slots deliver up to 128 GB of memory, while PCIe 4.0 ×4 M.2 storage ensures fast NVMe performance for data‑intensive tasks. Two 2.5 GbE ports, powered by Intel I226 controllers, provide deterministic networking with Time‑Sensitive Networking (TSN) support—critical for real‑time control systems. The board’s 12‑36 V DC input and operating temperature range of –20 °C to 60 °C make it suitable for factory floors, transportation, and outdoor installations.

For the market, Jetway’s entry signals intensified competition in the edge‑AI segment, where players like Advantech and AAEON have long dominated. By leveraging Intel’s mainstream silicon, Jetway can potentially offer a cost‑effective alternative without sacrificing performance, encouraging broader adoption of AI at the edge. As OEMs evaluate the F35‑ARU1 for robotics, smart manufacturing, and remote monitoring, the board’s flexibility—spanning Windows and Linux, multiple display outputs, and optional TPM—positions it as a versatile foundation for next‑generation industrial solutions.