Nordic Semi Unveils nRF54LS05A and nRF54LS05B Entry-Level, Ultra-Low-Power Bluetooth LE SoCs

Key Takeaways

• 128 MHz Cortex‑M33 core, ultra‑low power
• 64 KB or 96 KB RAM, 0.5 MB NVM
• Sleep current down to 0.6 µA
• No Bluetooth Mesh, but robust security features

Summary

Nordic Semiconductor introduced the nRF54LS05A and nRF54LS05B, entry‑level Bluetooth LE SoCs built on a 128 MHz Arm Cortex‑M33 core. Both chips feature the fourth‑generation Bluetooth LE radio, 0.5 MB of non‑volatile memory, and 64 KB or 96 KB of RAM respectively. Power consumption is ultra‑low, with sleep currents as low as 0.6 µA and radio currents under 5 mA. The devices are available through an early‑access program with production slated for Q3 2026, supported by the nRF54LS05‑DK development kit.

Pulse Analysis

Nordic’s entry‑level nRF54LS05 series arrives at a time when the IoT market is demanding ever‑smaller, battery‑friendly devices. By leveraging a Cortex‑M33 core and the company’s fourth‑generation Bluetooth LE radio, the chips deliver sufficient processing headroom for simple sensor nodes while keeping power draw to a few microamps in sleep. This balance addresses the growing need for long‑life beacons, tags, and remote controls, especially in wearables and smart‑home peripherals where cost and form factor are critical.

From a technical standpoint, the nRF54LS05A/B differentiate themselves with a modest 64 KB or 96 KB RAM footprint, 508 KB of flash, and a rich peripheral set that includes up to 37 GPIOs, multiple serial interfaces with EasyDMA, and a high‑resolution SAADC. Security is baked in via a 128‑bit AES coprocessor, secure boot, and tamper detection, meeting stringent compliance requirements without additional components. Power metrics are impressive: radio Rx draws 3.4 mA, Tx 4.8 mA at 0 dBm, while deep‑sleep modes consume between 0.6 µA and 1.2 µA, enabling multi‑year battery life for low‑duty‑cycle applications.

For developers, Nordic smooths the transition from the popular nRF52 line by offering pin‑to‑pin compatibility and support through the nRF Connect SDK, including a Bare‑Metal option. The accompanying nRF54LS05‑DK board, featuring an nRF5340 debugger and full I/O breakout, allows rapid prototyping and validation. Early‑access availability now lets design teams evaluate the silicon ahead of the Q3 2026 production ramp, positioning the nRF54LS05 series as a compelling choice for cost‑sensitive, ultra‑low‑power Bluetooth LE deployments.