U-Blox JODY-W6 – NXP IW623/AW693 Tri-Band Wi-Fi 6E and Bluetooth 5.4 LE Audio Modules

Key Takeaways

• Tri‑band Wi‑Fi 6E and Bluetooth 5.4 in one module
• Supports up to 1.34 Gbps combined Wi‑Fi throughput
• Automotive‑grade variants operate up to +105 °C
• Dual‑MAC enables simultaneous Wi‑Fi and Bluetooth
• Evaluation kits provide PCIe, UART, and SMA antennas

Summary

u‑blox has launched the JODY‑W6 series, integrating NXP IW623/AW693 tri‑band Wi‑Fi 6E and Bluetooth 5.4 (including LE Audio) into a single LGA module. Seven variants span professional and automotive grades, offering up to 1.34 Gbps combined Wi‑Fi throughput and 2 Mbps Bluetooth data rates. The modules feature dual‑MAC, 2×2 MIMO, and support multiple antenna configurations for concurrent operation. Engineering samples arrive Q2 2026 with volume production slated for the end of that quarter.

Pulse Analysis

The introduction of u‑blox's JODY‑W6 marks a significant step toward consolidating wireless connectivity in edge devices. By pairing NXP's IW623 professional‑grade SoC with the automotive‑qualified AW692/AW693, the module delivers tri‑band Wi‑Fi 6E across 2.4, 5, and 6 GHz alongside Bluetooth 5.4 LE Audio. This convergence reduces bill‑of‑materials and board‑space, while the 2×2 MIMO and dual‑MAC architecture ensure robust performance in dense RF environments typical of factories and vehicles.

From a market perspective, the JODY‑W6 addresses the growing demand for high‑speed, secure links in Industry 4.0 and connected car platforms. The ability to sustain 1.2 Gbps per band and support up to 64 concurrent Wi‑Fi connections positions the module for real‑time data aggregation, video analytics, and over‑the‑air updates. Moreover, the inclusion of WPA3, AES‑GCMP, and NXP EdgeLock secure boot aligns with tightening cybersecurity regulations across industrial and automotive sectors.

Developers benefit from the accompanying EVK‑JODY‑W6 evaluation kit, which exposes PCIe, SDIO, UART, and audio interfaces, simplifying integration with Linux or Android host processors. The kit’s flexible antenna options and power‑rail choices accelerate prototyping, while the forthcoming M.2 form‑factor variant promises seamless adoption in existing carrier boards. As volume production commences in late Q2 2026, the JODY‑W6 is poised to become a reference solution for next‑generation IoT and infotainment designs.